• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.229-233
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• 2011

Diamond thin films were deposited on pretreated Co cemented tungsten carbide (WC-6%Co) inserts as substrate by microwave plasma chemical vapor deposition (MPCVD) system, equipped with a 915MHz, 30kW generator for generating a large-size plasma. The substrates were pretreated with two solutions Murakami solution $[KOH:K_3Fe(CN)_6:H_2O]$ and nitric solution $[HNO_3:H_2O]$ to etch, WC and Co at cemented carbide substrates, respectively. The deposition experiments were performed at an input power of 10 kW and in a total pressure of 100 torr. The influence of various $CH_4$ contents on the crystallinity and morphology of the diamond films deposited in MPCVD was investigated using scanning electron microscopy (SEM) and Raman spectroscopy. The diamond film synthesized by the $CH_4$ plasma shows a triangle-faceted (111) diamond. As $CH_4$ contents was increased, the thickness of diamond films increased and the faceted planes disappeared. Finally, Faceted diamond changed into nano-crystalline diamond with random crystallinity.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1009-1013
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• 2010

Extremely dense WC with a relative density of up to 99% was obtained within five minutes under a pressure of 80 MPa using the High-Frequency Induction Heated Sintering method. The average grain size of the WC was about 71 nm. The advantage of this process is not only rapid densification to obtain a neartheoretical density but also the prohibition of grain growth in nano-structured materials. The hardness and fracture toughness of the dense WC produced by HFIHS were $2660kg{\cdot}mm^{-2}$ and $7.2MPa{\cdot}m^{1/2}$, respectively.

• Elastomers and Composites
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• v.56 no.3
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• pp.172-178
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• 2021

The wear behavior of styrene-butadiene rubber (SBR) and butadiene rubber (BR) was investigated using a blade-type abrader with a steel blade (SB), Ti-coated tungsten carbide blade (TiB), or zirconia blade (ZB). The wear rate of SBR against SB and TiB decreased with increasing number of revolutions because of the blunting of the blades during wear. However, the wear rate of SBR against ZB remained nearly constant with little blade blunting. Generally, the wear rate of BR was largely unaffected by the blade material used for abrasion. The wear rate and frictional coefficient of SBR were found to be higher than those of BR at similar levels of frictional energy input. A power-law relationship was found between the wear rate and frictional energy input during abrasion. A well-known Schallamach pattern was observed for SBR, while a much finer pattern was observed for BR. The blade material affects the wear rate of the rubbers because the macromolecular free radicals and blade tend to undergo mechano-chemical reactions. The inorganic ZB was found to be the most inert for such a mechanism.

• Korean Journal of Metals and Materials
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• v.46 no.11
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• pp.725-729
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• 2008

Deposition characteristics of electroless plated Ni-W-P films were investigated for various complexing agents. Used complexing agents are sodium citrate, sodium gluconate and sodium malonate. In this study, the existing mixed potential theory could explain the overall mechanism of Ni-W-P electroless plating for all complexing agents. The deposition rate could be also expected by the theory. The deposited Ni-W-P films were evaluated in term of surface hardness and corrosion resistance. Microhardness of the deposit increased about 1,000 Hv after heat treatment for one hour at $400^{\circ}C$, because it was above the crystallization temperature of $Ni_3P$. The deposited Ni-W-P films can exhibit excellent corrosion resistance in using sodium malonate as a complexing agent, the other hand the using sodium gluconate was the worst corrosion resistance. The worst corrosion resistance was due to a large number of nano-sized pin-holes or small pores. The plating current at the mixed potential increases when the using sodium malonate as a complexing agent, it was explained by the cross section.

• Journal of the Semiconductor & Display Technology
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• v.9 no.1
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• pp.41-47
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• 2010

The effects of thermal treatment on CNTs, which were coated with a-$CN_x$ thin film, were investigated and related to variations of chemical bonding and morphologies of CNTs and also properties of field emission induced by thermal treatment. CNTs were directly grown on nano-sized conical-type tungsten tips via the inductively coupled plasma-chemical vapor deposition (ICP-CVD) system, and a-$CN_x$ films were coated on the CNTs using an RF magnetron sputtering system. Thermal treatment on a-$CN_x$ coated CNT-emitters was performed using a rapid thermal annealing (RTA) system by varying temperature ($300-700^{\circ}C$). Morphologies and microstructures of a-$CN_x$/CNTs hetero-structured emitters were analyzed by FESEM and HRTEM. Chemical composition and atomic bonding structures were analyzed by EDX, Raman spectroscopy, and XPS. The field emission properties of the a-$CN_x$/CNTs hetero-structured emitters were measured using a high vacuum (below $10^{-7}$ Torr) field-emission measurement system. For characterization of emission stability, the fluctuation and degradation of the emission current were monitored in terms of operation time. The results were compared with a-$CN_x$ coated CNT-emitters that were not thermally heated as well as with the conventional non-coated CNT-emitters.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.2
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• pp.117-123
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• 2004

A 30 nm $In_{0.7}GaAs$ High Electron Mobility Transistor (HEMT) with triple-gate has been successfully fabricated using the $SiO_2/SiN_x$ sidewall process and BCB planarization. The sidewall gate process was used to obtain finer lines, and the width of the initial line could be lessened to half by this process. To fill the Schottky metal effectively to a narrow gate line after applying the developed sidewall process, the sputtered tungsten (W) metal was utilized instead of conventional e-beam evaporated metal. To reduce the parasitic capacitance through dielectric layers and the gate metal resistance ($R_g$), the etchedback BCB with a low dielectric constant was used as the supporting layer of a wide gate head, which also offered extremely low Rg of 1.7 Ohm for a total gate width ($W_g$) of 2x100m. The fabricated 30nm $In_{0.7}GaAs$ HEMTs showed $V_{th}$of -0.4V, $G_{m,max}$ of 1.7S/mm, and $f_T$ of 421GHz. These results indicate that InGaAs nano-HEMT with excellent device performance could be successfully fabricated through a reproducible and damage-free sidewall process without the aid of state-of-the-art lithography equipment. We also believe that the developed process will be directly applicable to the fabrication of deep sub-50nm InGaAs HEMTs if the initial line length can be reduced to below 50nm order.

• Advances in nano research
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• v.12 no.3
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• pp.291-300
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• 2022

The behavior of hydrogen species on the surface of the catalyst during the Lewis acid transformation to form Brønsted acid sites over the spherical silica-supported WO_x catalyst was investigated. To understand the structure-activity relationship of Lewis acid transformation and hydrogen bonding interactions, we explore the potential of using the in situ diffuse reflection infrared Fourier transform spectroscopy (DRIFTS) with adsorbed ammonia and hydrogen exposure. From the results of in situ DRIFTS measurements, Lewis acid sites on surface catalysts were transformed into new Brønsted acid sites upon hydrogen exposure. The adsorbed NH₃ on Lewis acid sites migrated to Brønsted acid sites forming NH⁴⁺. The results show that the dissociated H atoms present on the catalyst surface formed new Si-OH hydroxyl species - the new Brønsted acid site. Besides, the isolated Si-O-W species is the key towards H-bond and Si-OH formation. Additionally, the H atoms adsorbed surrounding the Si-O-W species of mono-oxo O=WO₄ and di-oxo (O=)₂WO₂ species, where the Si-O-W species are the main species presented on the Inc-SSP catalysts than that of the IWI-SSP catalysts.

• Journal of the Korean Society of Radiology
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• v.13 no.2
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• pp.271-281
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• 2019

This study investigated the shielding efficiency of various types of shielding materials and measured the dose by organ using the phantom. Results of Shielding Efficiency Measurement Using Personal Radiation Meter. Among the various shielding materials, 1.1 mm RNS-TX composed of nano tungsten showed the highest shielding efficiency and 0.2 mm lead shielding showed the lowest shielding efficiency. 99mTc 30 mCi was exposed to the phantom for 120 minutes and the result of the measurement of the organs. 20.53 mSv without radiation protective clothing, 8.75 mSv when wearing 0.25 mm Pb protective clothing, 6.03 mSv when wearing 0.5 mm Pb protective clothing. 131I 2 mCi mCi was exposed to the phantom for 120 minutes and the result of the measurement of the organs. 7.71 mSv without radiation protective clothing, 4.88 mSv when wearing 0.25 mm Pb protective clothing, 2.79 mSv when wearing 0.5 mm Pb protective clothing. 18F 5 mCi was exposed to the phantom for 120 minutes and the result of the measurement of the organs. 16.39 mSv without radiation protective clothing, 15.84 mSv when wearing 0.25 mm Pb protective clothing, 12.52 mSv when wearing 0.5 mm Pb protective clothing. None of the radiation workers working in the nuclear medicine department exceeded the dose limit. However, when compared with other workers in the hospital, they showed a relatively high dose. Therefore, it is necessary to prepare measures to reduce and manage the dose of radiation workers in the nuclear medicine department through the wearing of radiation protective clothing made of lightweight, shielding material with good shielding efficiency, circulation task, task sharing, and substitution equipment such as auto dispenser.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.61-66
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• 2012

Chemical Mechanical Planarization (CMP) is a polishing process used in the microelectronic fabrication industries to achieve a globally planar wafer surface for the manufacturing of integrated circuits. Pad conditioning plays an important role in the CMP process to maintain a material removal rate (MRR) and its uniformity. For metal CMP process, highly acidic slurry containing strong oxidizer is being used. It would affect the conditioner surface which normally made of metal such as Nickel and its alloy. If conditioner surface is corroded, diamonds on the conditioner surface would be fallen out from the surface. Because of this phenomenon, not only life time of conditioners is decreased, but also more scratches are generated. To protect the conditioners from corrosion, thin organic film deposition on the metal surface is suggested without requiring current conditioner manufacturing process. To prepare the anti-corrosion film on metal conditioner surface, vapor SAM (self-assembled monolayer) and FC (Fluorocarbon) -CVD (SRN-504, Sorona, Korea) films were prepared on both nickel and nickel alloy surfaces. Vapor SAM method was used for SAM deposition using both Dodecanethiol (DT) and Perfluoroctyltrichloro silane (FOTS). FC films were prepared in different thickness of 10 nm, 50 nm and 100 nm on conditioner surfaces. Electrochemical analysis such as potentiodynamic polarization and impedance, and contact angle measurements were carried out to evaluate the coating characteristics. Impedance data was analyzed by an electrical equivalent circuit model. The observed contact angle is higher than 90o after thin film deposition, which confirms that the coatings deposited on the surfaces are densely packed. The results of potentiodynamic polarization and the impedance show that modified surfaces have better performance than bare metal surfaces which could be applied to increase the life time and reliability of conditioner during W CMP.

• Journal of the korean academy of Pediatric Dentistry
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• v.50 no.1
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• pp.65-74
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• 2023

This study compared the surface roughness and microbial adhesion characteristics of Omnichroma, a novel composite resin developed using "smart chromatic technology", with those of two other conventional composite resins with different filler compositions. A total of 144 specimens were fabricated using 3 types of composite resins: Omnichroma (nano-spherical), Filtek Z350XT (nanofill), and Tetric N-Ceram (nanohybrid) and, divided into 3 groups of 48. Finishing was performed using tungsten carbide burs. Specimens were then divided into 3 subgroups using different polishing methods: Control, SofLex, and PoGo. Surface roughness was analyzed quantitatively and qualitatively using an atomic force microscope and a scanning electron microscope. Microbial adhesion was assessed by culturing Streptococcus mutans on the specimens for 24 hours and then measuring colony-forming units attached to the upper surface. The surface roughness (Ra) of Omnichroma was 0.123 ㎛ after finishing, and it exhibited a smooth surface compared to the other resins. However, after polishing, there were no significant differences in the surface roughness between the three composite groups, regardless of the polishing methods. The surfaces of the Control subgroups were significantly rougher than those of the SofLex subgroups in all 3 composite groups. However, except for Tetric N-Ceram, there were no significant differences between the Control and PoGo subgroups in the other composite groups. Microbial adhesion assessment showed no significant differences between any of the 3 composite resin subgroups; however, Omnichroma exhibited higher microbial adhesion than the other two composites. No significant correlation was observed between surface roughness and microbial adhesion.