• Journal of Korean Society of Industrial and Systems Engineering
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• v.29 no.1
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• pp.135-142
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• 2006

The package loading process of tile lumbering industry is an operation that after a pair of workers binds three or six lumber into a unit and cut the both ends of the lumber, carry and pack and load the weight cargo of 30-50kg. The package loading process causes lots of noise and wood dust when the lumber are cut and brings about the main cause of the musculoskeletal disorder when workers carry the heavy goods. Therefore, we developed the monolithic package loading equipment cutting both ends that is enable to improve the working method and environments of the existing package loading process. The noise and wood dust were reduced by developing the device and the main cause of shirking duties on working place was solved by preventing the musculoskeletal disorder and improving the working environments as excluding the work of carrying heavy goods.

• Journal of Korean Society of Rural Planning
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• v.20 no.4
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• pp.157-164
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• 2014

This study clarified the correlation between the satisfaction of farm experience village visitors and the package design of farm specialty products and identified the factors to consider when improving the package design. It was found that the satisfaction with package design when purchasing farm specialty products affected the satisfaction of farm experience village visitors. In case of farm experience village visitors, they were more satisfied with the purchase when they were satisfied with the package design of farm specialty products they purchased. The results of analysis of correlation between the satisfaction of farm experience village visitors and the improvement of package design of farm specialty products showed that the important factors of package design are easiness of transport handling, easiness of storage, and functionality of packaging materials.

• Journal of the East Asian Society of Dietary Life
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• v.6 no.3
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• pp.335-344
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• 1996

This study was to investigate consumer recognition on food label of food package. The results of this study were as follows: 1. when shopping for food, the items considered the most were taste of family, food safety, nutrition and price, respectively. 2. 95.5% of respondents confirmed of the food label of food package when shopping for food. The items confirmed the most on food label were expiration date, manufacture date, manufacturer, food additives and nutrition, respectively. 3. 85.3% of respondents did not satisfy on the food label of food label of food package. 43.6% of respondents demanded food additives more detailed. 28.2% of respondents demanded nutrition information more detailed. 28.2% of respondents demanded food function more detailed. 4. The food which respondents satisfied on food label most were snack '||'&'||' cookies, nuddle, spices, can '||'&'||' bottled food, instant food, processed meat foo, frozen food and imported food, respectively. 5. The group with the most hphrases falling in the top rank was nutrition/calories. The phrases in the nutrition/calories group scored in the top rank were 3 "positive" nutritional characteristics(addition of vitamins, addition of DHA, high dietary fiber) and 5 "nagative" nutritional characteristics(no sugar, low sugar, low calories, low salt and low cholesterol). The group with the most phrases falling in the third rank was ingredient. The phrases in the ingredient scored in the third rank were add of food additives. 6. 55.5% of respondents did not know Recommended Daily Allowance(RDA) information and 61.9% of respondents did not understand the nutrition declaration(content) of food package but 65.7% of resspondents understood the nutrition claim of food package. From these result, respondents were more affected by nutrition claim than by nutrition declaration on food package when shopping for food.ood.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.65-70
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• 2014

Warpage of top packages to form thin package-on-packages was measured with progress of their process steps such as PCB substrate itself, chip bonding, and epoxy molding. The $100{\mu}m$-thick PCB substrate exhibited a warpage of $136{\sim}214{\mu}m$. The specimen formed by mounting a $40{\mu}m$-thick Si chip to such a PCB using a die attach film exhibited the warpage of $89{\sim}194{\mu}m$, which was similar to that of the PCB itself. On the other hand, the specimen fabricated by flip chip bonding of a $40{\mu}m$-thick chip to such a PCB possessed the warpage of $-199{\sim}691{\mu}m$, which was significantly different from the warpage of the PCB. After epoxy molding, the specimens processed by die attach bonding and flip chip bonding exhibited warpages of $-79{\sim}202{\mu}m$ and $-117{\sim}159{\mu}m$, respectively.

• Journal of Digital Convergence
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• v.18 no.5
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• pp.473-484
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• 2020

The purpose of the research is to propose ways to activate package tours through active promotion by verifying the motives and constraints pursued by customers of package tours, highlighting the advantages of content development and package tours that are revived in their needs. This study verified empirical analysis using SPSS 25.0 for 481 adults aged 19 or older who experienced package tours. The results of the research analysis are as follows. First, the daily escape, external activities, and service appeal of the tourist motivation were all verified with a positive impact on attitude. Second, it was found that the inherent constraints of tourism constraints had a negative effect on the relationship with attitudes, but the structural constraints were not significantly affected. Third, attitudes have shown to have a positive effect on satisfaction. Based on these results, I have described what factors tourists feel important when participating in package tour products, and hope that The factors will be useful in exploring the development of customized products required by tourists. It will need to be expanded to realistic comparative studies needed to revitalize package tours in the future.

• Journal of Mechanical Science and Technology
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• v.14 no.2
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• pp.251-258
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• 2000

Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.2
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• pp.47-58
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• 2012

The purpose of this study is to provide how various elements of package design affect on consumer response. Those consumers who is living at Sung-nam district and who is using or have used herbal shampoo were selected as respondents for this research. For testing hypotheses. frequency analysis, reliability analysis, and multi regression analysis were utilized with SPSS 12. All elements of package design influenced on brand attitude and purchasing intention. Typography is the most effective element influencing on brand attitude, while illustration is on purchasing intention. This result could be a useful reference for package designer and brand manager to trigger positive brand attitude and purchasing intention.

• Proceedings of the Korea Contents Association Conference
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• 2008.05a
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• pp.763-767
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• 2008

This paper investigates a selected criteria of cost elements in prior researches on value of package tour products, satisfaction of the tourist and cost elements of package tour products. In theoretical point of view, this paper shows the relationship between the value of the package tour products and satisfaction of the tourist. In this paper, the selected criteria of cost elements in package tour products for evaluating the satisfaction of the tourist are also analyzed. This research shows travel agencies' focus on the plan and products and consumers' needs. Also this can be used for development of package tour products which meet the consumers' needs as package tour product suppliers. Meanwhile, other purpose of this research is to help investigate evaluation indicators of package tour products for tourists and travel agencies based on cost elements.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.39-47
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• 2002

Heat is always the root of stress acting upon the electronic package, regardless of the heat due to the device itself during operation or working under the adverse environment. Due to the significant mismatch in coefficient of thermal expansion (CTE) and the thermal conductivity (K) of the packaging components, on one hand intensive research has been conducted in order to enhance the device reliability by minimizing the mechanical stressing and deformation within the package. On the other hand the effectiveness of different thermal enhancements are pursued to dissipate the heat to avoid the overheating of the device. However, the interactions between the thermal-mechanical loading has not yet been address fully. in articular when the temperature gradient is considered within the package. To address the interactions between the thermal loading upon the mechanical stressing condition. coupled-field analysis is performed to account the interaction between the thermal and mechanical stress distribution. Furthermore, process induced defects are also incorporated into the analysis to determine the effects on thermal conducting path as well as the mechanical stress distribution. It is concluded that it feasible to consider the thermal gradient within the package accompanied with the mechanical analysis, and the subsequent effects of the inherent defects on the overall structural integrity of the package are discussed.