• Title/Summary/Keyword: Flash memory cell

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Data Scrambling Scheme that Controls Code Density with Data Occurrence Frequency (데이터 출현 빈도를 이용하여 코드 밀도를 조절하는 데이터 스크램블링 기법)

  • Hyun, Choulseung;Jeong, Gwanil;You, Soowon;Lee, Donghee
    • KIPS Transactions on Computer and Communication Systems
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    • v.10 no.9
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    • pp.235-242
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    • 2021
  • Most data scrambling schemes generate pure random codes. Unlike these schemes, we propose a variable density scrambling scheme (VDSC) that differentiates densities of generated codes. First, we describe conditions and methods to translate plain codes to cipher codes with different densities. Then we apply the VDSC to flash memory such that preferred cell states occur more than others. To restrain error rate, specifically, the VDSC controls code densities so as to increase the ratio of center state among all possible cell states in flash memory. Scrambling experiments of data in Windows and Linux systems show that the VDSC increases the ratio of cells having near-center states in flash memory.

A Study on the Characteristics and Programming Conditions of the Scaled SONOSFET NVSM for Flash Memory (플래시메모리를 위한 Scaled SONOSFET NVSM의 프로그래밍 조건과 특성에 관한 연구)

  • 박희정;박승진;남동우;김병철;서광열
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.11
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    • pp.914-920
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    • 2000
  • When the charge-trap type SONOS(polysilicon-oxide-nitride-oxide-semiconductor) cells are used to flash memory, the tunneling program/erase condition to minimize the generation of interface traps was investigated. SONOSFET NVSM(Nonvolatile Semiconductor Memory) cells were fabricated using 0.35 ㎛ standard memory cell embedded logic process including the ONO cell process, based on retrograde twin-well, single-poly, single metal CMOS(Complementary Metal Oxide Semiconductor) process. The thickness of ONO triple-dielectric for the memory cell is tunnel oxide of 24 $\AA$, nitride of 74 $\AA$, blocking oxide of 25 $\AA$, respectively. The program mode(V$\_$g/=7, 8, 9 V, V$\_$s/=V$\_$d/=-3 V, V$\_$b/=floating) and the erase mode(V$\_$g/=-4, -5, -6 V, V$\_$s/=V$\_$d/=floating, V$\_$b/=3 V) by MFN(Modified Fowler-Nordheim) tunneling were used. The proposed programming condition for the flash memory of SONOSFET NVSM cells showed less degradation(ΔV$\_$th/, S, G$\_$m/) characteristics than channel MFN tunneling operation. Also, the program inhibit conditins of unselected cell for separated source lines NOR-type flash memory application were investigated. we demonstrated that the phenomenon of the program disturb did not occur at source/drain voltage of 1 V∼12 V and gate voltage of -8 V∼4 V.

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CPWL : Clock and Page Weight based Disk Buffer Management Policy for Flash Memory Systems

  • Kang, Byung Kook;Kwak, Jong Wook
    • Journal of the Korea Society of Computer and Information
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    • v.25 no.2
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    • pp.21-29
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    • 2020
  • The use of NAND flash memory is continuously increased with the demand of mobile data in the IT industry environment. However, the erase operations in flash memory require longer latency and higher power consumption, resulting in the limited lifetime for each cell. Therefore, frequent write/erase operations reduce the performance and the lifetime of the flash memory. In order to solve this problem, management techniques for improving the performance of flash based storage by reducing write and erase operations of flash memory with using disk buffers have been studied. In this paper, we propose a CPWL to minimized the number of write operations. It is a disk buffer management that separates read and write pages according to the characteristics of the buffer memory access patterns. This technique increases the lifespan of the flash memory and decreases an energy consumption by reducing the number of writes by arranging pages according to the characteristics of buffer memory access mode of requested pages.

EM Algorithm for Designing Soft-Decision Binary Error Correction Codes of MLC NAND Flash Memory (멀티 레벨 낸드 플래시 메모리용 연판정 복호를 수행하는 이진 ECC 설계를 위한 EM 알고리즘)

  • Kim, Sung-Rae;Shin, Dong-Joon
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.39A no.3
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    • pp.127-139
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    • 2014
  • In this paper, we present two signal processing techniques for designing binary error correction codes for Multi-Level Cell(MLC) NAND flash memory. MLC NAND flash memory saves the non-binary symbol at each cell and shows asymmetric channel LLR l-density which makes it difficult to design soft-decision binary error correction codes such as LDPC codes and Polar codes. Therefore, we apply density mirroring and EM algorithm for approximating the MLC NAND flash memory channel to the binary-input memoryless channel. The density mirroring processes channel LLRs to satisfy roughly all-zero codeword assumption, and then EM algorithm is applied to l-density after density mirroring for approximating it to mixture of symmetric Gaussian densities. These two signal processing techniques make it possible to use conventional code design algorithms, such as density evolution and EXIT chart, for MLC NAND flash memory channel.

Cell to Cell Interference Cancellation Algorithms in Multi level cell Flash memeory (MLC 플래시 메모리에서의 셀간 간섭 제거 알고리즘)

  • Jeon, Myeong-Woon;Kim, Kyung-Chul;Shin, Beom-Ju;Lee, Jung-Woo
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.12
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    • pp.8-16
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    • 2010
  • NAND multilevel cell (MLC) flash memory is widely issued because it can increase the capability of storage by storing two or more bits to a single cell. However if a number of levels in a cell increases, some physical features like cell to cell interference result cell voltage shift and it is known that a VT shift is unidirectional. To reduce errors by the effects, we can consider error correcting codes(ECC) or signal processing methods. We focus signal processing methods for the cell to cell interference voltage shift effects and propose the algorithms which reduce the effects of the voltage shift by estimating it and making level read voltages be adaptive. These new algorithms can be applied with ECC at the same time, therefore these algorithms are efficient for MLC error correcting ability. We show the bit error rate simulation results of the algorithms and compare the performance of the algorithms.

WAP-LRU: Write Pattern Analysis Based Hybrid Disk Buffer Management in Flash Storage Systems (WAP-LRU : 플래시 스토리지 시스템에서 쓰기 패턴 분석 기반의 하이브리드 디스크 버퍼 관리 기법)

  • Kim, Kyung Min;Choi, Jun-Hyeong;Kwak, Jong Wook
    • IEMEK Journal of Embedded Systems and Applications
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    • v.13 no.3
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    • pp.151-160
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    • 2018
  • NAND flash memories have the advantages of fast access speed, high density and low power consumption, thus they have increasing demand in embedded system and mobile environment. Despite the low power and fast speed gains of NAND flash memory, DRAM disk buffers were used because of the performance load and limited durability of NAND flash cell. However, DRAM disk buffers are not suitable for limited energy environments due to their high static energy consumption. In this paper, we propose WAP-LRU (Write pattern Analysis based Placement by LRU) hybrid disk buffer management policy. Our policy designates the buffer location in the hybrid memory by analyzing write pattern of the workloads to check the continuity of the page operations. In our simulation, WAP-LRU increased the lifetime of NAND flash memory by reducing the number of garbage collections by 63.1% on average. In addition, energy consumption is reduced by an average of 53.4% compared to DRAM disk buffers.

A Subthreshold Slope and Low-frequency Noise Characteristics in Charge Trap Flash Memories with Gate-All-Around and Planar Structure

  • Lee, Myoung-Sun;Joe, Sung-Min;Yun, Jang-Gn;Shin, Hyung-Cheol;Park, Byung-Gook;Park, Sang-Sik;Lee, Jong-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.12 no.3
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    • pp.360-369
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    • 2012
  • The causes of showing different subthreshold slopes (SS) in programmed and erased states for two different charge trap flash (CTF) memory devices, SONOS type flash memory with gate-all-around (GAA) structure and TANOS type NAND flash memory with planar structure were investigated. To analyze the difference in SSs, TCAD simulation and low-frequency noise (LFN) measurement were fulfilled. The device simulation was performed to compare SSs considering the gate electric field effect to the channel and to check the localized trapped charge distribution effect in nitride layer while the comparison of noise power spectrum was carried out to inspect the generation of interface traps ($N_{IT}$). When each cell in the measured two memory devices is erased, the normalized LFN power is increased by one order of magnitude, which is attributed to the generation of $N_{IT}$ originated by the movement of hydrogen species ($h^*$) from the interface. As a result, the SS is degraded for the GAA SONOS memory device when erased where the $N_{IT}$ generation is a prominent factor. However, the TANOS memory cell is relatively immune to the SS degradation effect induced by the generated $N_{IT}$.

Reliability Analysis by Lateral Charge Migration in Charge Trapping Layer of SONOS NAND Flash Memory Devices (SONOS NAND 플래시 메모리 소자에서의 Lateral Charge Migration에 의한 소자 안정성 연구)

  • Sung, Jae Young;Jeong, Jun Kyo;Lee, Ga Won
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.4
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    • pp.138-142
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    • 2019
  • As the NAND flash memory goes to 3D vertical Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) structure, the lateral charge migration can be critical in the reliability performance. Even more, with miniaturization of flash memory cell device, just a little movement of trapped charge can cause reliability problems. In this paper, we propose a method of predicting the trapped charge profile in the retention mode. Charge diffusivity in the charge trapping layer (Si3N4) was extracted experimentally, and the effect on the trapped charge profile was demonstrated by the simulation and experiment.

The study on cell Vth distibution induced by heavily doped channel ionn and Si-SiN stress in flash memory cell (과도한 채널 이온 주입 농도 및 Si-SiN 스트레스가 플래쉬 메모리셀 산포에 미치는 영향)

  • Lee Chi-Kyoung;Park Jung-Ho;Kim Han-Su;Park Kyu-Charn
    • Proceedings of the IEEK Conference
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    • 2004.06b
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    • pp.485-488
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    • 2004
  • As scaling down the cell channel length, the increment of B concentration in channel region is inevitable to overcome the punch-through, especially in flash memory cell with 90nm technology. This paper shows that the high dose ion implantation in channel cause the Si defect. which has been proved to be the major cause of the tailed Vth in distribution. And also mechanical stress due to SiN-anneal process can induce the Si dislocation. and get worse it. With decreasing the channel implantation dose, skipping the anneal and reducing the mechanical stress, Si defect problem is solved completely. We are verify first that the optimization of B concentration in channel must be certainly considered in order to improve Si defect. It is also certainly necessary to stabilize the distribution of cell Vth in the next generation of flash memory.

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An Efficient SLC Transition Method for Improving Defect Rate and Longer Lifetime on Flash Memory (플래시 메모리 상에서 불량률 개선 및 수명 연장을 위한 효율적인 단일 비트 셀 전환 기법)

  • Hyun-Seob Lee
    • Journal of Internet of Things and Convergence
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    • v.9 no.3
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    • pp.81-86
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    • 2023
  • SSD (solid state disk), which is flash memory-based storage device, has the advantages of high density and fast data processing. Therefore, it is being utilized as a storage device for high-capacity data storage systems that manage rapidly increasing big data. However, flash memory, a storage media, has a physical limitation that when the write/erase operation is repeated more than a certain number of times, the cells are worn out and can no longer be used. In this paper, we propose a method for converting defective multi-bit cells into single-bit cells to reduce the defect rate of flash memory and extend its lifetime. The proposed idea distinguishes the defects and treatment methods of multi-bit cells and single-bit cells, which have different physical characteristics but are treated as the same defect, and converts the expected defective multi-bit cells into single-bit cells to improve the defect rate and extend the overall lifetime. Finally, we demonstrate the effectiveness of our proposed idea by measuring the increased lifetime of SSD through simulations.