• Journal of Internet Computing and Services
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• v.6 no.4
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• pp.47-58
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• 2005

There are two major type of flash memory products, namely, NAND-type and NOR-type flash memory. NOR-type flash memory is generally deployed as ROM BIOS code storage because if offers Byte I/O and fast read operation. However, NOR-type flash memory is more expensive than NAND-type flash memory in terms of the cost per byte ratio, and hence NAND type flash memory is more widely used as large data storage such as embedded Linux file systems. In this paper, we designed an efficient flash memory file system based an Embedded system and presented to make up for reduced to Swapping a weak System Performance to flash file system using NAND-type flash memory, then proposed Swapping algorithm insured to an Execution time. Based on Implementation and simulation studies, Then, We improved performance bases on NAND-type flash memory to the requirement of the embedded system.

• Journal of The Institute of Information and Telecommunication Facilities Engineering
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• v.10 no.4
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• pp.115-120
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• 2011

Recently flash memory is widely used in various mobile devices as storage medium. Nonvolatile memory can be divided into two categories: NAND- and NOR-type flash memory. NOR flash memory is mainly used to store instruction codes for operation; while NAND for data storage. However, NAND does show more economical benefits, that is, it is approximately 30~40% cheaper than NOR flash. Therefore it can be useful to improve NAND flash performance by replacing NOR flash with NAND flash combining with various buffer systems.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.2
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• pp.1-6
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• 2010

We proposed a highly integrated 3-dimensional NOR Flash memory array by using vertical 4-bit SONOS NOR flash memory. This structure has a vertical channel, so it is possible to have a long enough channel without extra cell area. Therefore, we can avoid second-bit effect, short channel effect, and redistribution of injected charges. And the proposed array structure is based on three-dimensional integration. Thus, we can obtain a NOR flash memory having $1.5F^2$/bit cell size.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.1
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• pp.79-89
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• 2014

It has been an increase in consumers who want a high-capacity and fast speed by the newly diffused mobile device(Smart phones, Ultra books, Tablet PC). As a result, the demand for Flash Memory is constantly increasing. Flash Memory is separated by a NAND-type and NOR-type. NAND-type Flash Memory speed is slow, but price is cheaper than the NOR-type Flash Memory. For this reason, NAND-type Flash Memory is widely used in the mobile market. So Fault Detection is very important for Flash Memory Test. In this paper, Proposed PMBIST for Pattern Test of NAND-type Flash Memory improved Fault detection.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.3
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• pp.710-716
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• 2008

This paper covers the performance evaluation of two flash memory-based file storages, NAND and NOR, which are the major flash types. To evaluate their performances, we set up separate file storages for the two types of flash memories on a PocketPC-based experimental platform. Using the platform, we measured and compared the I/O throughputs in terms of buffer size, amount of used space, and kernel-level write caching. According to the results from our experiments, the overall performance of the NAND-based storage is higher than that of NOR by up to 4.8 and 5.7 times in write and read throughputs, respectively. The experimental results show the relative strengths and weaknesses of the two schemes and provide insights which we believe assist in the design of flash memory-based file storages.

• IEMEK Journal of Embedded Systems and Applications
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• v.10 no.3
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• pp.151-156
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• 2015

Recently, an embedded flash memory has been widely used for the Internet of Things(IoT). Due to its nonvolatility, economical feasibility, stability, low power usage, and fast speed. With respect to power consumption, the embedded memory system must consider the most significant design factor. The objective of this research is to design high performance and low power NAND flash memory architecture including a dual buffer as a replacement for NOR flash. Simulation shows that the proposed NAND flash system can achieve better performance than a conventional NOR flash memory. Furthermore, the average memory access time of the proposed system is better that of other buffer systems with three times more space. The use of a small buffer results in a significant reduction in power consumption.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.3
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• pp.193-198
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• 2005

NOR type flash 32 ${\times}$ 32 way are fabricated by using the typical 0.35 ${\mu}{\textrm}{m}$ CMOS process. The structure of array is the NOR type with common source line. In this paper, optimized program and erase voltage conditions are presented to realize multi-bit per cell at the CSL-NOR array. These are considered selectivity of selected bit and disturbances of unselected bits. Retention characteristics of locally trapped-charges in the nitride layer are investigated. The lateral diffusion and vertical detrapping to the tunneling oxide of locally trapped charges as a function of retention time are investigated by using the charge pumping method. The results are directly shown by change of the trapped-charges quantities.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.250-250
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• 2010

The random telegraph signal (RTS) for the NOR flash cell scaling is investigated. An innovative method to suppress the RTS, based on the device engineering, is proposed. By optimizing the channel doping profile and using the high-k tunnel dielectric, it is confirmed from three-dimensional (3-D) simulation, that the $V_{th}$ amplitude, dueto RTS, is significantly suppressed, from approximately 0.5 to 0.07 V in the middle of the channel at 45 nm NOR Flash technology. From this result, it is expected that the proposed method to suppress the RTS amplitude is essential for further cell size scaling in Flash memory.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.26-27
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• 2006

To develop tera-bit level SONOS flash memories, SONOS unit memory and 64 bit flash arrays are fabricated. The unit cells have both channel length and width of 30nm. The NAND & NOR arrays are fabricated on SOI wafer and patterned by E-beam. The unit cells represent good write/erase characteristics and reliability characteristics. SSL-NOR array have normal write/erase operation. These researches are leading the realization of Tera-bit level non-volatile nano flash memory.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.26-31
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• 2002

To realize a high integrated Flash memory utilizing SONOS memory devices, the NOR type 1TC(one Transistor Cell) SONOS Flash arrays are fabricated and characterized. This SONOS Flash arrays with common source lines are designed and fabricated by conventional 0.35$\mu\textrm{m}$ CMOS process. The thickness of ONO for memory cell is tunnel oxide of 34${\AA}$, nitride of 73${\AA}$ and blocking oxide of 34${\AA}$. To investigate operating characteristics, CHEI(Channel Hot Electron Injection) method and Bit line erase method are selected as the write operation and the erase method, respectively. The disturbance characteristics according to the write/erase/read cycling are also examined. The degradation characteristics are investigated and then the reliability of SONOS flash memory is guaranteed.