• Journal of Genetic Medicine
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• v.13 no.1
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• pp.20-25
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• 2016

Purpose: Xeroderma pigmentosum (XP) is rare autosomal recessive genetic disorder of DNA repair in which the ability to repair damage caused by ultraviolet light is deficient. We reported the first molecularly confirmed Korean patient of XP by targeted exome sequencing. The prevalence of XP included all subtype and carrier frequency of XP-A the using public data were estimated for the first time in South Korea. Materials and Methods: We described a 4-year-old Korean girl with clinical diagnosis of XP. We performed targeted exome sequencing in the patient for genetic confirmation considering disease genetic heterogeneity and for differential diagnosis. We verified a carrier frequency of c.390-1G>C in XPA gene known as mutational hot spot using Korean Reference Genome Data Base. We estimated the period prevalence of all subtypes of XP based on claims data of the Health Insurance Review and Assessment Service in South Korea. Results: We identified homozygous splicing mutation of XPA (c.390-1G>C) in the patient. The carrier frequency of risk for XPA (c.390-1G>C) was relatively high 1.608 e-03 (allele count 2/1244). The prevalence of XP in South Korea was 0.3 per million people. Conclusion: We expect that c.390-1G>C is hot spot for the mutation of XPA and possible founder variant in South Korea. However, the prevalence in South Korea was extremely low compared with Western countries and Japan.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.273-280
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• 2002

The stochiometric mix of evaporating materials for the CuGaTe$_2$ single crystal thin films was prepared from horizontal furnance. For extrapolation method of X-ray diffraction patterns for the CuGaTe$_2$ polycrystal, it was found tetragonal structure whose lattice constant a$\_$0/ and c$\_$0/ were 6.025 ${\AA}$ and 11.931 ${\AA}$, respectively. To obtain the single crystal thin films, CuGaTe$_2$ mixed crystal was deposited on throughly etched semi-insulator GaAs(100) substrate by the Hot Wall Epitaxy (HWE) system. The source and substrate temperature were 670 $^{\circ}C$ and 410 $^{\circ}C$ respective1y, and the thickness of the single crystal thin films is 2.1 $\mu\textrm{m}$. The crystalline structure of single crystalthin films was investigated by the photoluminescence and double crystal X-ray diffraction (DCXD). Hall effect on this sample was measured by the method of van der Pauw and studied on carrier density and mobility dependence on temperature. The carrier density and mobility of CuGaTe$_2$ single crystal thin films deduced from Hall data are 8.72${\times}$10$\^$23/㎥, 3.42${\times}$10$\^$-2/㎡/V$.$s at 293K, respectively. From the photocurrent spectrum by illumination of perpendicular light on the c - axis of the CuGaTe$_2$ single crystal thin film, we have found that the values of spin orbit coupling Δs.o and the crystal field splitting Δcr were 0.0791 eV and 0/2463eV at 10K, respectively. From the PL spectra at 10K, the peaks corresponding to free bound excitons and D-A pair and a broad emission band due to SA is identified. The binding energy of the free excitons are determined to be 0.0470eV and the dissipation energy of the donor -bound exciton and acceptor-bound exciton to be 0.0490eV, 0.00558eV, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2009.08a
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• pp.397-397
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• 2009

• Special Issue of the Society of Naval Architects of Korea
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• 2007.09a
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• pp.89-93
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• 2007

The Boil-off gas (BOG) generation during the voyage is inevitable since Natural Gas (NG) in normally liquefied below -160 degree C in atmosphere condition and small heat ingress due to relatively hot outside keeps evaporating continuously. The one of major issue in LNG carriers is to handle generated BOG from cargo tank. The generated BOG affects to increase the cargo tank pressure and Gas Management System (GMS) for LNG carriers is closely related to cargo tank pressure maintenance. Economically, BOG is generally used as fuel in LNG carrier. Newly developed GMS for LNG carrier in boiler propulsion system, VaCo System, not only accomplish automatic control in GMS but also ensure safer operation.

• Journal of the Korea Society for Simulation
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• v.22 no.4
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• pp.93-98
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• 2013

In this paper, the proposed shallow trench isolation structures for high threshold voltage for very large scale and ultra high voltage integrated circuits MOSFET were simulated. Physically based models of hot-carrier stress and dielectric enhanced field of thermal damage have been incorporated into a TCAD tool with the aim of investigating the electrical degradation in integrated devices over an extended range of stress biases and ambient temperatures. As a simulation results, shallow trench structure were intended to be electric functions of passive, as device dimensions shrink, the electrical characteristics influence of proposed STI structures on the transistor applications become stronger the potential difference electric field and saturation threshold voltage.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.3 s.345
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• pp.9-14
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• 2006

The dependence of NBTI lifetime on the BEOL processes such as sintering gas type and passivation layer has been characterized in depth. Then, optimized BEOL process scheme is proposed to improve NBTI lifetime. NBTI showed degradation due to the plasma enhanced nitride (PE-SiN) passivation film and $H_2$ sintering anneal. Then, new process scheme of $N_2$ annealing instead of $H_2$ annealing prior to PE-SiN deposition is proposed. The proposed BEOL process flow showed that NBTI lifetime can be improved a lot without degradation of device performance and NMOS hot carrier reliability.

• Journal of Sensor Science and Technology
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• v.31 no.1
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• pp.41-44
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• 2022

In this study, we have fabricated and characterized vertical double-gate (DG) InGaAs tunnel field-effect-transistors (TFETs) with Al₂O₃/HfO₂ = 1/5 nm bi-layer gate dielectric by employing a top-down approach. The device exhibited excellent characteristics including a minimum subthreshold swing of 60 mV/decade, a maximum transconductance of 141 µS/㎛, and an on/off current ratio of over 10³ at 20℃. Although the TFETs were fabricated using a dry etch-based top-down approach, the values of DIBL and hysteresis were as low as 40 mV/V and below 10 mV, respectively. By evaluating the effects of constant voltage and hot carrier injection stress on the vertical DG InGaAs TFET, we have identified the dominant charge trapping mechanism in TFETs.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.12
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• pp.60-68
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• 1993

Thw VLSI device of submicron level trends to have a low level of reliability because of hot carriers which are caused by short channel effects and which do not appear in a long-channel MOSFET operated in 5V. In order to minimize the generation of hot carrier, much research has been made into various types of drain structures. This study has suggested CG MOSFET (Concaved Gate MOSFET) as new drain structure and compared its electrical characteristics with those of the conventional MOSFET and LDD-structured MOSFET by making use of a simulation method. These three device were assumed to be produced by the LOCOS process and a computer-based analysis(PISCES-2B simulator) was carried out to verify the hot electron-resistant behaviours of the devices. In the present simulation, the channel length of these devises was 1.0$\mu$m and their DC characteristics, such as VS1DT-IS1DT curves, gate and substrate current, potential contours, breakdown voltage and electric field were compared with one another.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.431-435
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• 2010

In this paper, we investigated the dependence of device performance and hot carrier lifetime on the channel direction of PMOSFET. $I_{D.sat}$ vs. $I_{Off}$ characteristic of PMOSFET with <100> channel direction is greater than that with <110> channel direction because carrier mobility of <100> channel direction is greater than that of <110> channel direction. However, hot carrier lifetime for <110> channel direction is much lower than that with <110> channel due to the greater impact ionization rate in the <100> channel direction. Therefore, concurrent consideration of reliability characteristics and device performance is necessary for channel strain engineering of MOSFETs.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.58.2-58.2
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• 2010

본 연구에서는 n-type wafer에 비정질 실리콘을 증착한 이종접합 태양전지를 열처리 방법을 이용하여 열처리의 효과를 분석함으로써 이종접합 태양전지에 효율적인 열처리 효과에 대하여 연구하였다. P, N-layer는 PECVD(Plasma-enhanced chemical vapor deposition) I-layer는 HWCVD(Hot wire chemical vapor deposition), ITO는 RF 마그네트론 스퍼터링법으로 동일한 조건에서 제작하였고 rapid thermal process를 이용하여 진공 중에서 $150^{\circ}C$, $200^{\circ}C$, $220^{\circ}C$, $250^{\circ}C$까지 열처리를 하였다. 열처리 전과 후 QSSPC로 minority carrier life time, 자외 가시선 분광분석 장치로 투과 반사도를, Ellipsometer로 흡수 계수 등의 변화를 조사하였다. 열처리 후 Minority carrier life time, Voc 및 광변환 효율이 증가하였다.