• 반도체디스플레이기술학회지
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• 제12권4호
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• pp.39-44
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• 2013

In the semiconductor heat-treatment process, the temperature uniformity determines the film quality of a wafer. This film quality effects on the overall yield rate. The heat transfer of the wafer surface in the heat-treatment process equipment is occurred by convection and radiation complexly. Because of this, there is the nonlinearity between the wafer temperature and reactor. Therefore, the accurate prediction of temperature on the wafer surface is difficult without the direct measurement. The thermal camera and the T/C wafer are general ways to confirm the temperature uniformity on the heat-treatment process. As above ways have limit to measure the temperature in the precise domain under the micro-scale. In this study, we developed the thin film type temperature sensor using the MEMS technology to establish the system which can measure the temperature under the micro-scale. We combined the experiment and numerical analysis to verify and calibrate the system. Finally, we measured the temperature on the wafer surface on the semiconductor process using the developed system, and confirmed the temperature variation by comparison with the commercial T/C wafer.

• 대한기계학회논문집A
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• 제29권7호
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• pp.998-1004
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• 2005

A nano-stereolithography (NSL) process has been developed for fabrication of 3D shell structures which can be applied to various nano/micro-fluidic devices. By the process, a complicated 3D shell structure on a scale of several microns can be fabricated using lamination of layers with a resolution of 150 nm in size, so it does not require the use of my sacrificial layer or any supporting structure. A layer was fabricated by means of solidifying liquid-state monomers using two-photon absorption (TPA) induced using a femtosecond laser processing. When the polymerization process is finished, unsolidified liquid state resins can be removed easily by dropping several droplets of ethanol fur developing the fabricated structure. Through this work, some 3D shell structures, which can be applied to various applications such as nano/micro-fluidic devices and MEMS system, were fabricated using the developed process.

• 한국기계가공학회지
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• 제20권9호
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• pp.104-109
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• 2021

Tactile sensors and integrated circuits that detect external stimuli have been developed for use in various industries. Most tactile sensors have been developed using the MEMS(micro electro-mechanical systems) process in which metal electrodes and strain sensors are applied to a silicon substrate. However, tactile sensors made of highly brittle silicon lack flexibility and are prone to damage by external forces. Flexible tactile sensors based on polydimethylsiloxane and using a multi-walled carbon nano-tube mixture as a pressure-sensitive material are currently being developed as an alternative to overcome these limitations. In this study, a manufacturing process of pressure-sensitive materials with low initial electrical resistance is developed and applied to the fabrication of flexible tactile sensors. In addition, flexible tactile sensors are developed with pressure-sensitive materials dispensed on a substrate with flexible mechanical properties. Finally, a study is conducted on the change in electrical resistance of pressure-sensitive materials according to the modulus of elasticity of the substrate.

• 한국정밀공학회지
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• 제22권12호
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• pp.184-189
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• 2005

An experimental study of the femtosecond laser machining of Si materials was carried out. Direct laser machining of the materials for the feature size of a few micron scale has the advantage of low cost and simple process comparing to the semiconductor process, E-beam lithography, ECM and other machining process. Further, the femtosecond laser is the better tool to machine the micro parts due to its characteristics of minimizing the heat affected zone(HAZ). As a result of line cutting of Si, the optimal condition had the region of the effective energy of 2mJ/mm-2.5mJ/mm with the power of 0.5mW-1.5mW. The polarization effects of the incident beam existed in the machining qualities, therefore the sample motion should be perpendicular to the projection of the electric vector. We also observed the periodic ripple patterns which come out in condition of the pulse overlap with the threshold energy. Finally, we could machined the groove with the linewidth of below $2{\mu}m$ for the application of MEMS device repairing, scribing and arbitrary patterning.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1194-1197
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• 2005

Micro nozzle is employed as a dynamic passive valve in micro fluidic devices. Micro nozzle array is used in micro droplet generation in bio-medical applications and propulsion device for actuating satellite and aerospace ship in vacuum environments. Aperture angle and the channel length of the micro nozzle affect its retification efficiency, and thus it is needed to produce micro nozzle precisely. MEMS process has a limit on making a micro nozzle with high-aspect ratio. Reactive ion etching process can make high-aspect ratio structure, but it is difficult to make the complex shape. Focused ion beam deposition has advantage in machining of three-dimensional complex structures of sub-micron size. Moreover, it is possible to monitor machining process and to correct defected part at simultaneously. In this study, focused ion beam deposition was applied to micro nozzle production.

• 대한기계학회논문집B
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• 제33권10호
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• pp.803-810
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• 2009

Micromirrors have a wide range of applications such as optical switches, laser scanners, and digital projection displays. Due to their low performances and high costs, however, practical applications of micromirrors are quite limited. At present micromirrors demand not only a better design but also a simple fabrication process. In this study a twisting-type micromirror that can be driven by two thermal bimorph actuators bending in opposite directions is designed from electro-thermo-mechanical theories and fabricated through a simple MEMS process. Each actuator consists of $SiO_2$ and gold thin-film layers. Simplified analytical model has been built to optimize the performance of micromirror. Due to unexpected resistance increase of metal film and alignment mismatch during fabrication process, experimental rotation angles of micromirrors are about $11^{\circ}$ at applied voltages less than 0.6V. From numerical simulation and analytical studies, however, the next design can provide rotation angles over $20^{\circ}$ at the same applied voltage.

• 한국전기전자재료학회논문지
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• 제15권11호
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• pp.958-962
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• 2002

This paper reports on the fabrication of free-standing microstructures by DRIE (deep reactive ion etching). SOI (Si-on-insulator) structures with buried cavities are fabricated by SDB (Si-wafer direct bonding) technology and electrochemical etch-stop. The cavity was formed the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the formed cavity under vacuum condition at -760 mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing (100$0^{\circ}C$, 60 min.), the SDB SOI structure with a accurate thickness and a good roughness was thinned by electrochemical etch-stop in TMAH solution. Finally, it was fabricated free-standing microstructures by DRIE. This result indicates that the fabrication technology of free-standing microstructures by combination SDB, electrochemical etch-stop and DRIE provides a powerful and versatile alternative process for high-performance bulk micromachining in MEMS fields.

• 정보저장시스템학회논문집
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• 제2권3호
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• pp.163-168
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• 2006

Small form factor optical pickup (SFFOP) corresponding to BD specifications is strongly proposed for the next-generation portable storage device. In order to generate SFFOP, small sized optical pickup has been fabricated. We have developed a small sited optical pickup that is called the integrated optical pickup (IOP). The fabrication method of this system is mainly dependant on the use of the wafer based micro fabrication technology, which has been used in MEMS process such as photolithography, reactive ion etching, wafer bonding, and packaging process. This approach has the merits for mass production and high assembling accuracy. In this study, to generate the small sized optical pickup for high recording capacity, IOP corresponding to BD specifications has been designed and developed, including three main parts, 1) design, fabrication and evaluation of objective lens unit, 2) design and fabrication of IOP and 3) evaluation process of FES and TES.

• 한국전기전자재료학회논문지
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• 제17권7호
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• pp.724-728
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• 2004

This paper describes on RIE(Reactive Ion Etching) characteristics of 3C-SiC(Silicon Carbide) grown on Si(100) wafers. In this work, CHF$_3$ gas was used to form the polymer as a function of a side-wall for excellent anisotropy etching during the RIE process. The ranges of the etch rate were obtained from 60 $\AA$/min to 980 $\AA$/min according to the conditions such as working gas pressure, RF power, distance between electrodes and the $O_2$ addition ratio in working gas pressure. Under the condition such as 100 mTorr of working gas pressure, 200 W of RF power and 30 mm of the distance between electrodes, mesa structures with about 40 of the etch angle were formed, and the vertical structures could be improved with 50 % of $O_2$ addition ratio in reactive gas during the RIE process. As a result of the investigation, we know that it is possible to apply the RIE process of 3C-SiC using CHF$_3$ for the development of electronic parts and MEMS applications in harsh environments.

• 센서학회지
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• 제19권3호
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• pp.209-213
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• 2010

This paper describes the fabrication and characteristics of AlN piezoelectric MPG(micro power generator). The micro energy harvester was fabricated to convert ambient vibration energy to electrical power as a AlN piezoelectric cantilever with Si proof-mass. To be compatible with CMOS process, AlN thin film was grown at low temperature by RF magnetron sputtering and micro power generators were fabricated by MEMS technologies. X-ray diffraction pattern proved that the grown AlN film had highly(002) orientation with low value of FWHM(full width at the half maximum, $\theta=0.276^{\circ}$) in the rocking curve around(002) reflections. The implemented harvester showed the $198.5\;{\mu}m$ highest membrane displacement and generated 6.4 nW of electrical power to $80\;k{\Omega}$ resistive load with $22.6\;mV_{rms}$ voltage from 1.0 G acceleration at its resonant frequency of 389 Hz. From these results, the AlN piezoelectric MPG will be possible to suitable with the batch process and confirm the possibility for power supply in portable, mobile and wearable microsystems.