• 한국정보처리학회:학술대회논문집
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• 한국정보처리학회 2012년도 추계학술발표대회
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• pp.197-199
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• 2012

최근 GPU 의 뛰어난 부동 소수점 연산 능력을 활용하여 그래픽 이외에 다양한 응용 프로그램들의 병렬화 및 성능최적화가 활발하게 이루어지고 있다. 이러한 GPU 의 성능을 극대화하기 위해서는 메모리 계층구조 및 shared memory 를 비롯한 on-chip 메모리의 사용을 최적화하는 것이 필수적이다. 본 논문에서는 이러한 shared memory 의 사용을 최적화하기 위한 기법들을 제안하고, 이를 패턴 매칭 응용 프로그램에 적용하여 효용성을 검증한다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권3호
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• pp.423-426
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• 2015

Current verification methods for on-chip memory have been implemented using coverpoints that are generated based on a single operation. These coverpoints cannot consider the influence of other memory banks in a busy state. In this paper, we propose a method in which the coverpoints account for all operations executed on different memory banks. In addition, a new constrained random vector generation method is proposed to reduce the required random vectors for the multi-operation-based coverpoints. The simulation results on NAND flash memory show 100% coverage with 496,541 constrained random vectors indicating a reduction of 96.4% compared with conventional random vectors.

• Transactions on Electrical and Electronic Materials
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• 제5권4호
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• pp.138-142
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• 2004

This paper presents the improved bum-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved through the bum-in process. Reliability problem is more significant in MCP that includes over two chips in a package, because the failure of one chip (SRAM) has a large influence on the yield and quality of the other chips - Flash Memory, DRAM, etc. Therefore, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level bum-in process using multi cells selection method in addition to the previously used methods. That method is effective in detecting special failure. Finally, with the composition of some kind of methods, we could achieve the high quality of SRAM in Multi Chip Package.

• 전자공학회논문지A
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• 제32A권5호
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• pp.737-748
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• 1995

In this paper, we studyed the variables in the design of multichip memory modules with 4M$\times$1bit DRAM chips to construct high capacity and high speed memory modules. The configuration of the module was 8 bit, 16 bit, and 32 bit DRAM modules with employing 0.6 W, 70 nsec 4M$\times$1 bit DRAM chips. We optimized routing area and wiring density by performing the routing experiment with the variables of the chip allocation, module I/O terminal, the number of wiring, and the number of mounting side of the chips. The multichip module was designed to be able to accept MCM-L techiques and low cost PCB materials. The module routing experiment showed that it was an efficient way to align chip I/O terminals and module I/O terminals in parallel when mounting bare chips, and in perpendicular when mounting packaged chips, to set module I/O terminals in two sides, to use double sided substrates, and to allocate chips in a row. The efficient number of wiring layer was 4 layers when designing single sided bare chip mounting modules and 6 layers when constructing double sided bare chip mounting modules whereas the number of wiring layer was 3 layers when using single sided packaged chip mounting substrates and 5 layers when constructing double sided packaged chip mounting substrates. The most efficient configuration was to mount bare chips on doubled substrates and also to increase the number of mounting chips. The fabrication of memory multichip module showed that the modules with bare chips can be reduced to a half in volume and one third in weight comparing to the module with packaged chips. The signal propagation delay time on module substrate was reduced to 0.5-1 nsec.

• 정보처리학회논문지A
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• 제13A권7호
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• pp.589-598
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• 2006

본 논문에서는 블루투스 무선 링크를 이용한 실시간 오디오 스트리밍을 위해 DSP를 내장한 SoC (System-on-Chip) 플랫폼 상에서 임베디드 블루투스 솔루션의 개발과 최적화에 대해 설명한다. 개발된 솔루션을 이식성을 고려해서 가상 운영체제 상에서 구현된 임베디드 블루투스 프로토콜 스택, 프로파일과 타겟 멀티미디어 SoC의 특성을 이용한 최적화 기법들을 포함한다. 수요 최적화 기법으로는 SoC 내의 스크래치 패드 메모리의 활용을 통한 메모리 접근 최소화, DSP 연산과 병렬 메모리 접근 명령을 이용한 코덱 구현, 무선 통신 환경을 고려한 동적 오디오 품질 조정 등이 있다. 실험 결과는 본 연구에서 제안한 최적화 기법을 적용한 임베디드 솔루션은 별도의 외부 메모리 없이 고품질 오디오 스트리밍을 지원할 수 있음을 보여준다.

• 대한전자공학회논문지SD
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• 제44권12호
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• pp.61-70
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• 2007

메모리 기술이 발달함에 따라 메모리의 집적도가 증가하게 되었고, 이러한 변화는 구성요소들의 크기를 작아지게 만들고, 고장의 감응성이 증가하게 하였다. 그리고 고장은 더욱 복잡하게 되었다. 또한, 칩 하나에 포함되어있는 저장 요소가 늘어남에 따라 테스트 시간도 증가하게 되었다. 그리고 SOC 기술의 발달로 대용량의 내장 메모리를 통합할 수 있게 되었지만, 테스트 과정이 복잡하게 되어 외부 테스트 환경에서는 내장 메모리를 테스트하기 어렵게 되었다. 본 논문에서 제안하는 테스트 구조는 내장 테스트를 사용하여 외부 테스트 환경 없이 테스트가 가능하다. 제안하는 내장 테스트 구조는 다양한 알고리즘을 적용 가능하므로, 생산 공정의 수율 변화에 따른 알고리즘 변화에 적용이 가능하다. 그리고 메모리에 내장되어 테스트하므로, At-Speed 테스트가 가능하다. 즉, 다양한 알고리즘과 여러 형태의 메모리 블록을 테스트 가능하기 때문에 높은 효율성을 가진다.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.82-87
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• 2020

In this paper, we introduce the novel idea to improve the B/W usage efficiency of on-chip networks used for TAM to test multiple DRAMs. In order to avoid the local bottleneck of test packets caused by an ATE, we make test patterns using microcode-based instructions within ATE and adopt a test bus to transmit test responses from DRAM DFT (Design for Testability) called Test Generator (TG) to ATE. The proposed test platform will contribute to increasing the test economics of memory IC industry.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 B
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• pp.1295-1297
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• 1996

CCITT G.721, G.723 standard ADPCM algorithm is implemented by using TI's fixed point DSP start kit (DSK). ADPCM can be implemented on a various rates, such as 16K, 24K, 32K and 40K. The ADPCM is sample based compression technique and its complexity is not so high as the other speech compression techniques such as CELP, VSELP and GSM, etc. ADPCM is widely applicable to most of the low cost speech compression application and they are tapeless answering machine, simultaneous voice and fax modem, digital phone, etc. TMS320C50 DSP is a low cost fixed point DSP chip and C50 DSK system has an AIC (analog interface chip) which operates as a single chip A/D and D/A converter with 14 bit resolution, C50 DSP chip with on-chip memory of 10K and RS232C interface module. ADPCM C code is compiled by TI C50 C-compiler and implemented on the DSK on-chip memory. Speech signal input is converted into 14 bit linear PCM data and encoded into ADPCM data and the data is sent to PC through RS232C. The ADPCM data on PC is received by the DSK through RS232C and then decoded to generate the 14 bit linear PCM data and converted into the speech signal. The DSK system has audio in/out jack and we can input and out the speech signal.

• 한국정보처리학회:학술대회논문집
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• 한국정보처리학회 2009년도 추계학술발표대회
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• pp.41-42
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• 2009

현재 많은 임베디드 SoC(System-On-Chip)에는 캐시 메모리의 단점을 보완하기 위해 온-칩(On-Chip) SRAM, 즉, SPM(Scratchpad Memory)를 내장하고 있으며 SPM은 그 특성상 캐시 메모리와 달리 소프트웨어가 직접 관리해야 한다. 본 논문에서는 NUMA를 지원하는 Linux 상에서 이식성이 높으면서 단순하게 구현할 수 있는 SPM 관리 방법을 제안한다.

• 전자공학회논문지B
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• 제33B권2호
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• pp.149-158
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• 1996

In this paper we describe designing and implementing a digital neural chip and a parallel neural machine for simulating large scale neural netsorks. The chip is a single-chip multiprocessor which has four digiral neural processors (DNP-II) of the same architecture. Each DNP-II has program memory and data memory, and the chip operates in MIMD (multi-instruction, multi-data) parallel processor. The DNP-II has the instruction set tailored to neural computation. Which can be sed to effectively simulate various neural network models including on-chip learning. The DNP-II facilitates four-way data-driven communication supporting the extensibility of parallel systems. The parallel neural machine consists of a host computer, processor boards, a buffer board and an interface board. Each processor board consists of 8*8 array of DNP-II(equivalently 2*2 neural chips). Each processor board acn be built including linear array, 2-D mesh and 2-D torus. This flexibility supports efficiency of mapping from neural network models into parallel strucgure. The neural system accomplishes the performance of maximum 40 GCPS(giga connection per second) with 16 processor boards.