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http://dx.doi.org/10.14775/ksmpe.2018.17.1.138

An Experimental Study on Cooling Characteristic according to Fin Array of Aluminum Heat Sink  

Yoon, Sung-Un (Dept. of Mechanical Engineering, Chosun University)
Kim, Jae-Yeol (Dept. of Mechanical System & Automotive Engineering, Chosun University)
Gao, Jia-Chen (Dept. of Mechanical System Engineering, Graduate School of Chosun University)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.17, no.1, 2018 , pp. 138-143 More about this Journal
Abstract
In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.
Keywords
Aluminium Heat Sink; Natural Convection; Fin Array; Cooling Characteristic; Thermoelectric Module;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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