• Title/Summary/Keyword: Automotive electronic module

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Epoxy solder paste and its applications (에폭시 솔더 페이스트 소재와 적용)

  • Moon, Jong-Tae;Eom, Yong-Sung;Lee, Jong-Hyun
    • Journal of Welding and Joining
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    • v.33 no.3
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    • pp.32-39
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    • 2015
  • With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

Study on the Design of Power MOSFET with ESD Protection Circuits (Zener ESD 보호회로 내장 전력 MOSFET 최적 설계)

  • Nahm, Eui-Seok;Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.28 no.9
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    • pp.555-560
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    • 2015
  • This paper was proposed 900 V Power MOSFET with ESD protection circuits using zener diodes. And we were carried out and analyzed its electrical characteristics. As a result of designing 900 V power MOSFET, we obtained 1,000 V breakdown voltage, 3.49 V threshold voltage and $0.249{\Omega}{\cdot}cm^2$. And we designed ESD circuits using 2 series zener diode and 4 series zener diodes. After analyzing electrical characteristics, we obtained 26 V forward voltage drop and 47 V breakdown voltage. Therefore, This devices can enoughly use power module, SMPS and Automotive.

Development and Optimization of Engine Module for Hybrid System Simulator (하이브리드 시스템 시뮬레이터용 엔진 모듈 개발과 최적화에 관한 연구)

  • Jeon, Dae-Il;Gong, Ho-Jeong;Hwang, In-Goo;Myung, Cha-Lee;Park, Sim-Soo
    • Transactions of the Korean Society of Automotive Engineers
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    • v.18 no.1
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    • pp.14-22
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    • 2010
  • Hybrid Electronic Vehicle (HEV) is one of the solutions of high oil price and environment problem. Recently, study of HEV is important for automobile industry. However HEV has a lot of components and there are many cases for assembling, it's impossible to test results from assembling by using real vehicles. To solve this problem, hybrid system simulator is required. The purpose of this study is to develop and optimize of engine module for hybrid system simulator. The commercial 1-D engine simulation program, WAVE is used to get the engine capacity and performance data and 1-D simulation model of base engine is compared with engine experiment results. Using the data, the engine module is developed based on the MATLAB Simulink. There are blocks of base engine, Single-CVVT engine and Dual-CVVT engine. The effect of acceleration and deceleration is applied to each engine block. In addition, the control and processing logics for CIS technology are developed. Finally the simulator operates FTP-72 mode test.

AUTOSAR-ready Light Software Architecture for Automotive Embedded Control Systems (차량용 전자제어시스템을 위한 AUTOSAR 대응 경량화 소프트웨어 아키텍처 연구)

  • Lee, Kangseok;Park, Inseok;SunWoo, Myoungho;Lee, Wootaik
    • Transactions of the Korean Society of Automotive Engineers
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    • v.21 no.1
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    • pp.68-77
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    • 2013
  • This paper presents AUTOSAR-ready light software architecture (AUTOSAR-Lite), which is a light weighted version of the AUTOSAR, for automotive embedded control systems. The proposed AUTOSAR-Lite reduces overhead problems caused by the excessive standard specifications of AUTOSAR. Concurrently, AUTOSAR-Lite keeps advantages of AUTOSAR such as a scalability, re-usability, reliability, and transferability. The fundamental design of AUTOSAR-Lite is originated from the AUTOSAR standard. AUTOSAR-Lite is composed of three layers such as an application software, runtime environment, and basic software layer. The application software layer adopts component-based design methodology as AUTOSAR. The runtime environment layer integrates interfaces between application and basic software layers. In case of the basic software layer, restrictions of the module configurations and interfaces of basic software are minimized. In order to validate the feasibility of AUTOSAR-Lite, a software design result based on AUTOSAR-Lite software architecture for electronic throttle control (ETC) system is suggested.

Development of a Body Network System with GSEK/VDX Standards and CAN Protocol (OSEK/VDX 표준과 CAN 프로토콜을 사용한 차체 네트웍 시스템 개발)

  • 신민석;이우택;선우명호;한석영
    • Transactions of the Korean Society of Automotive Engineers
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    • v.10 no.4
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    • pp.175-180
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    • 2002
  • In order to satisfy the requirements of time reduction and cost saving for development of electronic control systems(ECU) in automotive industry, the applications of a standardized real-time operating system(RTOS) and a communication protocol to ECUs are increased. In this study, a body control module(BCM) that employs OSEK/VDX(open system and corresponding interfaces for automotive electronics/vehicle distributed executive) OS tour the RTOS and a controller area network(CAN) fur the communication protocol is designed, and the performances of the system are evaluated. The BCM controls doors, mirrors, and windows of the vehicle through the in-vehicle network. To identify all the transmitted and received control messages, a PC connected with the CAN communication protocol behaves as a CAN bus emulator. The control system based upon in-vehicle network improves the system stability and reduces the number of wiring harness. Furthermore it is easy to maintain and simple to add new features because the system is designed based on the standards of RTOS and communication protocol.

Experimental Study on the Radiative and Convective Cooling of Electronic Modules opposed to a Heated Vertical Plate (가열 수직 평판과 마주보는 전자모듈의 복사 및 대류 냉각에 대한 실험적 고찰)

  • Choi, In-Su
    • Journal of the Korean Society of Industry Convergence
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    • v.8 no.2
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    • pp.105-112
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    • 2005
  • The characteristics of natural convection heat transfer combined with radiation in a vertical parallel plates has been investigated experimentally. The vertical channel is consisted with a heated wall and three protruding heating sources attached on the opposite wall. The cooling of modules has been experimented with heating the wall as well as modules themselves at different aspects ratios and heating fluxes. As the location of module is higher, the temperature becomes higher, but the increasement is smaller. When the aspect ratio is lower than 26, its effect on the temperature is not significant rather than that of the radiation heat transfer. Furthermore, the correlation of Nusselt number with the Rayleigh number are attempted, but additional treatment is needed to accomodate the cases of heating module and/or opposite wall.

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An Experimental Study on Cooling Characteristic according to Fin Array of Aluminum Heat Sink (히트싱크의 핀 배열에 따른 냉각특성에 관한 실험적 연구)

  • Yoon, Sung-Un;Kim, Jae-Yeol;Gao, Jia-Chen
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.1
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    • pp.138-143
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    • 2018
  • In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.

Characteristics of Joint Between Ag-Pd Thick Film Conductor and Solder Bump and Interfacial Reaction (Ag-Pd 후막도체와 솔더범프 사이의 접합특성 및 계면반응)

  • 김경섭;한완옥;이종남;양택진
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.1
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    • pp.1-6
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    • 2004
  • The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the ECM(Engine Control Module) alumina substrate and the intermetallic compound layer between Sn-37wt%Pb solder and pad joints after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, conductor pad roughness were increased from 304 nm to 330 nm. $Cu_6/Sn_5$ formed during initial reflow process at the interface between TiWN/Cu pad and solder grew by the succeeding reflow process, so the grains became coarse. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about 0.1∼0.6 $\mu\textrm{m}$. And a needle-shaped was also observed at the inside of the solder.

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Design of CAN Communication Interface possible for Error Detection that use for Embedded System (오류검출이 가능한 임베디드 시스템용 CAN통신 인터페이스 설계)

  • Ahn, Jong-Young;Kim, Sung-Su;Kim, Young-Ja;Park, Sang-Jung;Hur, Kang-In
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.10 no.1
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    • pp.69-74
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    • 2010
  • Now the CAN(controller Area Network) is using electronic modules as a serial communication which is very robust to noise. Especially the CAN is using for automotive part that very popular in which automotive electronic control module, engine controller unit, sensor modules, etc. but the CAN has the order of priority to linking node and also has fault confinement so using in these features that is applied to in factory automation product line. The CAN communication is basically very robust to electric noise so varied applying to others part. In this paper, we suggest to CAN interface for embedded system that is possible for error detection using two CAN nodes on Hi-speed, full-CAN.

Speech Recognition System in Car Noise Environment (자동차 잡음환경에서의 음성인식시스템)

  • Kim, Soo-Hoon;Ahn, Jong-Young
    • Journal of Digital Contents Society
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    • v.10 no.1
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    • pp.121-127
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    • 2009
  • The automotive ECU(Electronic Control Unit) becomes more complicated and is demanding many functions. For example, many automobile companies are developing driver convenience systems such as power window switch, LCM(Light Control Module), mirror control system, seat memory. In addition, many researches and developments for DIS(Driver Information System) are in progress. It is dangerous to operate such systems in driving. In this paper, we implement the speech recognition system which controls the car convenience system using speech, and apply the preprocessing filter to improve the speech recognition rate in car noise environment. As a result, we get the good speech recognition rate in car noise environment.

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