• Journal of the Korean Ceramic Society
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• v.56 no.4
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• pp.354-359
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• 2019

Information security films that can ensure personal privacy by reducing the viewing angle of display screens were fabricated by microlouver patterning and a ZnO nano-ink filling process. Optical simulation results demonstrated that all the microlouver films showed good security performances. Security performances were evaluated as calculated relative luminance ratios compared between the side and front. Based on the simulation results, microlouver films were fabricated by UV imprint lithography and nano-ink bar coating. However, distortion of the microlouver pattern occurred with the use of high-viscosity nano-inks such as ZrO₂ and TiO₂, and the CuO-filled microlouver film suffered from very low optical transmittance. Accordingly, the effects of ZnO filling height on security performance were intensively investigated through simulation and experimental measurements. The fabricated microlouver film with a 75-㎛-high ZnO filling exhibited a good relative luminance ratio of 0.75 at a 60° side angle and a transmittance of 44% at a wavelength of 550 nm.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.63-69
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• 2007

We investigated interconnection processes using Cu vias for MEMS sensor packages. Ag paste layer was formed on a glass substrate and used as a seed layer for electrodeposition of Cu vias after bonding a Si substrate with through-via holes. With applying electrodeposition current densities of $20mA/cm^2\;and\;30mA/cm^2$ at direct current mode to the Ag paste seed-layer, Cu vias of $200{\mu}m$ diameter and $350{\mu}m$ depth were formed successfully without electrodeposition defects. Interconnection processes for MEMS sensor packages could be accomplished with Ti/Cu/Ti line formation, Au pad electrodeposition, Sn solder electrodeposition and reflow process on the Si substrate where Cu vias were formed by Cu electrodeposition into through-via holes.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.9-13
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• 2011

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.254-254
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• 2009

• Journal of Korea Foundry Society
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• v.26 no.5
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• pp.227-231
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• 2006

Liquid formability of bulk amorphous alloys is known to be very poor due to their high viscosity comparing with conventional metallic materials. It is important to have the fabricating technology of bulk amorphous alloys in order to make the components with complicated shape. Liquid formability includes the mold cavity filling ability and the hot tear(crack) resistance during solidification. A mold made of a commercial tool steel for the formability test was designed. Melting was performed by the arc melting furnace with melting capacity of 200 g in an argon atmosphere. Liquid formability and glass forming ability of Cu base and Ni base bulk amorphous alloys were measured and evaluated. Mold filling ability of Ni-Zr-Ti-Si-Sn alloy was better than that of Cu-Ni-Zr-Ti alloy, however the reverse is the hot tear resistance. Bulk amorphous alloy is very susceptible to crack if partial crystallization occurs during solidification. Crack resistance was thought to be closely related with the glass forming ability.

• Economic and Environmental Geology
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• v.7 no.1
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• pp.23-35
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• 1974

Dalsung Mine, located in Kyungsang puk-do, Korea, is well known as one of the typical breccia pipe filling hydrothermal W-Cu deposit. By homogenization temperature with fluid inclusions in quartz crystals (330 samples were dealt with) by heating stage microscope, two temperature ranges were figured out, one is $154^{\circ}{\sim}267^{\circ}C$ (average $210^{\circ}C$), and the other is $283^{\circ}{\sim}335^{\circ}C$ (average $309^{\circ}C$). Regarding to mineral paragenesis, mineralization of the deposit were thought that former, mesothermal stage, W-Cu mineralization processed through out the ore body and later mineralization were limitted under -4level as katathermal solution with Cu minerals.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.

• Korean Chemical Engineering Research
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• v.52 no.1
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• pp.26-39
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• 2014

Cu interconnection in electronic devices is fabricated via damascene process including Cu electrodeposition. In this review, Cu electrodeposition and superfilling for fabricating Cu interconnection are introduced. Superfilling results from the influences of organic additives in the electrolyte for Cu electrodeposition, and this is enabled by the local enhancement of Cu electrodeposition at the bottom of filling feature formed on the wafer through manipulating the surface coverage of organic additives. The dimension of metal interconnection has been constantly reduced to increase the integrity of electronic devices, and the width of interconnection reaches the range of few tens of nanometer. This size reduction raises the issues, which are the deterioration of electrical property and the reliability of Cu interconnection, and the difficulty of Cu superfilling. The various researches on the development of organic additives for the modification of Cu microstructure, the application of pulse and pulse-reverse electrodeposition, Cu-based alloy superfilling for improvement of reliability, and the enhancement of superfilling phenomenon to overcome the current problems are addressed in this review.

• Clean Technology
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• v.17 no.2
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• pp.103-109
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• 2011

The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.

• Journal of the Korean institute of surface engineering
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• v.41 no.1
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• pp.23-27
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• 2008

The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitation was effective to obtain superconformal copper configuration within the trenches of $130{\sim}80nm$ width. The transition of open potential during electroless deposition process showed that solution agitation induced compact structure of copper deposits by suppressing mass transfer of cuprous ions toward substrate. Also, the specific resistivity of copper layers was lowered by increasing agitation speed, which made the deposited copper particles smaller. Considering both copper deposit configuration and electric property, around 500 rpm of solution agitation was the most suitable for the homogeneous electroless copper filling within the ultra-fine patterns.