• Transactions on Electrical and Electronic Materials
• /
• v.4 no.3
• /
• pp.5-9
• /
• 2003

In this paper, a layout-based CMOS RF model for RFIC's including the capacitance effect, the skin effect, and the proximity effect between metal lines on the Si surface is proposed for the first time for accurately predicting the RF behavior of CMOS devices. With these RF effects, the RF equivalent circuit model based on the layout of the multi-finger gate transistor is presented. The capacitances between metal lines on the Si surface are modeled with the layout. And the skin effect is modeled to the equivalent ladder circuit of metal line. The proximity effect is modeled by adding the mutual inductance between cross-coupled inductances in the ladder circuit representation. Compared to the BSIM 3v3 and other models, the proposed RF model shows better agreements with the measured data and shows well the frequency dependent behavior of devices in GHz ranges.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.28 no.8
• /
• pp.610-618
• /
• 2017

This paper presents a 868/915 MHz CMOS RF transceiver for the ZigBee application. Using a switchless matching network, the off chip switch is removed to achieve the low cost RF transceiver, and by the elimination of the switch's insertion loss we can achieve the benefits for the RF receiver's noise figure and transmitter's power efficiency at the given output power. The receiver is composed of low-noise amplifier, mixer, and baseband analog(BBA) circuit. The transmitter is composed of BBA, mixer, and driver amplifier. And, the integer N type frequency synthesizer is designed. The proposed ZigBee RF full transceiver is implemented on the $0.18{\mu}m$ CMOS technology. Measurement results show that the maximum gain and the noise figure of the receiver are 97.6 dB and 6.8 dB, respectively. The receiver consumes 32 mA in the receiver mode and the transmitter 33 mA in the transmission mode.

• ETRI Journal
• /
• v.33 no.6
• /
• pp.969-972
• /
• 2011

This letter presents a CMOS RF front-end operating in a subthreshold region for low-power Band-III mobile TV applications. The performance and feasibility of the RF front-end are verified by integrating with a low-IF RF tuner fabricated in a 0.13-${\mu}m$ CMOS technology. The RF front-end achieves the measured noise figure of 4.4 dB and a wide gain control range of 68.7 dB with a maximum gain of 54.7 dB. The power consumption of the RF front-end is 13.8 mW from a 1.2 V supply.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
• /
• v.12 no.3
• /
• pp.49-59
• /
• 2001

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the growing needs for lowcost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology so far, much of them have been developed in ETRI, and from them forecasts technology trends in the near future.

• Proceedings of the IEEK Conference
• /
• 2000.06e
• /
• pp.61-64
• /
• 2000

This paper describes a RF Down-Conversion Mixer for mobile communication systems. This circuit achieves low voltage operation and low power consumption by reducing stacked devices of conventional gilbert cell mixer. In order to reduce stacked devices, we use source-follower structure. The proposed RF Down-Conversion mixer operates up to 1.85GHz at 1.5V power supply with 0.25um CMOS technology and consumes 2.2mA.

• The Magazine of the IEIE
• /
• v.29 no.9
• /
• pp.1020-1020
• /
• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology trends in the near future.

• The Magazine of the IEIE
• /
• v.29 no.9
• /
• pp.18-30
• /
• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology and from them forecasts technology trends in the near future.

• Proceedings of the IEEK Conference
• /
• 1998.10a
• /
• pp.1121-1124
• /
• 1998

A CMOS RF bandpass amplifier which performs both functions of low-noise amplifier and bandpass filter is designed for the application of 1.9 ㎓ RF front-end in wireless receivers. The positive-feedback Q-enhancement technique is used to overcome the low gain and low Q factor of the bandpass amplifier. The designed bandpass amplifier is simulated with HSPICE and fabricated using HYUNDAI $0.8\mu\textrm{m}$ CMOS 2-poly 2-metal full custom process. Under 3 V supply voltage, results of simulation show that the CMOS bandpass amplifier provides the power gain 23dB, noise figure 3.8 dB, and power dissipation 55mW.

• Proceedings of the Korean Operations and Management Science Society Conference
• /
• 2005.05a
• /
• pp.914-921
• /
• 2005

신제품으로 개발 중인 초소형 CMOS RF 전압 제어발진기(VCO) IC 에 대한 공인된 시험 규격은 현재 개발되어 있지 않다. 또한 제조업체들은 고유의 시험방법을 보유하고 있을 것이나 공개하지 않고 있는 실정이다. 한편 일부 해외 제조업체에서 국제 규격인 IEC 또는 JEDEC 을 기준으로 시험방법을 제시하고 있지만, 이러한 시험규격들은 개별 부품을 솔더링하는 하이브리드 공정을 이용하여 제작된 VCO 를 대상으로 한 것이다. 그러므로 CMOS 반도체 공정을 이용한 IC 형으로 개발 중인 VCO 를 평가하기에는 적합하지 않다. 이에 본 연구에서는 신개발 부품인 CMOS RF VCO IC 에 대한 신뢰성 시험 및 평가 기준을 수립하고, 신뢰성 확보를 위한 신제품 개발 단계에서의 신뢰성 평가 프로세스를 개발하고자 한다.

• Journal of the Korean Institute of Telematics and Electronics C
• /
• v.34C no.7
• /
• pp.18-27
• /
• 1997

A CMOS 950 MHz frequency synthesizer is designed and fabricated in a 0.8.mu.m standard CMOS process for IS-95-A CDMA mobile communication transceivers To utilize a CMOS ring VCO in a CDMA wireless communication receisver, we employed a QDC (quasi-direct conversion) receiver architecture for CDMA applications. Realized RF frequency synthesizer used as the RF local oscillator for a QDC receiver exhibits a phase noise of -92 dBc/Hz at 885kHz offset from the 950.4 MHz carrier, which complies with IS-95-A CDMA specification. It has a rms jitter of 23.7 ps, and draws 30mA from a 5V supply. Measured I/Q phase error of the 950.4 output signals is 0.7 degree.