• Title/Summary/Keyword: Oxide Semiconductor

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C-V Characterization of Plasma Etch-damage Effect on (100) SOI (Plasma Etch Damage가 (100) SOI에 미치는 영향의 C-V 특성 분석)

  • Jo, Yeong-Deuk;Kim, Ji-Hong;Cho, Dae-Hyung;Moon, Byung-Moo;Cho, Won-Ju;Chung, Hong-Bay;Koo, Sang-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.8
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    • pp.711-714
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    • 2008
  • Metal-oxide-semiconductor (MOS) capacitors were fabricated to investigate the plasma damage caused by reactive ion etching (RIE) on (100) oriented silicon-on-insulator (SOI) substrates. The thickness of the top-gate oxide, SOI, and buried oxide layers were 10 nm, 50 nm, and 100 nm, respectively. The MOS/SOI capacitors with an etch-damaged SOI layer were characterized by capacitance-voltage (C-V) measurements and compared to the sacrificial oxidation treated samples and the reference samples without etching. The measured C-V curves were compared to the numerical results from corresponding 2-dimensional (2-D) structures by using a Silvaco Atlas simulator.

Charge Pump Circuits with Low Area and High Power Efficiency for Memory Applications

  • Kang, Kyeong-Pil;Min, Kyeong-Sik
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.6 no.4
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    • pp.257-263
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    • 2006
  • New charge pump circuits with low area and high power efficiency are proposed and verified in this paper. These pump circuits do not suffer the voltage stress higher than $V_{DD}$ across their pumping capacitors. Thus they can use the thin-oxide MOSFETs as the pumping capacitors. Using the thin-oxide capacitors can reduce the area of charge pumps greatly while keeping their driving capability. Comparing the new pump (NCP-2) with the conventional pump circuit using the thick-oxide capacitors shows that the power efficiency of NCP-2 is the same with the conventional one but the area efficiency of NCP-2 is improved as much as 71.8% over the conventional one, when the $V_{PP}/V_{DD}$ ratio is 3.5 and $V_{DD}$=1.8V.

Effect of Ag Formation Mechanism on the Change of Optical Properties of SiInZnO/Ag/SiInZnO Multilayer Thin Films (SiInZnO/Ag/SiInZnO 다층박막의 Ag 형성 메카니즘에 따른 광학적 특성 변화)

  • Lee, Young Seon;Lee, Sang Yeol
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.5
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    • pp.347-350
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    • 2013
  • By inserting a very thin metal layer of Ag between two outer oxide layers of amorphous silicon indium zinc oxide (SIZO), we fabricated a highly transparent SIZO/Ag/SIZO multilayer on a glass substrate. In order to find the optimized thickness of Ag layers, we investigated the variation of optical properties depending on Ag thickness. It was found that the transition of Ag layer from island formation to a continuous film occurred at a critical thickness. Continuity of the Ag film is very important for optical properties in SIZO/Ag/SIZO multilayer. With about 15 nm thick Ag layer, the multilayer showed a high optical transmittance of 80% at 550 nm and low emissivity in IR.

Analysis on the defect and scratch of Chemical Mechanical Polishing Process (CMP 공정의 Defect 및 Scratch의 유형분석)

  • Kim, Hyung-Gon;Kim, Chul-Bok;Kim, Sang-Yong;Lee, Cheol-In;Kim, Tae-Hyung;Chang, Eui-Goo;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.189-192
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    • 2001
  • Recently, STI process is getting attention as a necessary technology for making high density of semiconductor by devices isolation method. However, it does have various problems caused by CMP nprocess, such as torn oxide defects, nitride residues on oxide, damages of si active region, contaminations due to post-CMP cleaning, difficulty of accurate end point detection in CMP process, etc. In this work, the various defects induced by CMP process was introduced and the above mentioned problems of CMP process was examined in detail. Finally, the guideline of future CMP process was presented to reduce the effects of these defects.

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Indium Gallium Zinc Oxide(IGZO) Thin-film transistor operation based on polarization effect of liquid crystals from a remote gate

  • Kim, Myeong-Eon;Lee, Sang-Uk;Heo, Yeong-U;Kim, Jeong-Ju;Lee, Jun-Hyeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.142.1-142.1
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    • 2018
  • This research presents a new field effect transistor (FET) by using liquid crystal gate dielectric with remote gate. The fabrication of thin-film transistors (TFTs) was used Indium tin oxide (ITO) for the source, drain, and gate electrodes, and indium gallium zinc oxide (IGZO) for the active semiconductor layer. 5CB liquid crystal was used for the gate dielectric material, and the remote gate and active layer were covered with the liquid crystal. The output and transfer characteristics of the LC-gated TFTs were investigated.

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A Study on Parameters for Design of IGBT (IGBT 설계 Parameter 연구)

  • Lho, Young-Hwan;Lee, Sang-Yong;Kim, Yoon-Ho
    • Proceedings of the KSR Conference
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    • 2009.05a
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    • pp.1943-1950
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    • 2009
  • The development of high voltage Insulated Gate Bipolar Transistor (IGBT) have given new device advantage in the areas where they compete with conventional GTO (Gate Turnoff Thyristor) technology. The IGBT combines the advantages of a power MOSFET (Metal-Oxide Semiconductor Field-Effect Transistor) and a bipolar power transistor. The change of electrical characteristics for IGBT is mainly coming from the change of characteristics of MOSFET at the input gate and the PNP transistors at the output. The gate oxide structure gives the main influence on the changes in the electrical characteristics affected by environments such as radiation and temperature, etc.. The change of threshold voltage, which is one of the important design parameters, is brought by charge trapping at the gate oxide. In this paper, the electrical characteristics are simulated by SPICE simulation, and the parameters are found to design optimized circuits.

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Analysis on the defect and scratch of Chemical Mechanical Polishing process (CMP 공정의 Defect 및 Scratch의 유형분석)

  • 김형곤;김철복;정상용;이철인;김태형;장의구;서용진
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
    • /
    • pp.189-192
    • /
    • 2001
  • Recently, STI process is getting attention as a necessary technology for making high density of semiconductor by devices isolation method. However, it does have various problems caused by CMP process, such as torn oxide defects, nitride residues on oxide, damages of si active region, contaminations due to post-CMP cleaning, difficulty of accurate end point detection in CMP process, etc. In this work, the various defects induced by CMP process was introduced and the above mentioned Problems of CMP process was examined in detail. Finally, the guideline of future CMP process was presented to reduce the effects of these defects.

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In-situ Monitoring of Anodic Oxidation of p-type Si(100) by Electrochemical Impedance Techniques in Nonaqueous and Aqueous Solutions

  • 김민수;김경구;김상열;김영태;원영희;최연익;모선일
    • Bulletin of the Korean Chemical Society
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    • v.20 no.9
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    • pp.1049-1055
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    • 1999
  • Electrochemical oxidation of silicon (p-type Si(100)) at room temperature in ethylene glycol and in aqueous solutions has been performed by applying constant low current densities for the preparation of thin SiO2 layers. In-situ ac impedance spectroscopic methods have been employed to characterize the interfaces of electrolyte/oxide/semiconductor and to estimate the thickness of the oxide layer. The thicknesses of SiO2 layers calculated from the capacitive impedance were in the range of 25-100Å depending on the experimental conditions. The anodic polarization resistance parallel with the oxide layer capacitance increased continuously to a very large value in ethylene glycol solution. However, it decreased above 4 V in aqueous solutions, where oxygen evolved through the oxidation of water. Interstitially dissolved oxygen molecules in SiO2 layer at above the oxygen evolution potential were expected to facilitate the formation of SiO2 at the interfaces. Thin SiO2 films grew efficiently at a controlled rate during the application of low anodization currents in aqueous solutions.

Line-shaped superconducting NbN thin film on a silicon oxide substrate

  • Kim, Jeong-Gyun;Suh, Dongseok;Kang, Haeyong
    • Progress in Superconductivity and Cryogenics
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    • v.20 no.4
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    • pp.20-25
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    • 2018
  • Niobium nitride (NbN) superconducting thin films with the thickness of 100 and 400 nm have been deposited on the surfaces of silicon oxide/silicon substrates using a sputtering method. Their superconducting properties have been evaluated in terms of the transition temperature, critical magnetic field, and critical current density. In addition, the NbN films were patterned in a line with a width of $10{\mu}m$ by a reactive ion etching (RIE) process for their characterization. This study proves the applicability of the standard complementary metal-oxide-semiconductor (CMOS) process in the fabrication of superconducting thin films without considerable degradation of superconducting properties.

A Study on the Development of Early Acetone Gas Detection to Prevent the Acetone Leakage Accident (아세톤 누출사고 예방을 위한 아세톤 가스 조기감지 기술개발에 관한 연구)

  • Seung Jin Jeon;Youngbo Choi
    • Journal of the Korean Society of Safety
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    • v.38 no.2
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    • pp.30-35
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    • 2023
  • Acetone is a widely used Volatile Organic Compound (VOC) in industries and laboratories. However, acetone affects human health adversely and causes fires and explosions. Early acetone detection and improved personnel training in safety and emergency management are necessary to prevent acetone-related accidents. The multi-VOC acetone detectors used currently have a sensitivity and selectivity limit. In this study, we discovered that Pt-loaded iron oxide (a metal oxide semiconductor) conversely, has high detection and selectivity for very low-levels of acetone gas. The loaded Pt catalyzes the reaction between the sensing materials' surface and the oxygen molecules in the air; this optimizes acetone detection and can decrease acetone-related illnesses, fires and explosions.