• Journal of Sensor Science and Technology
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• v.16 no.5
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• pp.377-383
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• 2007

We describe the fabrication and characterization of a doubly clamped multi-walled carbon nanotube (MWNT). The device was assembled by an application of electric field in solution. The MWNT was clamped on end of metal trench electrodes in solution and deposited with additional platinum (Pt) on edge of electrode for firmly suspending the MWNT by focused ion beam (FIB). The MWNTs range of diameter and length were 100 to 150 nm and 1.5 to $2{\mu}m$, respectively. Electrical characteristics of fabricated devices were measured by I-V curve and impedance analysis. The mechanical deformation was observed by resistivity in high air pressure. Resonant frequency around 6.8 MHz was detected and resistivity was linearly varied according to the magnitude of air pressure. This device could have potential applications in nanoelectronics and various sensors.

• Journal of Sensor Science and Technology
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• v.5 no.3
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• pp.49-54
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• 1996

We propose a new method for measuring coliform group in water. In this method we measure the pressure increase rate with time due to the generation of $CO_{2}$ gas formed during the fermentation of coli. Experimental results by constructed instrument using pressure and temperature sensors show that we can determine the amounts of coli in $4{\sim}6$ hours, which usually takes $24{\sim}72$ hours by conventional methods.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2012.05a
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• pp.65-69
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• 2012

An oxygen rich preburner was tested and the responses from the pressure sensors were studied with FFT analysis. Since the limited capability of the static sensor, less than 250 Hz frequency domain was investigated and compared to the results of the dynamic sensors. As a result, 60 Hz harmonics were presented dominant in the combustion pressure and oxygen inlet pressure. While similar harmonics were shown with the dynamic sensor, it indicated that harmonics less than 60 Hz were very minor and the high frequency is more important.

• Journal of the Ergonomics Society of Korea
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• v.15 no.2
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• pp.165-176
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• 1996

Hand posture and force, which define aspects of the way an object is grasped, are features of robotic manipulation. A means for specifying these grasping "flavors" has been developed that uses an instrumented glove equipped with joint and force sensors. The new grasp specification system is being used at the Pennsylvania State University (Penn State) in a Virtual Reality based Point-and-Direct (VR-PAD) robotics implementation. In the Computer Integrated Manufacturing (CIM) Laboratory at Penn State, hand posture and force data were collected for manipulating bricks and other items that require varying amounts of force at multiple pressure points. The feasibility of measuring desired grasp characteristics was demonstrated for a modified Cyberglove impregnated with FSR (Force Sensitive Resistor) pressure sensors in the fingertips. A joint/force model relating the parameters of finger articulation and pressure to various lifting tasks was validated for the instrumented "wired" glove. Operators using such a modified glove may ultimately be able to configure robot grasping tasks in environments involving hazardous waste remediation, flexible manufactruing, space operations and other flexible robotics applications. In each case, the VR-PAD approach improved the computational and delay problems of real-time multiple- degree-of-freedom force feedback telemanipulation.

• Journal of Navigation and Port Research
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• v.29 no.10 s.106
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• pp.871-876
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• 2005

Application of semiconductor sensors has been widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors's lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis. The Fatigue lifetime in its bottom is smaller than others and bending load have not an effect on the fatigue lifetime of the interconnect but the stress distribution.

• Journal of Sensor Science and Technology
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• v.24 no.1
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• pp.10-14
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• 2015

This paper reports the results of a study on the optimization of the etching profile, which is an important factor in deep-reactive-ion etching (DRIE), i.e., dry etching. Dry etching is the key processing step necessary for the development of the Internet of Things (IoT) and various microelectromechanical sensors (MEMS). Large-area etching (open area > 20%) under a high-frequency (HF) condition with nonoptimized processing parameters results in damage to the etched sidewall. Therefore, in this study, optimization was performed under a low-frequency (LF) condition. The HF method, which is typically used for through-silicon via (TSV) technology, applies a high etch rate and cannot be easily adapted to processes sensitive to sidewall damage. The optimal etching profile was determined by controlling various parameters for the DRIE of a large Si wafer area (open area > 20%). The optimal processing condition was derived after establishing the correlations of etch rate, uniformity, and sidewall damage on a 6-in Si wafer to the parameters of coil power, run pressure, platen power for passivation etching, and $SF_6$ gas flow rate. The processing-parameter-dependent results of the experiments performed for optimization of the etching profile in terms of etch rate, uniformity, and sidewall damage in the case of large Si area etching can be summarized as follows. When LF is applied, the platen power, coil power, and $SF_6$ should be low, whereas the run pressure has little effect on the etching performance. Under the optimal LF condition of 380 Hz, the platen power, coil power, and $SF_6$ were set at 115W, 3500W, and 700 sccm, respectively. In addition, the aforementioned standard recipe was applied as follows: run pressure of 4 Pa, $C_4F_8$ content of 400 sccm, and a gas exchange interval of $SF_6/C_4F_8=2s/3s$.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.7
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• pp.597-604
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• 2013

Underwater acoustic sensors are significantly damaged from underwater explosion. The damage that affects sensor should be evaluated for its smooth operations and safety. For satisfying these objectives, it is necessary to obtain more accurate values of the pressure and the energy flux density by distance. This paper is divided into two part. First, to obtain more accurate value of the pressure and the energy flux density at each point, the simulation results and the reference values were compared. For fitting to the reference pressure and the reference energy flux density, the sizes of fluid and TNT model are corrected, and the comparison results show good agreements. Second, based on these results, the structural integrity of underwater sensor structure was analyzed when TNT located in 10 meters from underwater sensors structure. This simulation used the commercial software MSC/DYTRAN.

• Journal of Sensor Science and Technology
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• v.6 no.3
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• pp.180-187
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• 1997

We demonstrate the improvement of sensitivity and analysis of operating characteristics of the piezoelectric pressure sensor using ZnO piezoelectric thin film and FET(field effect transistor) for sensing applied pressure and transforming the pressure into electrical signals, respectively. The sensitivity of the PSFET(pressure sensitive field effect transistor) was improved by using highly-oriented ZnO film perpendicular to the substrate surface and the operating characteristics was investigated by monitoring output voltage with time in various static pressure levels.

• Journal of Sensor Science and Technology
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• v.16 no.2
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• pp.126-131
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• 2007

In this paper, we fabricated piezoresistive pressure sensor with dry etching technology which used ICP-RIE (inductively coupled plasma reactive ion etching) and etching delay technology which used SOI (silicon-on-insulator). Structure of the fabricated pressure sensor shows a square diaphragm connected to a frame which was vertically fabricated by dry etching process and a single-element four-terminal gauge arranged at diaphragm edge. Sensitivity of the fabricated sensor was about 3.5 mV/V kPa at 1 kPa full-scale. Measurable resolution of the sensor was not exceeding 20 Pa. The nonlinearity of the fabricated pressure sensor was less than 0.5 %F.S.O. at 1 kPa full-scale.

• Proceedings of the KSR Conference
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• 2000.11a
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• pp.521-526
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• 2000

Experimental study is conducted to clarify pressure variation of the passenger cabin of conventional train. These pressure variation may give rise to the ear-discomfort. Generally ear-discomfort has been considered as a problem related to high speed train. Because there is also a good progress to speed-up for conventional line, this isn't only a phenomena related to high speed train any longer. In this study, tile pressure variation of interior, gangway and exterior of saemaeul passenger car is measured using the atmospheric pressure sensors in Honam line. From the results of experiment, the pressure variation per second almost close in upon the limitation in the case of Noryong tunnel. Therefore, to accomplish speed-up for conventional train, it may be necessary to study a serial ventilating and the airtightness of carbody.