• 제목/요약/키워드: Mo electrode

검색결과 236건 처리시간 0.031초

RF 스퍼터법을 이용한 Sr2FeMoO6 박막 제조 및 전기전도 특성 (Preparation of Sr2FeMoO6 Thin Films by RF Magnetron Sputtering and Their Electrical Conduction Properties)

  • 유희욱;선호정
    • 한국전기전자재료학회논문지
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    • 제23권12호
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    • pp.966-972
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    • 2010
  • Single-phase $Sr_2FeMoO_6$ thin films were produced by RF magnetron sputtering for use as electrodes in integrated sensors and found to be good conductors at room temperature. The films were deposited from a powder-type sputtering target under various conditions, and were crystallized by annealing. Elimination of $O_2$ gas during deposition, by the use of a solely Ar sputtering gas under a working pressure as low as possible, and vacuum annealing were important to promote the $Sr_2FeMoO_6$ phase. However, oxygen exclusion from sputtering and annealing was not enough to yield single-phase $Sr_2FeMoO_6$: hydrogen annealing was also required. Film production was optimized by varying the deposition parameters and hydrogen annealing conditions. The film had good electrical conduction, with a low resistivity of $1.6{\times}10^{-2}\Omega{\cdot}cm$ at room temperature.

열적으로 강인한 Molybdenium 게이트-PMOS Capacitor의 분석 (Analysis of PMOS Capacitor with Thermally Robust Molybdenium Gate)

  • 이정민;서현상;홍신남
    • 한국전기전자재료학회논문지
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    • 제18권7호
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    • pp.594-599
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    • 2005
  • In this paper, we report the properties of Mo metal employed as PMOS gate electrode. Mo on $SiO_2$ was observed to be stable up to $900^{\circ}C$ by analyzing the Interface with XRD. C-V measurement was performed on the fabricated MOS capacitor with Mo Bate on $SiO_2$. The stability of EOT and work-function was verified by comparing the C-V curves measured before and after annealing at 600, 700, 800, and $900^{\circ}C$. C-V hysteresis curve was performed to identify the effect of fired charge. Gate-injection and substrate-injection of carrier were performed to study the characteristics of $Mo-SiO_2$ and $SiO_2-Si$ interface. Sheet resistance of Mo metal gate obtained from 4-point probe was less than $10\;\Omega\Box$ that was much lower than that of polysilicon.

A New Way to Prepare MoO3/C as Anode of Lithium ion Battery for Enhancing the Electrochemical Performance at Room Temperature

  • Yu, Zhian;Jiang, Hongying;Gu, Dawei;Li, Jishu;Wang, Lei;Shen, Linjiang
    • Journal of Electrochemical Science and Technology
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    • 제7권2호
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    • pp.170-178
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    • 2016
  • Composited molybdenum oxide and amorphous carbon (MoO3/C) as anode material for lithium ion batteries has been successfully synthesized by calcining polyaniline (PANI) doped with ammonium heptamolybdate tetrahydrate (AMo). The as prepared electrode material was characterized by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR) and field emission scanning electron microscopy (FE-SEM). The electrochemical performance of the anode was investigated by galvanostatic charge/discharge, cyclic voltammetry (CV), and electrochemical impedance spectroscopy (EIS). The MoO3/C shows higher specific capacity, better cyclic performance and rate performance than pristine MoO3 at room temperature. The electrochemical of MoO3/C properties at various temperatures were also investigated. At elevated temperature, MoO3/C exhibited higher specific capacity but suffered rapidly declines. While at low temperature, the electrochemical performance was mainly limited by the low kinetics of lithium ion diffusion and the high charge transfer resistance.

박막태양전지 하부전극용 Mo 박막특성 연구 (A Study on properties of Lower Electrode thin films solar cell for Mo thin film)

  • 양현훈;김영준;정운조;박계춘
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.321-322
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    • 2007
  • In order to increase the cost effectiveness of solar cells, module production should be treated more comprehensively. Back contact cells offer distinct advantage in the interconnection of cells to modules. Thereby Mo thin film were prepared in order to clarify optimum conditions for growth of the thin film depending upon process, and then by changing a number of deposition conditions and substrate temperature conditions variously, structural and electrical characteristics were measured. For the manufacture of the Mo were vapor-deposited in the named order. Among them, Mo were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC power was controlled so that the composition of Mo, while the surface temperature having an effect on the quality of the thin film was changed from R.T$[^{\circ}C]$ to $200[^{\circ}C]$ at intervals of $50[^{\circ}C]$. Micro-structural studies were carried out by XRD (D/MAX-1200, Rigaku Co.) and SEM (JSM-5400, Jeol Co.). Electrical properties were measured by CMT-SR3000 Measurement System.

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DLC Emitter 전기적 특성 (Electric properties of DLC Emitter)

  • 이상헌
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2009년도 제40회 하계학술대회
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    • pp.1312_1313
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    • 2009
  • In this study the fabrication technique of the planner field emission device structure with a DLC layer were studied. The bottom Mo electrode using electrochemical method on the DLC layer deposited using assist sputtering.

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DC 마그네트론 스퍼터링 방법에 의해 증착된 Mo 박막의 특성 (Characteristics of Mo Thin Films Deposited by DC Magnetron Sputtering)

  • 공선미;소우빈;김은호;정지원
    • Korean Chemical Engineering Research
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    • 제49권2호
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    • pp.195-199
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    • 2011
  • DC 마그네트론 스퍼터링 방법을 이용하여 soda lime glass 위에 Mo 박막을 증착하였다. DC power와 증착 압력을 변화시키면서 상온에서 Mo 박막을 증착하였고 증착된 박막의 전기적 성질 및 구조적 성질을 조사하였다. DC power가 증가할수록 박막의 증착속도는 증가되었고 전기 저항도는 감소하였으며 박막의 결정성이 향상되는 것을 관찰할 수 있었다. 증착 압력이 감소할수록 박막의 증착속도와 전기 저항도가 감소하였으며 가늘고 긴 모양의 결정입자가 조밀하게 박막을 형성하였다. 압력이 증가함에 따라서 결정입자는 원형으로 변형되었으며 박막의 표면에 공극의 생성이 증가하였다. Mo 박막의 전기 저항도는 Mo 원자에 결합된 산소의 양이 많아질수록 증가하게 되고, 박막의 결정성이 높아지면 산소의 결합도가 감소하여 낮은 저항도를 갖게 되는 것을 확인하였다.

비진공법 CuInSe2 태양전지에서 MoSe2의 생성을 억제하기 위한 산화 몰리브데늄 확산장벽 층 (Molybdenum Oxides as Diffusion Barrier Layers against MoSe2 Formation in A Nonvacuum Process for CuInSe2 Solar Cells)

  • 이병석;이도권
    • Current Photovoltaic Research
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    • 제3권3호
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    • pp.85-90
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    • 2015
  • Two-step processes for preparing $Cu(In,Ga)Se_2$ absorber layers consist of precursor layer formation and subsequent annealing in a Se-containing atmosphere. Among the various deposition methods for precursor layer, the nonvacuum (wet) processes have been spotlighted as alternatives to vacuum-based methods due to their potential to realize low-cost, scalable PV devices. However, due to its porous nature, the precursor layer deposited on Mo substrate by nonvacuum methods often suffers from thick $MoSe_2$ formation during selenization under a high Se vapor pressure. On the contrary, selenization under a low Se pressure to avoid $MoSe_2$ formation typically leads to low crystal quality of absorber films. Although TiN has been reported as a diffusion barrier against Se, the additional sputtering to deposit TiN layer may induce the complexity of fabrication process and nullify the advantages of nonvacuum deposition of absorber film. In this work, Mo oxide layers via thermal oxidation of Mo substrate have been explored as an alternative diffusion barrier. The morphology and phase evolution was examined as a function of oxidation temperature. The resulting Mo/Mo oxides double layers were employed as a back contact electrode for $CuInSe_2$ solar cells and were found to effectively suppress the formation of $MoSe_2$ layer.

Mo 하지층의 첨가원소(Ti) 농도에 따른 Cu 박막의 특성 (Characteristic of Copper Films on Molybdenum Substrate by Addition of Titanium in an Advanced Metallization Process)

  • 홍태기;이재갑
    • 한국재료학회지
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    • 제17권9호
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    • pp.484-488
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    • 2007
  • Mo(Ti) alloy and pure Cu thin films were subsequently deposited on $SiO_2-coated$ Si wafers, resulting in $Cu/Mo(Ti)/SiO_2$ structures. The multi-structures have been annealed in vacuum at $100-600^{\circ}C$ for 30 min to investigate the outdiffusion of Ti to Cu surface. Annealing at high temperature allowed the outdiffusion of Ti from the Mo(Ti) alloy underlayer to the Cu surface and then forming $TiO_2$ on the surface, which protected the Cu surface against $SiH_4+NH_3$ plasma during the deposition of $Si_3N_4$ on Cu. The formation of $TiO_2$ layer on the Cu surface was a strong function of annealing temperature and Ti concentration in Mo(Ti) underlayer. Significant outdiffusion of Ti started to occur at $400^{\circ}C$ when the Ti concentration in Mo(Ti) alloy was higher than 60 at.%. This resulted in the formation of $TiO_2/Cu/Mo(Ti)\;alloy/SiO_2$ structures. We have employed the as-deposited Cu/Mo(Ti) alloy and the $500^{\circ}C-annealed$ Cu/Mo(Ti) alloy as gate electrodes to fabricate TFT devices, and then measured the electrical characteristics. The $500^{\circ}C$ annealed Cu/Mo($Ti{\geq}60at.%$) gate electrode TFT showed the excellent electrical characteristics ($mobility\;=\;0.488\;-\;0.505\;cm^2/Vs$, on/off $ratio\;=\;2{\times}10^5-1.85{\times}10^6$, subthreshold = 0.733.1.13 V/decade), indicating that the use of Ti-rich($Ti{\geq}60at.%$) alloy underlayer effectively passivated the Cu surface as a result of the formation of $TiO_2$ on the Cu grain boundaries.