• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.6
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• pp.742-750
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• 2018

In this paper, in order to enable zero-layer FTP cell using only 5V MOS devices on the basis of $0.13{\mu}m$ BCD process, the tunnel oxide thickness is used as the gate oxide thickness of $125{\AA}$ of the 5V MOS device at 82A. The HDNW layer, which is the default in the BCD process, is used. Thus, the proposed zero layer FTP cell does not require the addition of tunnel oxide and DNW mask. Also, from the viewpoint of memory IP design, a single memory structure which is used only for trimming analog circuit of PMIC chip is used instead of the dual memory structure dividing into designer memory area and user memory area. The start-up circuit of the BGR (Bandgap Reference Voltage) generator circuit is designed to operate in the voltage range of 1.8V to 5.5V. On the other hand, when the 64-bit FTP memory IP is powered on, the internal read signal is designed to maintain the initial read data at 00H. The layout size of the 64-bit FTP IP designed using the $0.13-{\mu}m$ Magnachip process .is $485.21{\mu}m{\times}440.665{\mu}m$($=0.214mm^2$).

• Journal of IKEEE
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• v.28 no.2
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• pp.204-208
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• 2024

In this paper, we propose an ESD protection circuit that applies structural changes to LVTSCR, a general low-voltage ESD protection circuit, to improve the current driving capability (IEC-ESD) characteristics of the ESD protection circuit. Power consumption was minimized by separating the area where the electric field and ESD current path are formed in the LVTSCR structure, and the electrical characteristics were analyzed and current driving characteristics were improved. Structural problems resulting from deterioration of system level characteristics were analyzed through simulation, and the characteristics were verified by reflecting this. The electrical characteristics of the proposed ESD protection circuit were verified using a TCAD simulator and analyzed through HBM modeling and system level modeling. In addition, silicon production and HBM 10kV characteristics were verified through DB-Hitek 0.18um BCD process.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.9
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• pp.1858-1864
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• 2009

In this paper, we design a non-volatile memory IP, 1-kb one-time programmable (OTP) memory, used for power management ICs. Since a conventional OTP cell uses an isolated NMOS transistor as an antifuse, there is an advantage of it big cell size with the BCD process. We use, therefore, a PMOS transistor as an antifuse in lieu of the isolated NMOS transistor and minimize the cell size by optimizing the size of a OTP cell transistor. And we add an ESD protection circuit to the OTP core circuit to prevent an arbitrary cell from being programmed by a high voltage between the terminals of the PMOS antifuse when the ESD test is done. Furthermore, we propose a method of turning on a PMOS pull-up transistor of high impedance to eliminate a gate coupling noise in reading a non-programmed cell. The layout size of the designed 1-kb PMOS-type antifuse OTP IP with Dongbu's $0.18{\mu}m$ BCD is $129.93{\times}452.26{\mu}m^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.1
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• pp.1-6
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• 2009

The holding voltage of high-voltage devices under the snapback breakdown condition has been known to be much smaller than the operating voltage. Such characteristics cause high-voltage ICs to be susceptible to the transient latch-up failure in the practical system applications, especially when these devices are used as the ESD(ElectroStatic Discharge) power clamp circuit. A new latchup-free design of the ESD power clamp circuit with stacked-bipolar devices is proposed and successfully verified in a $0.35{\mu}m$ 3.3V/60V BCD(Bipolar-CMOS-DMOS) process to achieve the desired ESD level. The total holding voltage of the stacked-bipolar devices in the snapback breakdown condition can be larger than the operating voltage. Proposed power clamp operates safely because of the high holding voltage. From the measurement on the devices fabricated using a $0.35{\mu}m$ BCD Process, it was observed that the proposed ESD power clamp can provide 800% higher ESD robustness per silicon area as compared to the conventional clamps with a high-voltage diode.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.1
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• pp.627-633
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• 2015

We designed of a LDO regulator with a OVP and UVLO protection function for a PMIC. Proposed LDO regulator circuit consists of a BGR reference circuit, an error amplifier and a power transistor and so on. The proposed LDO regulator is designed for low voltage input power protection. Proposed LDO circuit generated fixed 2.5 V from a supply of 3.3V. It was designed with 3.3 V power supply using a $0.35{\mu}m$ CMOS technology. SPICE simulation results showed that the proposed circuit provides 0.713 mV/V line regulation with output 2.5 V ~ 3.9 V and $8.35{\mu}V/mA$ load regulation with load current 0 mA to 40 mA.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.3
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• pp.1700-1706
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• 2014

In this paper, a step down converter for LED backlight of mobile application has been proposed. The converter which is operated with 4 MHz high switching frequency is capable of reducing mounting area of passive devices consists of a power stage and a control block. Circuit elements of the power stage are inductor, output capacitor, MOS transistors and feedback resistors. The control block consists of pulse width modulator, error amplifier and oscillator etc. Proposed step down converter has been designed and verified using a $0.35{\mu}m$ 1-poly 4-metal BCD process technology. Simulation results show that the output voltage is 1.8 V in 3.7 V input voltage, output current 100 mA which is larger than 25 ~ 50 mA in conventional 500 KHz driven converter when the duty ratio is 0.4.

• Proceedings of the KIPE Conference
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• 2007.07a
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• pp.271-273
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• 2007

본 논문에서는 TV나 Audio등에 사용되는 2채널 30W급 Class-D amplifier를 동부하이텍의 0.35um BD350BA 공정을 사용하여 디지털 방식의 Class-D amplifier 출력단 구동에 적합하도록 설계하였다. 출력단은 Bootstrap 전원을 사용한 N-N type의 30V LDMOS 내장형이며 각각 $250m{\Omega}$의 턴 온 저항을 갖게 설계 되었다. THD+N 특성개선을 위한 Dead time 및 Delay 조정회로를 내장하였으며 보호회로로는 Over current, Over temperature, UVLO 가 있다.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.12 no.2
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• pp.150-154
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• 2019

In the design of semiconductor integrated circuits, ESD is one of the important issues related to product quality improvement and reliability. In particular, as the process progresses and the thickness of the gate oxide film decreases, ESD is recognized as an important problem of integrated circuit design. Many ESD protection circuits have been studied to solve such ESD problems. In addition, the proposed device can modify the existing SCR structure without adding external circuit to effectively protect the gate oxide of the internal circuit by low trigger voltage, and prevent the undesired latch-up phenomenon in the steady state with high holding voltage. In this paper, SCR-based novel ESD(Electro-Static Discharge) device with the high holding voltage has been proposed. The proposed device has the lower triggering voltage without an external trigger circuitry and the high holding voltage to prevent latch-up phenomenon during the normal condition. Using TCAD simulation results, not only the design factors that influence the holding voltage, but also comparison of conventional ESD protection device(ggNMOS, SCR), are explained. The proposed device was fabricated using 0.35um BCD process and was measured electrical characteristic and robustness. In the result, the proposed device has triggering voltage of 13.1V and holding voltage of 11.4V and HBM 5kV, MM 250V ESD robustness.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.5
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• pp.71-79
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• 2010

This paper presents a design of a LLC resonant controller IC. LLC resonant controller IC controls the voltage of the 2nd side by adjusting frequency the input frequency of the external resonant circuit. The clock generator is integrated to provide the pulse to the resonant circuit and its frequency is controlled by the external resistor. Also, the frequency of the VCO is adjusted by the feedback voltage. The protection circuits such as UVLO(Under Voltage Lock Out), brown out, fault detector are implemented for the reliable and stable operation. The HVG, and LVG drivers can provide the high current and voltage to the IGBT. The designed LLC resonant controller IC is fabricated with the 0.35 um 2P3M BCD process. The overall die size is $1400um{\times}1450um$, and supply voltage is 5V, 15V.

• Korean Journal of Optics and Photonics
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• v.19 no.1
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• pp.60-67
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• 2008

An all-optical 4-bit Gray code to binary coded decimal (BCD) converter by means of commercially available numerical analysis tool (VPI) was demonstrated, for the first time to our knowledge. Circuit design approach was modified appropriately in order to fit the electrical method on an all-optical logic circuit based on a cross gain modulation (XGM) process so that signal degradation due to the non-ideal optical logic gates can be minimized. Without regenerations, Q-factor of around 4 was obtained for the most severely degraded output bit (least significant bit-LSB) with 2.5 Gbps clean input signals having 20 dB extinction ratio. While modifying the two-level simplification method and Karnaugh map method to design a Gray code to BCD converter, a general design concept was also founded (one-level simplification) in this research, not only for the Gray code to BCD converter but also for any general applications.