• Title/Summary/Keyword: Current-Mode Circuit

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Design of a PWM DC-DC Boost Converter IC for Mobile Phone Flash (휴대전화 플래시를 위한 PWM 전류모드 DC-DC converter 설계)

  • Jung, Jin-Woo;Heo, Yun-Seok;Park, Yong-Su;Kim, Nam-Tae;Song, Han-Jung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.6
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    • pp.2747-2753
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    • 2011
  • In this paper, a PWM current-mode DC-DC boost converter for mobile phone flash application has been proposed. The converter which is operated with 5 Mhz high switching frequency is capable of reducing mounting area of passive devices such as inductor and capacitor, consequently is suitable for compact mobile phones. This boost converter consists of a power stage and a control block. Circuit elements of the power stage are inductor, output capacitor, MOS transistors and feedback resistors. Meanwhile, the control block consists of pulse width modulator, error amplifier, oscillator etc. Proposed boost converter has been designed and verified in a $0.5\;{\mu}m$ 1-poly 2-metal CMOS process technology. Simulation results show that the output voltage is 4.26 V in 3.7 V input voltage, output current 100 mA which is larger than 25 ~ 50 mA in conventional 500 Khz driven converter when the duty ratio is 0.15.

Design of 5V NMOS-Diode eFuse OTP IP for PMICs (PMIC용 5V NMOS-Diode eFuse OTP IP 설계)

  • Kim, Moon-Hwan;Ha, Pan-Bong;Kim, Young-Hee
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.10 no.2
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    • pp.168-175
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    • 2017
  • In this paper, a 5V small-area NMOS-diode eFuse OTP memory cell is proposed. This cell which is used in PMICs consists of a 5V NMOS transistor and an eFuse link as a memory part, based on a BCD process. Also, a regulated voltage of V2V ($=2.0V{\pm}10%$) instead of the conventional VDD is used to the pull-up loads of a VREF circuit and a BL S/A circuit to obtain a wider operational voltage range of the eFuse memory cell. When this proposed cells are used in the simulation, their sensing resistances are found to be $15.9k{\Omega}$ and $32.9k{\Omega}$, in the normal read mode and in the program-verify-read mode, respectively. Furthermore, the read current flowing through a non-blown eFuse is restricted to $97.7{\mu}A$. Thus, the eFuse link of a non-blown eFuse OTP memory cell is kept non-blown. The layout area of the designed 1kb eFuse OTP memory IP based on Dongbu HiTek's BCD process is $168.39{\mu}m{\times}479.45{\mu}m(=0.08mm^2)$.

Deign of Small-Area Dual-Port eFuse OTP Memory IP for Power ICs (PMIC용 저면적 Dual Port eFuse OTP 메모리 IP 설계)

  • Park, Heon;Lee, Seung-Hoon;Park, Mu-Hun;Ha, Pan-Bong;Kim, Young-Hee
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.8 no.4
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    • pp.310-318
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    • 2015
  • In this paper, dual-port eFuse OTP (one-time programmable) memory cells with smaller cell sizes are used, a single VREF (reference voltage) is used in the designed eFuse OTP IP (intellectual property), and a BL (bit-line) sensing circuit using a S/A (sense amplifier) based D F/F is proposed. With this proposed sensing technique, the read current can be reduced to 3.887mA from 6.399mA. In addition, the sensing resistances of a programmed eFuse cell in the program-verify-read and read mode are also reduced to $9k{\Omega}$ and $5k{\Omega}$ due to the analog sensing. The layout size of the designed 32-bit eFuse OTP memory is $187.845{\mu}m{\times}113.180{\mu}m$ ($=0.0213{\mu}m2$), which is confirmed to be a small-area implementation.

Design of a Multi-Band Low Noise Amplifier for 3GPP LTE Applications in 90nm CMOS (3GPP LTE를 위한 다중대역 90nm CMOS 저잡음 증폭기의 설계)

  • Lee, Seong-Ku;Shin, Hyun-Chol
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.5
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    • pp.100-105
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    • 2010
  • A multi-band low noise amplifier (LNA) is designed in 90 nm RF CMOS process for 3GPP LTE (3rd Generation Partner Project Long Term Evolution) applications. The designed multi-band LNA covers the eight frequency bands between 1.85 and 2.8 GHz. A tunable input matching circuit is realized by adopting a switched capacitor array at the LNA input stage for providing optimum performances across the wide operating band. Current steering technique is adopted for the gain control in three steps. The performances of the LNA are verified through post-layout simulations (PLS). The LNA consumes 17 mA at 1.2 V supply voltage. It shows a power gain of 26 at the normal gain mode, and provides much lower gains of 0 and -6.7 in the bypass-I and -II modes, respectively. It achieves a noise figure of 1.78 dB and a IIP3 of -12.8 dBm over the entire band.

Latch-Up Prevention Method having Power-Up Sequential Switches for LCD Driver ICs (LCD 구동 IC를 위한 Power-Up 순차 스위치를 가진 Latch-Up 방지 기술)

  • Choi, Byung-Ho;Kong, Bai-Sun;Jun, Young-Hyun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.6
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    • pp.111-118
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    • 2008
  • In this paper, novel latch-up prevention method that employs power-up sequential switches has been proposed to relieve latch-up problem in liquid crystal display (LCD) driver ICs. These sequential switches are inserted in the 2'nd and 3'rd boosting stages, and are used to short the emitter-base terminals of parasitic p-n-p-n circuit before relevant boosting stages are activated during power-up sequence. To verily the performance of the proposed method, test chips were designed and fabricated in a 0.13-um CMOS process technology. The measurement results indicated that, while the conventional LCD driver If entered latch-up mode at $50^{\circ}C$ accompanying a significant amount of excess current, the driver IC adopting the proposed method showed no latch-up phenomenon up to $100^{\circ}C$ and maintained normal current level of 0.9mA.

High Efficiency Resonant Flyback Converter using a Single-Chip Microcontroller (싱글칩 마이크로컨트롤러를 이용한 고효율 공진형 플라이백 전력변환기)

  • Jeong, Gang-Youl
    • Journal of IKEEE
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    • v.24 no.3
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    • pp.803-813
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    • 2020
  • This paper presents a high efficiency resonant flyback converter using a single-chip microcontroller. The proposed converter primary performs the resonant switching by applying the asymmetrical pulse-width modulation (APWM) to the half-bridge power topology. And the converter secondary uses the diode flyback rectifier as its power topology and operates with the zero current switching (ZCS). Thus the proposed converter achieves high efficiency. The total structure of proposed converter is very simple because it uses a single-chip microcontroller and bootstrap circuit for its control and drive, respectively. First, this paper describes the converter operation according to each operation mode and shows its steady-state analysis. And the software control algorithm and drive circuits operating the proposed converter are explained. Then, the operation characteristics of proposed converter are shown through the experimental results of an implemented prototype based on each explanation.

Development of DC-DC Converter for Ancillary Power Supply in Hybrid Electric Vehicle (하이브리드 자동차 보조전원 공급용 DC-DC 컨버터 개발)

  • Kim, Jong-Cheol;Choi, Deok-Kwan;Park, Hae-Woo
    • Proceedings of the KIPE Conference
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    • 2005.07a
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    • pp.261-265
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    • 2005
  • This paper describes the DC-DC Converter for Ancillary Power Supply in Hybrid Electric Vehicle. DC-DC Converter is used for charging 12V auxiliary battery supplying electric power to head ramp, audio, ECU etc in automobiles. used DC-DC Converter Topology is PS-ZVS FB(Phase Shifted Zero Voltage Switching Full-Bridge) to reduce switching loss and EMI noise induced by high frequency operating condition. And For easy compensation and stable system response characteristic, current mode control method including slope compensation is employed. Constant current / constant voltage charging control method guarantee stable electric charging of auxiliary battery. Simulation toll PSIM6.0 is used for initial circuit parameter settings and H/W debuging. Thermal problems of Switching components in DC-DC Converter is improved by using Thermo Tracer.

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An Optimal Location of Superconducting Fault Current Limiter in Distribution Network with Distributed Generation Using an Index of Distribution Reliability Sensitivity (신뢰도 민감도 지수를 이용한 복합배전계통 내 초전도한류기의 최적 위치에 관한 연구)

  • Kim, Sung-Yul;Kim, Wook-Won;Bae, In-Su;Kim, Jin-O
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.6
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    • pp.52-59
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    • 2010
  • As electric power demand of customers is constantly increasing, more bulk power systems are needed to install in a network. By development of renewable energies and high-efficient facilities and deregulated electricity market, moreover, the amount of distributed resource is considerably increasing in distribution network consequently. Also, distribution network has become more and more complex as mesh network to improve the distribution system reliability and increase the flexibility and agility of network operation. These changes make fault current increase. Therefore, the fault current will exceed a circuit breaker capacity. In order to solve this problem, replacing breaker, changing operation mode of system and rectifying transformer parameters can be taken into account. The SFCL(Superconducting Fault Current Limiter) is one of the most promising power apparatus. This paper proposes a methodology for on optimal location of SFCL. This place is defined as considering the decrement of fault current by component type and the increment of reliability by customer type according to an location of SFCL in a distribution network connected with DG(Distributed Generation). With case studies on method of determining optimal location for SFCL applied to a radial network and a mesh network respectively, we proved that the proposed method is feasible.

Fast-Transient Digital LDO Regulator With Binary-Weighted Current Control (이진 가중치 전류 제어 기법을 이용한 고속 응답 디지털 LDO 레귤레이터)

  • Woo, Ki-Chan;Sim, Jae-Hyeon;Kim, Tae-Woo;Hwang, Seon-Kwang;Yang, Byung-Do
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.20 no.6
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    • pp.1154-1162
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    • 2016
  • This paper proposes a fast-transient digital LDO(Low dropout) regulator with binary-weighted current control technique. Conventional digital LDO takes a long time to stabilize the output voltage, because it controls the amount of current step by step, thus ringing problem is generated. Binary-weighted current control technique rapidly stabilizes output voltage by removing the ringing problem. When output voltage reliably reaches the target voltage, It added the FRZ mode(Freeze) to stop the operation of digital LDO. The proposed fast response digital LDO is used with a slow response DC-DC converter in the system which rapidly changes output voltage. The proposed digital controller circuit area was reduced by 56% compared to conventional bidirectional shift register, and the ripple voltage was reduced by 87%. A chip was implemented with a $0.18{\mu}F$ CMOS process. The settling time is $3.1{\mu}F$ and the voltage ripple is 6.2mV when $1{\mu}F$ output capacitor is used.

Design of Low-Noise and High-Reliability Differential Paired eFuse OTP Memory (저잡음 · 고신뢰성 Differential Paired eFuse OTP 메모리 설계)

  • Kim, Min-Sung;Jin, Liyan;Hao, Wenchao;Ha, Pan-Bong;Kim, Young-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.10
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    • pp.2359-2368
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    • 2013
  • In this paper, an IRD (internal read data) circuit preventing the reentry into the read mode while keeping the read-out DOUT datum at power-up even if noise such as glitches occurs at signal ports such as an input signal port RD (read) when a power IC is on, is proposed. Also, a pulsed WL (word line) driving method is used to prevent a DC current of several tens of micro amperes from flowing into the read transistor of a differential paired eFuse OTP cell. Thus, reliability is secured by preventing non-blown eFuse links from being blown by the EM (electro-migration). Furthermore, a compared output between a programmed datum and a read-out datum is outputted to the PFb (pass fail bar) pin while performing a sensing margin test with a variable pull-up load in consideration of resistance variation of a programmed eFuse in the program-verify-read mode. The layout size of the 8-bit eFuse OTP IP with a $0.18{\mu}m$ process is $189.625{\mu}m{\times}138.850{\mu}m(=0.0263mm^2)$.