Browse > Article

A Very Compact 60 GHz LTCC Power Amplifier Module  

Lee, Young-Chul (Division of Marine Electronics and Communication Eng., MMU)
Publication Information
The Journal of Korean Institute of Electromagnetic Engineering and Science / v.17, no.11, 2006 , pp. 1105-1111 More about this Journal
Abstract
In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.
Keywords
Power Amplifier Module; SiP(System-in-Package); LTCC(Low-Temperature Co-fired Ceramic); Wire-Bonding;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Athanasios et al., 'IST project: broadway-the way to broadband access at 60 GHz', Proceedings of Personal Wireless Communications, pp. 219-221, 2003
2 Charles Q. Scrantom, 'LTCC technology: where we are and where we're going-II', 1999 IEEE MTT-s Symposium on Technologies for Wireless Applications Digest, pp. 193-200, 1999
3 CST MICROWAVE STUDIO, CST Inc., [Online] Available
4 Nirod K. Das, 'Methods of suppression or avoidance of parallel-plate power leakage from conductor-backed transmission lines', IEEE Trans. on Microwave Theory and Techniques, vol. 44, no. 2, pp. 169-181, 1996   DOI   ScienceOn
5 I. J. Bahl et al., Microstrip Antennas, Artech House, 1982
6 이영철, '밀리미터파 SiP 응용을 위한 기생 공진모드 억제', 대한전자파학회논문지, 17(9), pp. 883-889, 2006년 9월   과학기술학회마을
7 Atsushi Yamada et al., '60 GHz ultra compact transmitter/receiver with a low phase noise PLLoscillator', IEEE MTT-S Int. Microwave Symposium Digest, pp. 2035-2038, 2003
8 David M. Pozar, Microwave Engineering, John Wiley & Sons, 1998
9 C. Bornholdt et al., '60 GHz millimeter-wave broadband wireless access demonstrator for the next-generation mobile internet', Optical Fiber Communication Conference, pp. 148-149, 2002
10 S. Yun, H. Lee, 'Parasitic impedance analysis of double bonding wires for high-frequency integrated circuit packaging', IEEE Microwave and Guided Wave Letters, vol. 5, pp. 296-298, 1995   DOI   ScienceOn
11 T. Krems et al., 'Millmeter-wave performance of chip interconnections using wire bonding and flip chip', IEEE MTT-S Int. Microwave Symposium Digest, pp. 247-250, 1996
12 A. Panther, C. Glaser, M. G. Stubbs, and J. S. Wight, 'Vertical transitions in low temperature co-fired ceramics for LMDS applications', IEEE MTT-S Int. Microwave Symposium Digest, vol. 3, pp. 1907-1910, 2001
13 T. P. Budka, 'Wide-bandwidth millimeter-wave bond-wire interconnects', IEEE Trans. on Microwave Theory and Techniques, vol. 49, no. 4, pp. 715-718, 2001   DOI   ScienceOn
14 Keiichi Ohata et al., '1.25 Gbps wirelss gigabit ethernet link at 60 GHz-Band', IEEE MTT-S Int. Microwave Symposium Digest, pp. 373-376, 2003
15 F. Alimenti, P. Mezzanotte, L. Roselli, and R. Sorrentino, 'Modeling and characterization of the bonding-wire interconnection', IEEE Trans. on Microwave Theory and Techniques, vol. 49, no. 1, pp. 142-150, 2001   DOI   ScienceOn
16 William H. Haydl, 'On the use of vias in conductor-backed coplanar circuits', IEEE Trans. on Microwave Theory and Techniques, vol. 50, no. 6, pp. 1571-1577, 2002   DOI   ScienceOn
17 F. J. Schmuckle et al., 'LTCC as MCM substrate: design of strip-Line structures and flip-chip interconnections', IEEE MTT-S Int. Microwave Symposium Digest, vol. 3, pp. 1093-1096, 2001
18 T. Krems et al., 'Avoiding cross talk and feedback effects in packaging coplanar millimeter-wave circuits', IEEE MTT-S Int. Microwave Symposium Digest, pp. 1091-1094, 1998
19 김봉수, 김광선, 은기찬, 변우진, 송명선, '40GHz 대역 고정통신용 광대역 LTCC 수신기 모듈', 한국전자파학회논문지, 16(10), pp. 1050-1058, 2005년 10월   과학기술학회마을