• 산업경영시스템학회지
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• 제29권1호
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• pp.135-142
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• 2006

The package loading process of tile lumbering industry is an operation that after a pair of workers binds three or six lumber into a unit and cut the both ends of the lumber, carry and pack and load the weight cargo of 30-50kg. The package loading process causes lots of noise and wood dust when the lumber are cut and brings about the main cause of the musculoskeletal disorder when workers carry the heavy goods. Therefore, we developed the monolithic package loading equipment cutting both ends that is enable to improve the working method and environments of the existing package loading process. The noise and wood dust were reduced by developing the device and the main cause of shirking duties on working place was solved by preventing the musculoskeletal disorder and improving the working environments as excluding the work of carrying heavy goods.

• 농촌계획
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• 제20권4호
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• pp.157-164
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• 2014

This study clarified the correlation between the satisfaction of farm experience village visitors and the package design of farm specialty products and identified the factors to consider when improving the package design. It was found that the satisfaction with package design when purchasing farm specialty products affected the satisfaction of farm experience village visitors. In case of farm experience village visitors, they were more satisfied with the purchase when they were satisfied with the package design of farm specialty products they purchased. The results of analysis of correlation between the satisfaction of farm experience village visitors and the improvement of package design of farm specialty products showed that the important factors of package design are easiness of transport handling, easiness of storage, and functionality of packaging materials.

• 동아시아식생활학회지
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• 제6권3호
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• pp.335-344
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• 1996

This study was to investigate consumer recognition on food label of food package. The results of this study were as follows: 1. when shopping for food, the items considered the most were taste of family, food safety, nutrition and price, respectively. 2. 95.5% of respondents confirmed of the food label of food package when shopping for food. The items confirmed the most on food label were expiration date, manufacture date, manufacturer, food additives and nutrition, respectively. 3. 85.3% of respondents did not satisfy on the food label of food label of food package. 43.6% of respondents demanded food additives more detailed. 28.2% of respondents demanded nutrition information more detailed. 28.2% of respondents demanded food function more detailed. 4. The food which respondents satisfied on food label most were snack '||'&'||' cookies, nuddle, spices, can '||'&'||' bottled food, instant food, processed meat foo, frozen food and imported food, respectively. 5. The group with the most hphrases falling in the top rank was nutrition/calories. The phrases in the nutrition/calories group scored in the top rank were 3 "positive" nutritional characteristics(addition of vitamins, addition of DHA, high dietary fiber) and 5 "nagative" nutritional characteristics(no sugar, low sugar, low calories, low salt and low cholesterol). The group with the most phrases falling in the third rank was ingredient. The phrases in the ingredient scored in the third rank were add of food additives. 6. 55.5% of respondents did not know Recommended Daily Allowance(RDA) information and 61.9% of respondents did not understand the nutrition declaration(content) of food package but 65.7% of resspondents understood the nutrition claim of food package. From these result, respondents were more affected by nutrition claim than by nutrition declaration on food package when shopping for food.ood.

• E2M - 전기 전자와 첨단 소재
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• 제10권6호
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.65-70
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• 2014

박형 package-on-package의 상부 패키지에 대하여 PCB 기판, 칩본딩 및 에폭시 몰딩과 같은 공정단계 진행에 따른 warpage 특성을 분석하였다. $100{\mu}m$ 두께의 박형 PCB 기판 자체에서 $136{\sim}214{\mu}m$ 범위의 warpage가 발생하였다. 이와 같은 PCB 기판에 $40{\mu}m$ 두께의 박형 Si 칩을 die attach film을 사용하여 실장한 시편은 PCB 기판의 warpage와 유사한 $89{\sim}194{\mu}m$의 warpage를 나타내었으나, 플립칩 공정으로 Si 칩을 PCB 기판에 실장한 시편은 PCB 기판과 큰 차이를 보이는 $-199{\sim}691{\mu}m$의 warpage를 나타내었다. 에폭시 몰딩한 패키지의 경우에는 DAF 실장한 시편은 $-79{\sim}202{\mu}m$, 플립칩 실장한 시편은 $-117{\sim}159{\mu}m$의 warpage를 나타내었다.

• 디지털융복합연구
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• 제18권5호
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• pp.473-484
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• 2020

패키지관광의 고객이 추구하는 동기와 제약을 검증하여 고객의 욕구에 부흥하는 콘텐츠 개발 및 패키지관광의 장점을 부각시켜 적극적인 홍보 등을 통하여 패키지관광의 활성화하는 방안을 제시하는 것이 연구 목적이다. 본 연구는 패키지관광을 경험 한 19세 이상의 성인 481명을 대상으로 SPSS 25.0을 이용하여 실증분석을 검증하였다. 연구 분석 결과는 다음과 같다. 첫째, 관광동기의 일상탈출, 외부활동, 서비스매력은 모두 태도에 긍정적인 영향관계가 검증되었다. 둘째, 관광제약의 내재적제약은 태도와의 관계에서 부정적인 영향을 가지는 것을 확인하였으나, 구조적제약은 유의적인 영향을 미치지 않은 것으로 규명되었다. 셋째, 태도는 만족도에 긍정적인 영향을 미치는 것으로 나타났다. 이러한 결과를 바탕으로 관광객이 패키지관광상품 참여시 중요하게 느끼는 요인이 무엇인지에 대하여 기술하였으며, 관광객이 요구하는 맞춤형 상품개발을 강구하는데 유용하게 활용되길 기대한다. 향후 패키지관광의 활성화에 필요한 현실성 있는 비교 연구로 확대할 필요가 있을 것이다.

• Journal of Mechanical Science and Technology
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• 제14권2호
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• pp.251-258
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• 2000

Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

• 한국인쇄학회지
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• 제30권2호
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• pp.47-58
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• 2012

The purpose of this study is to provide how various elements of package design affect on consumer response. Those consumers who is living at Sung-nam district and who is using or have used herbal shampoo were selected as respondents for this research. For testing hypotheses. frequency analysis, reliability analysis, and multi regression analysis were utilized with SPSS 12. All elements of package design influenced on brand attitude and purchasing intention. Typography is the most effective element influencing on brand attitude, while illustration is on purchasing intention. This result could be a useful reference for package designer and brand manager to trigger positive brand attitude and purchasing intention.

• 한국콘텐츠학회:학술대회논문집
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• 한국콘텐츠학회 2008년도 춘계 종합학술대회 논문집
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• pp.763-767
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• 2008

본 연구는 기획여행상품의 가치, 여행자 만족 및 기획여행상품의 원가구성요소에 대한 이론적 기초의 정리에서 출발하여 이와 관련한 선행연구들의 선택된 원가구성요소에 대하여 알아본다. 이론적 연구의 구체적인 고찰을 통해 기획여행상품의 가치와 여행자 만족과는 어떠한 유기적인 관계가 있는지를 파악하고, 여행자 만족을 평가하기 위해 적용된 기획여행상품 원가구성요소의 선택기준에 대한 시사점은 무엇인지를 분석한다. 이러한 연구고찰을 통해 여행사는 기획여행상품의 기획 및 판매시 중점적으로 지원해야 될 부분이 무엇인지, 소비자의 의도가 무엇인지를 파악할 수 있으며, 또한 기획여행상품 생산자의 입장에서 고객의 욕구에 부합하는 기획여행상품 개발에 이를 활용할 수 있을 것이다. 한편 본 연구는 다른 하나의 핵심적인 목적을 위해 시행된 바, 원가구성 요소의 선택기준을 근거로 여행자 및 여행사 입장에서의 기획여행상품의 평가지표 중요도 연구 등에 활용하고자 한다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.39-47
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• 2002

Heat is always the root of stress acting upon the electronic package, regardless of the heat due to the device itself during operation or working under the adverse environment. Due to the significant mismatch in coefficient of thermal expansion (CTE) and the thermal conductivity (K) of the packaging components, on one hand intensive research has been conducted in order to enhance the device reliability by minimizing the mechanical stressing and deformation within the package. On the other hand the effectiveness of different thermal enhancements are pursued to dissipate the heat to avoid the overheating of the device. However, the interactions between the thermal-mechanical loading has not yet been address fully. in articular when the temperature gradient is considered within the package. To address the interactions between the thermal loading upon the mechanical stressing condition. coupled-field analysis is performed to account the interaction between the thermal and mechanical stress distribution. Furthermore, process induced defects are also incorporated into the analysis to determine the effects on thermal conducting path as well as the mechanical stress distribution. It is concluded that it feasible to consider the thermal gradient within the package accompanied with the mechanical analysis, and the subsequent effects of the inherent defects on the overall structural integrity of the package are discussed.