• Journal of IKEEE
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• v.16 no.2
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• pp.102-108
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• 2012

3-dimensional integrated circuits (3D-ICs) have some problems for power delivery network design due to larger supply currents and larger power delivery paths compared to 2D-IC. The power delivery network consists of power bumps & through-silicon-vias (TSVs), and IR-drop at each node varies with the number and location of power bumps & TSVs. It is important to optimize the power bumps & TSVs while IR-drop constraint is satisfied in order to operate chip ordinarily. In this paper, the power bumps & TSVs optimization with optimized power mesh structure for power delivery network in 3D-ICs is proposed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.5
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• pp.66-76
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• 2000

This paper describes design and implementation of caption-processing ASIC(Application Specific Integrated Circuits) for OSD(On Screen Display) of karaoke system. The OSD of conventional karaoke system was implemented by a general purpose DSP, however this paper suggest a design to save hardware resources. The ASIC receives commands and data of graphic and caption from host processor, and then modifies the data to have various graphic effects. The design has been done by schematic and VHDL coding. The design was verified by logic simulation and FPGA emulation on the real system. The chip was fabricated with 0.8${\mu}{\textrm}{m}$ CMOS SOG, and worked properly at the karaoke system.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1105-1111
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• 2006

In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.2
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• pp.189-194
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• 2018

Nowadays most integrated circuits are built using the bulk CMOS technology, but it has much difficulty in further reduction of the power consumption and die size. As a super low-power technology to solve such problems, the SOI technology attracts great attention recently. In this paper, the study results of the temperature dependency of the hot carrier effects in the n-channel MOSFETs fabricated on the thin SOI substrate were discussed. In spite that the devices employed the LDD structure, the hot carrier effects were more serious than expected due to the high series resistance between the channel region and the substrate contact to the ground, and were found to be less serious for the higher temperature with the more phonon scattering in the channel region, which resulted in reducing the hot electron generation.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.2
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• pp.512-516
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• 2005

Home-Network is an integrated network of the PC and all electric home appliances in the home so that they can communicate with each other. In the 21th century, here are various technology for home Network environment such as HomePNA, IEEE1394, Ethernet Lan and Bluetooth. For Home Network construction, generally, the standard series interface 'RS232' is used to make communication possible between electric home appliances. However Home network using RS232 has a problem. That is, All machines have to be connected to each other with RS232 using Point-to-Point mode. In this case, the system becomes complicated because we have to use circuits as much as there are machines and increased expenses. To improve this problem, In this thesis, designed home network using RS422 Multi-drop mode serial communication and controled it with embedded linux system. And connected RS422 with motors and sensors using PIC to make the home network virtual environment.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.5
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• pp.1103-1108
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• 2010

In this paper, Frequency Synthesizer which is widely used for FH-SS system is proposed and the experimental results are analyzed. The performance of the DPLL(Digital Phase-Locked-Loop), which is the main part of the Synthesizer is analyzed by the computer program. Using Maxplus-II tool provided by altera. co., ltd, each part of the DPLL is designed and all of them is integrated into EPM7064SLC44-10 chip. And the simulation results are compared with the characteristics of the implemented circuits for analysis. And the experiential results show that the N value of the loop filter is toggled to adjacent N value, which result in phase jitter of the output. It can be resolved by increasing DCO(Digital Controlled oscillator) clock rate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.171-175
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion - usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder tripe conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usual1y scraped. Figure 1 shows the typical shape of scratch damaged from diamond. We suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning, so new designed Flat stripper was introduced.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.12
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• pp.1122-1127
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• 1998

Group II-AF_2$films such as $CaF_2$, $SrF_2$, and $BaF_2$ have been commonly used many practical applications such as silicon on insulatro(SOI), three-dimensional integrated circuits, buffer layers, and gate dielectrics in filed effect transistor. This paper presents electrical and structural properties of fluoride films as a gate dielectric layer. Conventional gate dielectric materials of TFTs like oxide group exhibited problems on high interface trap charge density($D_it$), and interface state incorporation with O-H bond created by mobile hydrogen and oxygen atoms. To overcome such problems in conventional gate insulators, we have investigated $CaF_2$ films on Si substrates. Fluoride films were deposited using a high vacuum evaporation method on the Si and glass substrate. $CaF_2$ films were preferentially grown in (200) plane direction at room temperature. We were able to achieve a minimum lattice mismatch of 0.74% between Si and $CaF_2$ films. Average roughness of $CaF_2$ films was decreased from 54.1 ${\AA}$ to 8.40 ${\AA}$ as temperature increased form RT and $300^{\circ}C$. Well fabricated MIM device showed breakdown electric field of 1.27 MV/cm and low leakage current of $10^{-10}$ A/$cm^2$. Interface trap charge density between $CaF_2$ film and Si substrate was as low as $1.8{\times}10^{11}cm^{-2}eV^{-1}$.

• Journal of Practical Engineering Education
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• v.8 no.2
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• pp.83-89
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• 2016

Flip-learning enables an effective teaching and learning in accordance with the deepening degree of engineering education as a framework that enables learning according to the individual differences of the theoretical aspects, and solving real problems and practice of the learner-centered education through the application of this. The subject of basic fluid power practice which is used in various industries requiring factory automation aims at understanding of the composition and operating principles of pneumatic components and programming of electric sequential circuits, building the design ability of pneumatic system. This subject goes by 3 hour classes with theory and practice side by side. So it has not enough time to instruct students various contents related in this subject. In this study, the instructional design was performed according to the KOREATECH (Korea University of Technology and Education) flip-learning basic model for the effective teaching of 'Basic Fluid Power Practice' in basic engineering practice courses,. And the effectiveness of flip-learning is analyzed through the students survey after performing classes.

• Smart Media Journal
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• v.6 no.2
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• pp.26-32
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• 2017

In this paper, we implement a signal-detecting electric circuit based LED lighting control system which is essential in NUI technology using EPIC converting surrounding earth electric field disturbance signals to electric potential signals. We used signal-detecting electric circuits which was developed to extract individual signal for each EPIC sensor while conventional EPIC-based development equipments provide limited forms of signals. The signals extracted from our developed circuit contributed to better performance as well as flexiblity in processes of feature extracting stage and pattern recognition stage. We designed a system which can control the brightness and on/off of LED lights with four hand gestures in order to justify its applicability to real application systems. We obtained faster pattern classification speed not only by developing an instruction system, but also by using interface control signals.