• 한국결정성장학회지
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• 제29권4호
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• pp.149-153
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• 2019

HVPE는 GaN 단결정의 제조 방법 중 하나로 빠른 성장 속도가 장점인 상업적으로 널리 사용되는 성장 방법이다. HVPE 법에 의한 GaN 단결정 성장은 여러 공정으로 이루어지며, 특히 GaN 성장 전 기판의 질화 처리는 성장되는 GaN 단결정 품질에 상당한 영향을 미친다. 본 연구에서는 사파이어 기판 위에 GaN 단결정 성장 시 기판의 질화처리가 성장되는 GaN 단결정 품질에 미치는 영향을 알아보고자 하였다. 질화 처리를 제외한 다른 성장 조건은 동일하게 하였고 질화처리 시 기판에 공급되는 가스 유량을 다양하게 변화시킨 후 GaN 박막을 성장시키고, 성장된 GaN의 표면 특성평가를 통하여, HVPE 법에서의 질화처리 효과를 고찰하여 보고자 하였다.

• 한국전자통신학회논문지
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• 제9권7호
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• pp.747-752
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• 2014

본 논문은 $0.13{\mu}m$ 기술의 디자인을 10% 축소하는데 기존의 로직 디바이스만의 축소와는 달리 로직뿐 아니라 입, 출력 회로의 축소에 관한 것이다. 게이트 산화막(1.2V)을 decoupled plasma nitridation(DPN) oxide로 변경함으로써 flicker 노이즈를 축소 전 공정에 비해 1/3-1/5배 감소됨을 확인하였다. 또한, 축소에 의한 피할 수 없는 문제는 일반적인 metal insulator metal(MIM)의 캐패시터 문제이다. 이를 해결하기 위하여 20% 높은 MIM 캐패시터($1.2fF/{\mu}m^2$)를 개선하고 그 특성을 평가하였다.

• Progress in Superconductivity
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• 제3권1호
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• pp.49-55
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• 2001

Josephson junction arrays were fabricated by DC magnetron sputtering, self-aligning and reactive ion etching technique. The Al native oxide, formed by thermal oxidation, was used as the tunneling barrier of Nb/$Al-A1_2$$O_3$Nb trilayer. The arrays have 2,000 Josephson junctions with the area of $14\mu\textrm{m}$ $\times$ $46\mu\textrm{m}$. The gap voltages were in the range of 2.5 ~2.6 mV and the spread of critical current was $\pm$11~14%. When operated at 70~94 ㎓, the arrays generated zero-crossing steps up to 2.1~2.4 V. To improve transmission of microwave power and prevent diffusion of oxygen into Nb ground-plane while depositing $SiO_2$dielectric, we applied a plasma nitridation process to the Nb ground-plane. The microwave power was well propagated in Josephson junction arrays with nitridation. The difference in microwave transmission 7an be interpreted by the surface impedance change depending on nitridation.

• 한국분말재료학회지
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• 제25권6호
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• pp.482-486
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• 2018

Despite numerous advances in the preparation and use of GaN, and many leading-edge applications in lighting technologies, the preparation of high-quality GaN powder remains a challenge. Ammonolytic preparations of polycrystalline GaN have been studied using various precursors, but all were time-consuming and required high temperatures. In this study, an efficient and low-temperature method to synthesize high-purity hexagonal GaN powder is developed using sub-micron $Ga_2O_3$ powder as a starting material. The sub-micron $Ga_2O_3$ powder was prepared by an ultrasonic spray pyrolysis process. The GaN powder is synthesized from the sub-micron $Ga_2O_3$ powder through a nitridation treatment in an $NH_3$ flow at $800^{\circ}C$. The characteristics of the synthesized powder are systematically examined by X-ray diffraction, scanning and transmission electron microscopy, and UV-vis spectrophotometer.

• 대한전자공학회논문지
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• 제25권12호
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• pp.1649-1655
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• 1988

Thermally growon SiO2 films were thermally nitrided in a hot-wall furnace and in a RF-heated cold-wall reactor and their characteristics were investigated by the AES and the C-V dmeasurements. The Auger depth profile show that 200\ulcornerSiO2 film nitrided at 1200\ulcorner, for 2hrs by the hot-wall process has a nitrogen-rich layer near the SiOxNy-Si interface. However the nitrogen-ri h layer is not observed in the case of cold-wall process. The maximum flat-band voltage for the SiO2 films nitrided by the hot-wall process is higher than by the cold-wall process, and the peak value of flat-band voltage for the hot-wall process appears the longer nitridation time than that for the cold-wall process. The SiOxNy-Si interface shift toward the Si substrate for the case of the hot-wall process is larger than that for the cold-wall process.

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.296-299
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• 2008

The effects of radio frequency (RF) source power for decoupled plasma nitridation (DPN) process on the electrical properties and Fowler-Nordheim (FN) stress immunity of the oxynitride gate dielectrics for deep nano-technology devices has been investigated. With increase of RF source power, the threshold voltage (Vth) of a NMOS transistor(TR) decreased and that of a PMOS transistor increased, indicating that the increase of nitrogen incorporation in the oxynitride layer due to higher RF source power induced more positive fixed charges. The improved off-current characteristics and wafer uniformity of PMOS Vth were observed with higher RF source power. FN stress immunity, however, has been degenerated with increasing RF source power, which was attributed to the increased trap sites in the oxynitride layer. With the experimental results, we could optimize the DPN process minimizing the power consumption of a device and satisfying the gate oxide reliability.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2001년도 High Temperature Superconductivity Vol.XI
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• pp.33-33
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• 2001

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.1-4
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• 1998

In this paper, we have studied a variation of I-V characteristics, and time-dependent dielectric breakdown(TDDB) of thin layer NO and ONO film depending on nitridation and reoxidation time, respectively, and measured a variation of leakage current and charge-to-breakdown(Q$\_$bd/) of optimized NO and ONO film depending on ambient temperature, and then compared with the properties of conventional SiO$_2$. From the results, we find that these NO and ONO thin films are strongly influenced by process time and the optimized ONO film shows superior dielectric characteristics, and Q$\_$bd/ performance over the NO film and SiO$_2$, while maintaining a similar electric field dependence compared with NO layer.

• 한국분말재료학회지
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• 제15권6호
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• pp.489-495
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• 2008

Colored tantalum oxy-nitride (TaON) and tantalum nitride ($Ta_{3}N_{5}$) were synthesized by ammonolysis. Oxygen deficient tantalum oxides ($TaO_{1.7}$) were produced by a titration process, using a tantalum chloride ($TaCl_5$) precursor. The stirring speed and the amount of $NH_{4}OH$ were important factors for controling the crystallinity of tantalum oxides. The high crystallinity of tantalum oxides improved the degree of nitridation which was related to the color value. Synthesized powders were characterized by XRD, SEM, TEM and Colorimeter.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2002년도 High Temperature Superconductivity Vol.XII
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• pp.55-55
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• 2002