Electrical & Electronic Materials (E2M - 전기 전자와 첨단 소재)
- Volume 10 Issue 6
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- Pages.519-527
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- 1997
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- 2982-6268(pISSN)
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- 2982-6306(eISSN)
Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package
반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용
Abstract
The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured
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