• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2007년도 하계종합학술대회 논문집
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• pp.81-82
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• 2007

This paper presents a WLAN band active monopole antenna which is made of a CPW-fed monopole antenna and a low noise amplifier implemented on single-layer low-temperature co-fired ceramic (LTCC) substrate. Planar active antenna measure return loss and power test. (drain voltage = 4V, gate voltage = -0.6V). The bandwidth, is 540MHz, return loss is -38dB.

• 한국전기전자재료학회논문지
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• 제28권9호
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• pp.551-554
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• 2015

This paper was analyzed electrical characteristics of super junction IGBT with super junction field rings. As a result of super junction IGBT with super junction field rings, we obtained 3,300 V breakdown voltage and good thermal characteristics. we obtained shrinked chip size because field ring was decreased than field ring for conventional IGBT, too. And we fabricated super junction IGBT with super junction field rings. As a result of measuring fabricated chip, we obtained 3,300 V breakdown voltage. The fabricated devices were replaced thyristos using high voltage conversion, sufficiently.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 추계학술대회 논문집 학회본부
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• pp.178-180
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• 1994

In recent days, the inverter is widely used at the industrial applications. In the range lower than 100[kW], IGBT(Insulated Gate Bipolar Transistor) is most widely used as the switching device. In that case of IGBT, the rising time and the filling time are very short(about $200[ns]{\sim}300[ns]$). Especially for motor control applications, the switching frequency is required to be increased for better dynamic performance of the drive. However, the higher switching frequency leads to the unexpected problem occurs such as voltage spike due to stray inductance in the bus at switching instant. In this paper, a new methodology for reducing the stray inductance existing in the bus that induces the voltage spike will be presented.

• 한국전기전자재료학회논문지
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• 제23권9호
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• pp.676-680
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• 2010

In this paper, Fin-type silicon-oxide-nitride-oxide-silicon (SONOS) flash memory are fabricated and the electrical characteristics are analyzed. Compared to the planar-type SONOS devices, Fin-type SONOS devices show good short channel effect (SCE) immunity due to the enhanced gate controllability. In memory characteristics such as program/erase speed, endurance and data retention, Fin-type SONOS flash memory are also superior to those of conventional planar-type. In addition, Fin-type SONOS device shows improved SCE immunity in accordance with the decrease of Fin width. This is known to be due to the fully depleted mode operation as the Fin width decreases. In Fin-type, however, the memory characteristic improvement is not shown in narrower Fin width. This is thought to be caused by the Fin structure where the electric field of Fin top can interference with the Fin side electric field and be lowered.

• 한국정보통신학회논문지
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• 제21권4호
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• pp.767-773
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• 2017

본 논문에서는 HEVC 부호기를 위한 효율적인 Intra Prediction Angular 모드 결정 하드웨어 설계를 제안한다. HEVC의 Intra Prediction은 현재 블록 주변의 재구성된 샘플들을 참조하여 현재 블록을 예측하는 방법이다. Intra Prediction에서는 1개의 DC 모드, 1개의 Planar 모드, 33개의 Angular 모드로 총 35개의 모드를 지원한다. HEVC의 Intra Prediction은 35개의 모드 중에서 최적의 모드를 결정한 후 예측하여 부호화 성능을 향상 시킨다. 그러나 35가지의 모드를 모두 처리하기 위해서는 많은 연산 복잡도와 처리시간이 요구된다. 그러므로 본 논문에서는 원본 영상 픽셀의 차이 값을 비교하여 Angular 모드를 효율적으로 결정하는 알고리즘을 적용한 하드웨어 설계를 제안하였다. 또한 효율적인 알고리즘의 사용을 통해 하드웨어 면적을 감소시켰다. 제안된 하드웨어 구조는 Verilog HDL로 설계하였으며, 65nm 공정으로 합성하였다. 합성 결과 14.9K개의 게이트로 구현되었고, 최대 동작 주파수는 2GHz이다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제6권1호
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• pp.22-29
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• 2006

We demonstrate highly manufacturable Multi-channel Field Effect Transistor (McFET) on bulk Si wafer. McFET shows excellent transistor characteristics, such as $5{\sim}6 times higher drive current than planar MOSFET, ideal subthreshold swing, low drain induced barrier lowering (DIBL) without pocket implantation and negligible body bias dependency, maintaining the same source/drain resistance as that of a planar transistor due to the unique feature of McFET. And suitable threshold voltage ($V_T$) for SRAM operation and high static noise margin (SNM) are achieved by using TiN metal gate electrode.

• 전기전자학회논문지
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• 제22권4호
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• pp.1234-1237
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• 2018

본 논문에서는 planar MOSFET 대비 on 저항 감소 및 스위칭 속도 개선의 장점이 있는 4H-SiC trench MOSFET응용을 위하여 trench MOSFET 중요 이슈 중 하나인 sub-trench의 개선연구를 수행하였다. sub-trench의 제거를 위하여 Ar reshape 공정을 수행하였고, 온도와 공정시간을 변화해가며 trench 형태의 변화를 관찰하였다. 그 결과 $1500^{\circ}C$, 20분 조건에서 가장 적절한 sub-trench 완화를 확인하였다. 또한 Ar reshape 공정 이후 건식/습식 산화공정을 진행하여 결정방향에 따른 산화막 두께변화에 대해 확인하였다.

• 한국전기전자재료학회논문지
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• 제26권4호
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• pp.271-274
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• 2013

Power Metal Oxide Semiconductor Field Effect Transistor's (MOSFETs) are well known for superior switching speed, and they require very little gate drive power because of the insulated gate. In these respects, power MOSFETs approach the characteristics of an "ideal switch". The main drawback is on-resistance RDS(on) and its strong positive temperature coefficient. While this process has been driven by market place competition with operating parameters determined by products, manufacturing technology innovations that have not necessarily followed such a consistent path have enabled it. This treatise briefly examines metal oxide semiconductor (MOS) device characteristics and elucidates important future issues which semiconductor technologists face as they attempt to continue the rate of progress to the identified terminus of the technology shrink path in about 2020. We could find at the electrical property as variation p base dose. Ultimately, its ON state voltage drop was enhanced also shrink chip size. To obtain an optimized parameter and design, we have simulated over 500 V Field ring using 8 Field rings. Field ring width was $3{\mu}m$ and P base dose was $1e15cm^2$. Also the numerical multiple $2.52cm^2$ was obtained which indicates the doping limit of the original device. We have simulated diffusion condition was split from $1,150^{\circ}C$ to $1,200^{\circ}C$. And then $1,150^{\circ}C$ diffusion time was best condition for break down voltage.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권1호
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• pp.8-22
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• 2014

In the past few decades, CMOS logic technologies and devices have been successfully developed with the steady miniaturization of the feature size. At the sub-30-nm CMOS technology nodes, one of the main hurdles for continuously and successfully scaling down CMOS devices is the parametric failure caused by random variations such as line edge roughness (LER), random dopant fluctuation (RDF), and work-function variation (WFV). The characteristics of each random variation source and its effect on advanced device structures such as multigate and ultra-thin-body devices (vs. conventional planar bulk MOSFET) are discussed in detail. Further, suggested are suppression methods for the LER-, RDF-, and WFV-induced threshold voltage (VTH) variations in advanced CMOS logic technologies including the double-patterning and double-etching (2P2E) technique and in advanced device structures including the fully depleted silicon-on-insulator (FD-SOI) MOSFET and FinFET/tri-gate MOSFET at the sub-30-nm nodes. The segmented-channel MOSFET (SegFET) and junctionless transistor (JLT) that can suppress the random variations and the SegFET-/JLT-based static random access memory (SRAM) cell that enhance the read and write margins at a time, though generally with a trade-off between the read and the write margins, are introduced.

• 한국전기전자재료학회논문지
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• 제34권5호
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• pp.296-300
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• 2021

The performance of devices has been improved with fine processes from planar to three-dimensional transistors (e.g., FinFET, NWFET, and MBCFET). There are some problems such as a short channel effect or a self-heating effect occur due to the reduction of the gate-channel length by miniaturization. To solve these problems, we compare and analyze the electrical and thermal characteristics of FinFET and GAAFET devices that are currently used and expected to be further developed in the future. In addition, the optimal structure according to the Fin shape was investigated. GAAFET is a suitable device for use in a smaller scale process than the currently used, because it shows superior electrical and thermal resistance characteristics compared to FinFET. Since there are pros and cons in process difficulty and device characteristics depending on the channel formation structure of GAAFET, we expect a mass-production of fine processes over 5 nm through structural optimization is feasible.