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Y.-S. Eom, J.-H. Son, K.-S. Jang, H.-S. Lee, H.-C. Bae, K.-S. Choi and H.-S. Choi, Characterization of fluxing and hybrid underfills with micro-encapsulated catalyst for long pot life, ETRI Journal, 36(3) (2014), 343-351
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ScienceOn
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Y.-S. Eom, K.-S. Jang, J.-T. Moon and J.-D. Nam, Electrical interconnection with a smart ACA composed of fluxing polymer and solder powder, ETRI Journal, 32(3) (2010), 414-420
DOI
ScienceOn
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3 |
Y.-S. Eom, J.-W. Back, J.-T. Moon, J.-D. Nam and J.-M. Kim, Characterization of polymer matrix and low melting point solder for anisotropic conductive film, Microelectron. Eng., 85(2) (2008), 327-331
DOI
ScienceOn
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4 |
J.-W. Baek, K.-S. Jang, Y.-S. Eom, J.-T Moon, J.-M. Kim and J.-D. Nam, Chemo-rheological characteristic of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder, Microelectron. Eng., 87-10 (2010), 1968-1972
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5 |
K.-S. Jang, Y.-S. Eom, J.-T. Moon, Y.-S. Oh and J.-D. Nam, Catalytic behavior of Sn/Bi metal powder in anhydride- based epoxy curing, J. Nanosci. Nanotechnol., 9(12) (2009), 7461-7466
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6 |
J.-M. Kim, K. Yasuda and K. Fujimoto, Isotropic conductive adhesive with fusible filler particles, J. Electron. Mater., 33(11) (2004), 1331-1337
DOI
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7 |
J.-M. Kim, K. Yasuda and K. Fujimoto, Novel interconnection method using electrically conductive paste with fusible filler, J. Electron. Mater., 34(5) (2005), 600-604
DOI
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8 |
中國 電子素材産業協會 朱錫 Solder 素材支會 發表 資料 (in Chinese)
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9 |
中國 中企週硏, 2012-2015 資料 (in Chinese)
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Y.-H. Ko, M.-S. Kim, T.-S. Kim, J.-H. Bang and C.-W. Lee, Study on joint of micro solder bump for application of flexible electronics, Journal of KWJS, 31(3) (2013), 4-10 (in Korean)
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11 |
M.-S. Kang, J.-H Bang and C.-W. Lee, Joint reliability of Sn3.5Ag, Sn0.7Cu and Sn0.5Sb Pb-free solder and hybrids joining process for application of automobile electric module, Journal of KWJS, 30(6) (2012), 487- 491 (in Korean)
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12 |
Y.-H. Ko, J.-H. Bang, J.-H. Kim and C.-W. Lee, Evaluation of property and reliability of Sn3.5Ag and Sn0.7Cu Pb-free solder joint by complex vibration for application of automobile electric module, Journal of KWJS, 31(1) (2013), 6-10 (in Korean)
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13 |
W. S. Hong and C. M. Oh, Degradation behavior of solder joint and implementation technology for lead-free automotive electronics, Journal of KWJS, 31(3) (2013), 22-30 (in Korean)
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14 |
A. Y. Kim and W. S. Hong, Degradation characteristics of eutectic and Pb-free solder joint of electronics mounted for automobile engine, Journal of KWJS, 32(3) (2014), 288-294 (in Korean)
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15 |
E. George and M. Pecht, Tin whisker analysis of an automotive engine control unit, Microelectron. Relab., 54(1) (2014), 214-219.
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ScienceOn
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