• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.4
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• pp.143-150
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• 2008

EGR(exhaust gas recirculation) is an attractive means of improving the fuel economy of spark ignition engines, as it offers the benefits of charge dilution (lower pumping and cooling losses) while allowing stoichiometric fuelling to be retained for applications using the three-way catalysts. However, the occurrence of excessive cyclic variation with high EGR normally prevents substantial fuel economy improvements from being achieved in practice. Therefore, the optimum EGR rate in Gasoline-Hybrid engine should be carefully determined in order to achieve low fuel consumption and low exhaust emission. In this study, 2 liters gasoline engine with E-EGR system was used to investigate the effects of EGR on fuel economy, combustion stability, engine performance and exhaust emissions. EGR tolerance with load variation was found to be more sensitive than with rpm variation. With optimal EGR rates, the fuel consumption was improved by 5.5% while a combustion stability was guaranteed.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.7
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• pp.176-184
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• 1996

To overcome the drawbacks of conventional LDMOSFETs, we propose RESURF EDMOSFETs which can be adapted in varous circuit applications, be driven without charge pumping circuity and thowe threshold voltage can be adjusted. The devices have the diffused drift region formed by a high tmperature process before the gate oxidaton. After the polysilicon gate electrode formation, a fraction of the drift region around the gate edge is opened for supplemental self-aligned ion implantation to obtain self-aligned drift region. This leads to a shorter gate length and desirable drift region junction contour under the gate edge for minimum specific-on-resistance. In additon, a and maximize the breakdown voltage. Also, by biasing the metal field plate, we can reduce the specific-on-resistance further. The devices are optimized by using the TSUPREM-4 process simulator and the MEDICI device simulator. The optimized devices have the breakdwon voltage and the specific-on-resistance of 101.5V and 1.14m${\Omega}{\cdot}cm^{2}$, respectively for n-channel RESURF EDMOSFET, and 98V and 2.75m.ohm..cm$^{2}$ respectively for p-channel RESURF EDMOSFET. To check the validity of the simulations, we fabricated n-channel EDMOSFETs and confirmed the measured breakdown voltage of 97V and the specific-on-resistance of 1.28m${\Omega}{\cdot}cm^{2}$. These results are superior to those of any other reported power devices for smart power IC applications.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.3 s.357
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• pp.65-71
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• 2007

We propose a pixel-level automatic calibration circuit scheme that initializes a capacitive fingerprint sensor LSI to eliminate the influence of the surface condition and environment, which is degraded by dirt during long-time use, process variation and ambient temperature. The sample chip is fabricated on $0.35{\mu}m$ standard CMOS process. The calibration is executed by optimizing the reference voltage in each pixel to make the sensor signals of all pixels the same. The calibration control circuit is composed of the sensing circuit and charge pumping circuit, and calibrates all pixels in a short time. 16-level gray scale fingerprint images can be captured to increase the accuracy of identification. This confirms that the scheme is effective for capturing consistent clear images during long-time use.

• ETRI Journal
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• v.37 no.6
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• pp.1188-1198
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• 2015

In this paper, a multi-time programmable (MTP) cell based on a $0.18{\mu}m$ bipolar-CMOS-DMOS backbone process that can be written into by using dual pumping voltages - VPP (boosted voltage) and VNN (negative voltage) - is used to design MTP memories without high voltage devices. The used MTP cell consists of a control gate (CG) capacitor, a TG_SENSE transistor, and a select transistor. To reduce the MTP cell size, the tunnel gate (TG) oxide and sense transistor are merged into a single TG_SENSE transistor; only two p-wells are used - one for the TG_SENSE and sense transistors and the other for the CG capacitor; moreover, only one deep n-well is used for the 256-bit MTP cell array. In addition, a three-stage voltage level translator, a VNN charge pump, and a VNN precharge circuit are newly proposed to secure the reliability of 5 V devices. Also, a dual memory structure, which is separated into a designer memory area of $1row{\times}64columns$ and a user memory area of $3rows{\times}64columns$, is newly proposed in this paper.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.05a
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• pp.116-119
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• 1994

The characteristics of the Si-SiO$_2$ interface and the degradation in the short channel(L${\times}$W=1.7$\mu\textrm{m}$${\times}$15$\mu\textrm{m}$) SONOSFET nonvolatile memory devices, fabricated on the basis of the existing n-well CMOS processing technology for 1 Mbit DRAM with the 1.2$\mu\textrm{m}$ m design rule, were investigated using the charge pumping method. The SONOSFET memories have the tripple insulated-gate consisting of 30${\AA}$ tunneling oxide 205${\AA}$ nitride and 65${\AA}$ blocking oxide, The acceleration method which square voltage pulses of t$\_$p/=10msec, Vw=+19V and V$\_$E/=-22V continue to be alternatly applied to gale, was used to investigate the degradation of SONOSFET memories with the write/erase cycle. The degradation characteristics were ascertained by observing the change in the energy and spatial distributions of the interface trap density.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.12
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• pp.792-796
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• 2014

In this paper, we investigated the hot carrier reliability of two kinds of device with low threshold voltage (LVT) and regular threshold voltage (RVT) in 65 nm CMOS technology. Contrary to the previous report that devices beyond $0.18{\mu}m$ CMOS technology is dominated by channel hot carrier(CHC) stress rather than drain avalanche hot carrier(DAHC) stress, both of LVT and RVT devices showed that their degradation is dominated by DAHC stress. It is also shown that in case of LVT devices, contribution of interface trap generation to the device degradation is greater under DAHC stress than CHC stress, while there is little difference for RVT devices.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.2 s.332
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• pp.1-8
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• 2005

An area-efficient DC-DC voltage up-converter in a poly-Si TFT technology for system-on-glass is described which provides low-ripple output. The voltage up-converter is composed of charge-pumping circuit, comparator with threshold voltage mismatch compensation, oscillator, buffer, and delay circuit for multi-phase clock generation. The low ripple output is obtained by multi-phase clocking without increasing neither clock frequency nor filtering capacitor The measurement results have shown that the ripple on the output voltage with 4-phase clocking is 123mV, while Dickson and conventional cross-coupled charge pump has 590mV and 215mV voltage ripple, respectively, for $Rout=100k\Omega$, Cout-100pF, and fclk=1MHz. The filtering capacitor required for 50mV ripple voltage is 1029pF and 575pF for Dickson and conventional cross-coupled structure, for Iout=100uA, and fclk=1MHz, while the proposed multi-phase clocking DC-DC converter with 4-phase and 6-phase clocking requires only 290pF and 157pF, respectively. The efficiency of conventional and the multi-phase clocking DC-DC converter with 4-phase clocking is $65.7\%\;and\;65.3\%$, respectively, while Dickson charge pump has $59\%$ efficiency.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.42 no.2
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• pp.197-208
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• 2022

The existence of shallow bedrock and the desire to use underground space necessitate the use of blasting methods. The standard blasting method under water after drilling is associated with certain technical difficulties, including reduced detonation power, the use of a fixed charge per delay, and decoupling. However, there is no blasting method to replace the existing blasting method. In this paper, a dry hole charged with ANFO blasting is assessed while employing a dry hole pumping system to remove water from the drill borehole. Additional standard blasting is also utilized to compare the blasting performances of the two methods. The least-squares linear regression method is adopted to analyze the blasting vibration velocity quantitatively using the measured vibration velocity for each blasting method and the vibration velocity model as a function of the scaled distance. The results show that the dry hole charged with ANFO blasting will lead to greater damping of the blasting vibration, more energy dissipation to crush the surrounding rock, and closer distances for the allowable velocity of the blasting vibration. Also, standard blasting shows much longer influencing distances and a wider range of the blasting pattern. The pilot test confirms the blasting efficiency of dry hole charged with ANFO blasting.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.12
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• pp.944-948
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• 2011

In this paper, flicker noise characteristic and channel hot carrier degradation of NMOSFETs with plasma nitrided oixde (PNO) and thermally nitrided oxide (TNO) are analyzed in depth. Compared with NMOSFET with TNO, flicker noise characteristic of NMOSFET with PNO is improved significantly because nitrogen density in PNO near the Si/$SiO_2$ interface is less than that in TNO. However, device degradation of NMOSFET with PNO by channel hot carrier stress is greater than that with TNO although PMOSFET with PNO showed greater immunity to NBTI degradation than that with TNO in previous study. Therefore, concurrent investigation of the reliability as well as low frequency noise characteristics of NMOSFET and PMOSFET is required for the development of high performance analog MOSFET technology.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.12
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• pp.941-947
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• 2017

This paper reports a fractional-N phase-locked-loop(PLL) frequency synthesizer that is implemented in a $0.35-{\mu}m$ standard CMOS process and generates a quadrature signal for an FRS terminal. The synthesizer consists of a voltage-controlled oscillator(VCO), a charge pump(CP), loop filter(LF), a phase frequency detector(PFD), and a frequency divider. The VCO has been designed with an LC resonant circuit to provide better phase noise and power characteristics, and the CP is designed to be able to adjust the pumping current according to the PFD output. The frequency divider has been designed by a 16-divider pre-scaler and fractional-N divider based on the third delta-sigma modulator($3^{rd}$ DSM). The LF is a third-order RC filter. The measured results show that the proposed device has a dynamic frequency range of 460~510 MHz and -3.86 dBm radio-frequency output power. The phase noise of the output signal is -94.8 dBc/Hz, and the lock-in time is $300{\mu}s$.