• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.8
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• pp.46-51
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• 2002

A new interleaved synchronous mirror delay(SMD) is proposed in order to reduce the circuit size and the power. The conventional interleaved SMD has multiple pairs of forward delay array(FDA) and backward delay away(BDA) in order to reduce the jitter. The proposed interleaved SMD. requires one FDA and one BDA by changing the position of multiplexer. Moreover, the proposed interleaved SMD solves the polarity problem with just one extra inverter. Simulation results show that about 30% power reduction and 40% area reduction are achieved in the proposed interleaved SMD. All circuit simulations and implementations are based on a 0.25um two-metal CMOS technology.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.2
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• pp.212-215
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• 2016

In this paper, a 5.08 GHz Ring Voltage Controlled Oscillator(Ring VCO) was implemented using $0.18{\mu}m$ standard CMOS technology. The proposal Ring VCO is 3-stage structure. This research confirmed that the each stage's different transistor size ratio influence the current change and alter power consumption consequentially. This circuit is formed to control the current thereby adding the Current Mirror and to tune the frequency by supplying control voltage. It has an 65.5 %(1.88~5.45 GHz) tuning range. The measured output power is -0.30 dBm. The phase noise is -87.50 dBc/Hz @1 MHz offset with operating frequency of 5.08 GHz fundamental frequency. The total power consumption of Ring VCO is 31.2 mW with 2.4 V supply voltage.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.41 no.6
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• pp.17-25
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• 2004

In this paper, we propose a new small swing domino logic for low-power consumption. To reduce the power consumption, both the precharge node and the output node swing the range from 0 to $V_{REF}$- $V_{THN}$, where $V_{REF}$=VDD-n $V_{THN}$ (n=1, 2, and 3). This can be done by adding the inverter structure on domino logic that allows a full swing or a small swing on its input terminal without leakage current. Compared to previous works, the proposed structure can save the power consumption of more than 30% for n=0, 1, 2, and 3 in the equation of $V_{REF}$=VDD-n $V_{THN}$. A multiplier applying the proposed domino logic has been designed and fabricated using a 0.35-${\mu}{\textrm}{m}$ n-well CMOS process under 3.3-V supply voltage. Compared with other previous works, it shows a 30% power reduction and a better feature in power-delay product.lay product.

• Journal of Korea Multimedia Society
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• v.6 no.2
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• pp.352-359
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• 2003

In this paper, we designed the bluetooth receiver using the microstrip bandpass filter and the high gain low noise amplifier with the 0.2$\mu\textrm{m}$ CMOS technology. A cascode inverter is adopted to implement the low noise amplifier and is one stage amplifier with a voltage reference and without the choke inductor. The designed 2.4GHz LNA was achieved a power gain of 18dB, a noise figure of 2.8dB, and the power consumption of 255mW at 2.5V power supply. Also, the microstrip receiver bandpass filter was designed that the center frequency was 2.45GHz, the bandwidth was 4% and the insert attenuation was -1.9dB. When the microstrip bandpass filter and LNA was simulated together the power gain was 16.3dB.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.7
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• pp.1227-1234
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• 2008

In this paper is designed a 256-bit synchronous OTP(one-time programmable) memory required in application fields such as automobile appliance power ICs, display ICs, and CMOS image sensors. A 256-bit synchronous memory cell consists of NMOS capacitor as antifuse and access transistor without a high-voltage blocking transistor. A gate bias voltage circuit for the additional blocking transistor is removed since logic supply voltage VDD(=1.5V) and external program voltage VPPE(=5.5V) are used instead of conventional three supply voltages. And loading current of cell to be programmed increases according to RON(on resistance) of the antifuse and process variation in case of the voltage driving without current constraint in programming. Therefore, there is a problem that program voltage can be increased relatively due to resistive voltage drop on supply voltage VPP. And so loading current can be made to flow constantly by using the current driving method instead of the voltage driving counterpart in programming. Therefore, program voltage VPP can be lowered from 5.9V to 5.5V when measurement is done on the manufactured wafer. And the sens amplifier circuit is simplified by using the sens amplifier of clocked inverter type instead of the conventional current sent amplifier. The synchronous OTP of 256 bits is designed with Magnachip $0.13{\mu}m$ CMOS process. The layout area if $298.4{\times}314{\mu}m2$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.5
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• pp.649-657
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• 2014

In this study, the effects of the frequency-dependent characteristics of through-silicon vias (TSVs) on the performance of 3D ICs are examined by evaluating a typical interconnection structure, which is composed of 32-nm CMOS inverter drivers and receivers connected through TSVs. The frequency-domain model of TSVs is extracted in S-parameter from a 3D electromagnetic (EM) method, where the dimensional variation effect of TSVs can be accurately considered for a comprehensive parameter sweep simulation. A parametric analysis shows that the propagation delay increases with the diameter and height of the TSVs but decreases with the pitch and liner thickness. We also investigate the crosstalk effect between TSVs by testing different signaling conditions. From the simulations, the worst signal integrity is observed when the signal experiences a simultaneously coupled transition in the opposite direction from the aggressor lines. Simulation results for nine-TSV bundles having regular and staggered patterns reveal that the proposed method can characterize TSV-based 3D interconnections of any dimensions and patterns.

• ETRI Journal
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• v.37 no.1
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• pp.97-106
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• 2015

In this paper, MOS-triggered silicon-controlled rectifier (SCR)-based electrostatic discharge (ESD) protection circuits for mobile application in 3.3 V I/O and SCR-based ESD protection circuits with floating N+/P+ diffusion regions for inverter and light-emitting diode driver applications in 20 V power clamps were designed. The breakdown voltage is induced by a grounded-gate NMOS (ggNMOS) in the MOS-triggered SCR-based ESD protection circuit for 3.3 V I/O. This lowers the breakdown voltage of the SCR by providing a trigger current to the P-well of the SCR. However, the operation resistance is increased compared to SCR, because additional diffusion regions increase the overall resistance of the protection circuit. To overcome this problem, the number of ggNMOS fingers was increased. The ESD protection circuit for the power clamp application at 20 V had a breakdown voltage of 23 V; the product of a high holding voltage by the N+/P+ floating diffusion region. The trigger voltage was improved by the partial insertion of a P-body to narrow the gap between the trigger and holding voltages. The ESD protection circuits for low- and high-voltage applications were designed using $0.18{\mu}m$ Bipolar-CMOS-DMOS technology, with $100{\mu}m$ width. Electrical characteristics and robustness are analyzed by a transmission line pulse measurement and an ESD pulse generator (ESS-6008).

• 전자공학회논문지 IE
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• v.44 no.2
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• pp.14-20
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• 2007

This paper presents quaternary D flip-flop with advanced performance. Quaternary D flip-flop is composed of the components such as thermometer code output circuit, EX-OR gate, bias inverter, transmission gate and binary D flip-flop circuit. The designed circuit is simulated by HSPICE in $0.35{\mu}m$ one-poly six-metal CMOS process parameters with a single +3.3V supply voltage. In the simulations, sampling frequencies is measured around 100MHz. The PDP parameters and FOM we estimated to be 59.3fJ, 33.7 respectively.

• Journal of Korea Society of Industrial Information Systems
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• v.20 no.1
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• pp.1-7
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• 2015

In this paper, a 12-bit high resolution, power and area efficiency hybrid digital pulse width modulator (DPWM) with process and temperature (PT) calibration has been proposed for digital controlled DC-DC converters. The hybrid structure of DPWM combines a 6-bit differential tapped delay line ring-mux digital-to-time converter (DTC) schema and a 6-bit counter-comparator DTC schema, resulting in a power and area saving solution. Furthermore, since the 6-bit differential delay line ring oscillator serves as the clock to the high 6-bit counter-comparator DTC, a high frequency clock is eliminated, and the power is significantly saved. In order to have a simple delay cell and flexible delay time controllability, a voltage controlled inverter is adopted to build the deferential delay cell, which allows fine-tuning of the delay time. The PT calibration circuit is composed of process and temperature monitors, two 2-bit flash ADCs and a lookup table. The monitor circuits sense the PT (Process and Temperature) variations, and the flash ADC converts the data into a digital code. The complete circuits design has been verified under different corners of CMOS 0.18um process technology node.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.318-330
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• 2013

This paper presents a high-linearity low-noise small-size programmable gain amplifier (PGA) based on a new low-noise low-distortion differential amplifier and a proposed reconfiguration technique. The proposed differential amplifier combines an inverter-based differential pair with an adaptive biasing circuit to reduce noise and distortion. The reconfiguration technique saves the chip size by half by utilizing the same differential pair for the input transconductance and load-stage, interchangeably. Fabricated in $0.18-{\mu}m$ CMOS, the proposed PGA shows a dB-linear control range of 21dB in 16 steps from -11 dB to 10 dB with a gain error of less than ${\pm}0.33$ dB, an IIP3 of 7.4~14.5 dBm, a P1dB of -7~1.2 dBm, a noise figure of 13dB, and a 3-dB bandwidth of 270MHz at the maximum gain, respectively. The PGA occupies a chip area of $0.04mm^2$ and consumes only 1.3 mA from the 1.8 V supply.