• Journal of Sensor Science and Technology
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• v.28 no.1
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• pp.17-22
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• 2019

As CMOS technology scales down, reliability is becoming an important concern for VLSI designers. This paper analyzes gate-oxide breakdowns (i.e., the time-dependent dielectric-breakdown (TDDB) aging effect) as a reliability issue for combinational circuits with 45-nm technology. This paper shows simulation results for the noise margin, delay, and power using a single inverter-chain circuit, as well as the International Symposium on Circuits and Systems (ISCAS)'85 benchmark circuits. The delay and power variations in the presence of TDDB are also discussed in the paper. Finally, we propose a novel method to compensate for the logic failure due to dielectric breakdowns: We used a higher supply voltage and a negative ground voltage for the circuit. The proposed method was verified using the ISCAS'85 benchmark circuits.

• Journal of Korea Society of Digital Industry and Information Management
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• v.19 no.2
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• pp.11-25
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• 2023

With the increasing advancement of VLSI technology, health care system is also developing to serve the humanity with better care. Therefore, biomedical implantable devices are one of the amazing important invention of scientist to collect data from the body cell for the diagnosis of diseases without any pain. This Biomedical implantable transceiver circuit has several important issues. Oscillator is one of them. For the design flexibility and complete transistor-based architecture ring oscillator is favorite to the oscillator circuit designer. This paper represents the design and analysis of the a 9-stage CMOS ring oscillator using cadence virtuoso tool in 180nm technology. It is also designed to generate the carrier signal of 403.5MHz frequency. Ring oscillator comprises of odd number of stages with a feedback circuit forming a closed loop. This circuit was designed with 9-stages of delay inverter and simulated for various parameters such as delay, phase noise or jitter and power consumption. The average power consumption for this oscillator is 9.32㎼ and average phase noise is only -86 dBc/Hz with the source voltage of 0.8827V.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.2 s.117
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• pp.213-218
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• 2007

In this paper, we propose the design and fabrication on high frequency CMOS VCO for DS-UWB(Direct-Sequence Ultra-WideBand) applications using 0.18 ${\mu}m$ process. The complementary cross-coupled LC oscillator architecture which is composed of PMOS, NMOS symmetrically, is designed for improving the phase noise characteristic. The resistor is used instead of current source that reduce the 1/f noise of current source. The high-speed buffer is needed for measuring the output characteristic of VCO using spectrum analyzer, therefore the high-speed inverter buffer is designed with VCO. A fabricated core VCO size is $340{\mu}m{\times}535{\mu}m$. The VCO is tunable between 7.09 and 7.52 GHz and has a phase noise lower than -107 dBc/Hz at 1-MHz offset over entire tuning range. The measured harmonic suppression is 32 dB. The VCO core circuit draws 2.0 mA from a 1.8 V supply.

• Proceedings of the KIEE Conference
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• 2003.11b
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• pp.79-82
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• 2003

This paper describes a new low-swing inverter for low power consumption. To reduce a power consumption, an output voltage swing is in the range from 0 to $V_{ref}-V_{TH}$, where $V_{ref}=V_{DD}-nV_{TH}$. This can be done by the inverter structure that allow a full swing or a swing on its input terminal without leakage current. Using this low-swing voltage technology, we propose a low-power $4\times4$ bit parallel multiplier. The proposed circuits are simulated with HSPICE under $0.35{\mu}m$ CMOS standard technology. Compare to the previous works, this circuit can reduce the power consumption rate of 11.2% and the power-delay product of 10.3%.

• Journal of Sensor Science and Technology
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• v.33 no.3
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• pp.134-138
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• 2024

In this study, we propose a ternary D flip-flop using tristate ternary inverters for an energy-efficient ternary circuit design of sequential logic. The tristate ternary inverter is designed by adding the functionality of the transmission gate to a standard ternary inverter without an additional transistor. The proposed flip-flop uses 18.18% fewer transistors than conventional flip-flops do. To verify the advancement of the proposed circuit, we conducted an HSPICE simulation with CMOS 28 nm technology and 0.9 V supply voltage. The simulation results demonstrate that the proposed flip-flop is better than the conventional flip-flop in terms of energy efficiency. The power consumption and worst delay are improved by 11.34% and 28.22%, respectively. The power-delay product improved by 36.35%. The above simulation results show that the proposed design can expand the Pareto frontier of a ternary flip-flop in terms of energy consumption. We expect that the proposed ternary flip-flop will contribute to the development of energy-efficient sensor systems, such as ternary successive approximation register analog-to-digital converters.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2017.05a
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• pp.200-201
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• 2017

This paper introduces the SPICE simulation results of 3D sequential inverter considering electrical coupling. TCAD data and the SPICE data are compared to verify that the electrical coupling is well considered by using BSIM-IMG for the upper NMOS and LETI-UTSOI model for the lower PMOS. When inter layer dielectric is small, it is confirmed that electrical coupling is well reflected in the top transistor $I_{ds}-V_{gs}$ characteristics according to the change of the bottom transistor gate voltage.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.281-284
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• 2001

This paper describes an analog multi-phase delay-locked loop (DLL) to solve the harmonic lock problem using current-starved inverter and shunt-capacitor delay cell. The DLL can be used not only as an internal clock buffer of microprocessors and memory It's but also as a multi-phase clock generator for gigabit serial interfaces. The proposed circuit was simulated in a 0.25${\mu}{\textrm}{m}$ CMOS technology to solve harmonic lock problem and to realize fast lock-on time and low-jitter we verified time interval less than 40 ps as the simulation results.

• Journal of Radiation Industry
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• v.6 no.1
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• pp.31-40
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• 2012

There are two methods to fabricate the readout electronic to a large-area CMOS image sensor (LACIS). One is to design and manufacture the sensor part and signal processing electronics in a single chip and the other is to integrate both parts with bump bonding or wire bonding after manufacturing both parts separately. The latter method has an advantage of the high yield because the optimized and specialized fabrication process can be chosen in designing and manufacturing each part. In this paper, LACIS chip, that is optimized design for the latter method of fabrication, is presented. The LACIS chip consists of a 3-TR pixel photodiode array, row driver (or called as a gate driver) circuit, and bonding pads to the external readout ICs. Among 4 types of the photodiode structure available in a standard CMOS process, $N_{photo}/P_{epi}$ type photodiode showed the highest quantum efficiency in the simulation study, though it requires one additional mask to control the doping concentration of $N_{photo}$ layer. The optimized channel widths and lengths of 3 pixel transistors are also determined by simulation. The select transistor is not significantly affected by channel length and width. But source follower transistor is strongly influenced by length and width. In row driver, to reduce signal time delay by high capacitance at output node, three stage inverter drivers are used. And channel width of the inverter driver increases gradually in each step. The sensor has very long metal wire that is about 170 mm. The repeater consisted of inverters is applied proper amount of pixel rows. It can help to reduce the long metal-line delay.

• The Journal of the Korea institute of electronic communication sciences
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• v.10 no.8
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• pp.883-890
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• 2015

As the semiconductor processing technology has been developing, multiple cores or NoC(network on chip) can be contained in recent chips. GALS(globally asychronous locally synchronous) clocking scheme that has multi-clock domains with different frequencies or phase differences is widely used to solve power consumption and clock skew in a large chip with a single clock. A synchronizer is needed to avoid a synchronization problem between sender and receiver in GALS. In this paper, the setup and hold time of DFF required to design the synchronizer are measured using 180nm CMOS processing parameters depending on temperature, supply voltage, and the size of inverter in DFF. The simulation results based on the bisection method in HSPICE show that the setup and hold time are proportional to temperature, however they are inversely proportional to supply voltage, and negative values are measured for the hold time.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.9
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• pp.54-58
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• 2007

Development of high performance LTPS TFTs contributed to open up new SOP technology with various digital circuits integrated in display panels. This work introduces the current mode logic(CML) gate design method with which one can replace slow CMOS logic gates. The CML inverter exhibited small logic swing, fast response with high power consumption. But the power consumption became compatible with CMOS gates at higher clock speed. Due to small current values in CML, layout area is smaller than the CMOS counterpart even though CML uses larger number of devices. CML exhibited higher noise immunity thanks to its non-inverting and inverting outputs. Multi-input NAND/AND and NOR/OR gates were implemented by the same circuit architecture with different input confirugation. Same holds for MUX and XNOR/XOR CML gates. We concluded that the CML gates can be designed with few simple circuits and they can improve power consumption, chip area, and speed of operation.