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http://dx.doi.org/10.7464/ksct.2011.17.2.103

Improvement of the Throwing Power (TP) and Thickness Uniformity in the Electroless Copper Plating  

Seo, Jung-Wook (Manufacturing & Engineering Center, Samsung Electro-Mechanics Co., Ltd.)
Lee, Jin-Uk (Corporate R&D Institute, Samsung Electro-Mechanics Co., Ltd.)
Won, Yong-Sun (Department of Chemical Engineering, Pukyong National University)
Publication Information
Clean Technology / v.17, no.2, 2011 , pp. 103-109 More about this Journal
Abstract
The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.
Keywords
Electroless copper plating; Throwing power; Via; Thickness uniformity; PCB (Printed Circuit Board);
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