Electrochemical Characterization of Anti-Corrosion Film Coated Metal Conditioner Surfaces for Tungsten CMP Applications |
Cho, Byoung-Jun
(Department of Bio-Nano Technology, Hanyang University)
Kwon, Tae-Young (Department of Materials Engineering, Hanyang University) Kim, Hyuk-Min (Department of Bio-Nano Technology, Hanyang University) Venkatesh, Prasanna (Department of Materials Engineering, Hanyang University) Park, Moon-Seok (Shinhan Diamond Industrial Co., Ltd.) Park, Jin-Goo (Department of Bio-Nano Technology, Hanyang University) |
1 | R. Jairath, M. Desai, M. Stell, R. Tolles, D. Scheber-Brewer, "Consumables for the Chemical Mechanical Polishing (CMP) of Dielectrics and Conductors", Mater. Res. Soc. Symp. Proc. 337, pp.121, San Francisco, CA, USA (1994). |
2 | K. C. Kim, Y. J. Kang, Y. S. Yu, J. G. Park, Y. M. Won and K. H. Oh, "The Pad Recovery as a function of Diamond Shape on Diamond Disk for Metal CMP", J. Microelectron. Packag. Soc., 13(3), 47 (2006). |
3 | F. B. Kaufmann, D. B. Thompson, R. E. Broadie, M. A. Jaso, W. L. Guthrie, D. J. Person and M. Small, "Chemical- Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects". J. Electrochem. Soc., 123(11), 3460 (1991). |
4 | C. M. Coetsier, F. Testa, E. Carretier, M. Ennahali, B. Laborie, C. Mouton-arnaud, O. Fluchere and P. Moulin, "Static dissolution rate of tungsten film versus chemical adjustments of a reused slurry for chemical mechanical polishing", Applied Surface Science, 257, 6163 (2011). DOI |
5 | Y. J. Kang, D. H. Eom, J. Y. Park, J. G. Park, B. Y. Myoung, S. I. Lee and P. K. Kwon, "The Conditioning Behaviors of Diamond CVD Deposited Ceramic CMP Conditioner", Proc. the Int'l Microelectron. Packag. Soc. Conf., pp.270, Coex, Seoul (2002). |
6 | Y. S. Ji, S. M. Kang and I. S. Choi, "Surface Engineering Based on Self-Assembled Monolayers", Polymer Science and Tech. 17(2), 172 (2006). |
7 | B. J. Hooper, G. Byrne, S. Galligan and S. Galligan, "Pad conditioning in chemical mechanical polishing", J. Mater. Process. Technol., 123, 107 (2002). DOI |
8 | Y. Matsumoto and M. Ishida, "The property of plasma-polymerized fluorocarbon film in relation to CH4/C4H8 ratio and substrate temperature", Sens. Actuators, A, 83, 179 (2000). DOI |
9 | D. C. Kim, "Evaluation and Development of contamination free hydrophobic conditioner", in Master Thesis, Hanyang University, Ansan (2010). |
10 | P. B. Zantye, A. Kumar and A. K. Sikder, "Chemical mechanical planarization for microelectronics applications", Mater. Sci. Eng., R, 45, 89 (2004). DOI |
11 | S. Pennington, S. Luce, "Improved Process Latitude with Chemical-Mechanical Polishing", VMIC 9th Conf., Proc., pp.168, Santa Clara, CA, USA (1992). |