• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.3
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• Journal of Engineering Education Research
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• v.2 no.1
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• pp.10-16
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• 1999

In this paper, we developed the internet-based educational software package (DVLab) for design and virtual experiment of the digital logic circuits. The DVLab consists of the LogicSim module for design and simulation of digital combinational/sequantial logic circuits, micro-controller application circuits and the BreadBoard module for virtual experiment and the Theory module for lecture and the Report/ReportChecker module and some other utility modules. All developed modules can be run as application programs as well as applets in the Internet. The LogicSim and the BreadBoard support real time clock function, output verification function on the designed circuits, trace function of logic values, copy-protection function of designed circuits and provide various devices including logic gates, TTLs, LED, buzzer, and micro-controller. The educational model of digital logic circuit design and experiment using the DVLab is also presented in this paper.

• Journal of KIISE:Computer Systems and Theory
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• v.32 no.2
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• pp.75-84
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• 2005

This research is to design a high performance NAND-type flash memory package with a smart buffer cache that enhances the exploitation of spatial and temporal locality. The proposed buffer structure in a NAND flash memory package, called as a smart buffer cache, consists of three parts, i.e., a fully-associative victim buffer with a small block size, a fully-associative spatial buffer with a large block size, and a dynamic fetching unit. This new NAND-type flash memory package can achieve dramatically high performance and low power consumption comparing with any conventional NAND-type flash memory. Our results show that the NAND flash memory package with a smart buffer cache can reduce the miss ratio by around 70% and the average memory access time by around 67%, over the conventional NAND flash memory configuration. Also, the average miss ratio and average memory access time of the package module with smart buffer for a given buffer space (e.g., 3KB) can achieve better performance than package modules with a conventional direct-mapped buffer with eight times(e.g., 32KB) as much space and a fully-associative configuration with twice as much space(e.g., 8KB)

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.21-26
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• 2004

In this paper, a direct method is developed to extact RF equivalent circuit of a packaged BJT without optimization. First, parasitic components of plastic package are removed from measured S-parameters using open and short package patterns. Using package do-embedded S-parameters, a direct and simple method is proposed to extract bonding wire inductance and chip pad capacitance between package lead and chip pad. The small-signal model parameters of internal BJT are next determined by Z and Y-parameter formula derived from RF equivalent circuit. The modeled S-parameters of packaged BJT agree well with measured ones, verifying the accuracy of this new extraction method.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.11
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• pp.1291-1298
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• 2007

A novel 1:4 unequal wilkinson power divider using rectangular-shaped defected ground structure(DGS) in double layered substrate is proposed for removing the ground problem of DGS in packaging. Rectangular-shared DGS produces the transmission line having much higher characteristic impedance than standard microstrip line. The proposed unequal divider is composed of DGS and double layered substrate in order to be free from the ground problem of DGS patterns in packaging in metal housings. The second substrate is attached to the first substrate which contains DGS pattern on its ground plane at the bottom side to form the double layered substrate. In order to show the validity of the proposed DGS in the double layered substrate, a 1:4 unequal power divider is designed and measured. The predicted and measured performances are shown with an excellent agreement between them.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.9
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• pp.1098-1106
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• 2007

This paper presents active antenna diplexers implemented into an ultra-wideband CPW(Coplanar Waveguide) fed monopole antennas. The proposed active antenna diplexer is designed to direct interconnect the output port of a wideband antenna to the input port of two active(HEMT) devices, where the impedance matching conditions of the proposed active integrated antenna are optimized by adjusting CPW(Coplanar Waveguide) feed line to be the length of 1/20 $\lambda_0$(@5.8 GHz) in planar type wideband antenna. The measured bandwidth of the active integrated antenna shows the range from 2.0 GHz to 3.1 GHz and from 5.25 GHz to 5.9 GHz. The measured peak gains are 17.0 dB at 2.4 GHz and 15.0 dB at 5.5 GHz.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.35-41
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• 1998

A transient chirp measurement was used to analyze the chirping characteristics of modulator integrated DFB (MI-DFB) laser module. This method measures the wavelength change due to a small variation in modulation with bias. The measurement system includes a monochrometer and digitizing oscilloscope. The chirping characteristics due to packaging influences can also be accounted for. The chirp parameter calculated using this method was compared with the peak-to peak chirp. They showed the same tendency with modulator bias voltage. These results can be used as a reference when optimizing system parameters.

• Journal of the Korean Institute of Telematics and Electronics
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• v.17 no.6
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• pp.51-57
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• 1980

Any switching function can be constructed with universal building block of MAND gate. Threelevel AND-NOT logic networks with only true inputs are called TANT networks. Systematic approach to TANT minimization starts from the UF type minterm with the smallest subscript and ends when UF type minterms are all covered. Optinal PEI is composed of CPPI or EPPi without C-C table. The algorithm in this work is usful in solving TANT optimization porblem of four or five variables by hand solution. When variable are six or more, it is required to be solved by computer, A CAD software package of this algorithm with FORTRAN IV language is made to solve such problems.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.6
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• pp.18-26
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• 1999

This paper presents the architecture and design of a DSSS MODEM ASIC chip for wireless local area networks (WLAN). The implemented MODEM chip supports the DSSS physical layer specifications of the IEEE 802.11. The chip consits of a transmitter and a receiver which contain a CRC encoder/decoder, a differential encoder/decoder, a frequency offset compensator and a timing recovery circuit. The chip supports various data rates, i.e., 4,2 and 1Mbps and provides both DBPSK and DQPSK for data modulation. We have performed logic synthesis using the $SAMSUNG^{TM}$ $0.6{\mu}m$ gate array library and the implemented chip consists of 53,355 gates. The MODEM chip operates at 44MHz, the package type is 100-pin QFP and the power consumption is 1.2watt at 44MHz. The implemented MODEM architecture shows lower BER compared with the Harris HSP3824.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.12 s.354
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• pp.23-32
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• 2006

Fast and accurate power bus design (FAPUD) method for multi-layers high-speed digital boards is devised for the power supply network design tool for accurate and precise high speed board. FAPUD is constructed, based on two main algorithms of the PBEC (Path Based Equivalent Circuit) model and the network synthesis method. The PBEC model exploits simple arithmetic expressions of the lumped 1-D circuit model from the electrical parameters of a 2-D power distribution network. The circuit level design based on PBEC is carried with the proposed regional approach. The circuit level design directly calculates and determines the size of on-chip decoupling capacitors, the size and the location of off-chip decoupling capacitors, and the effective inductances of the package power bus. As a design output, a lumped circuit model and a pre-layout of the power bus including a whole decoupling capacitors are obtained after processing FAPUD. In the tuning procedure, the board re-optimization considering simultaneous switching noise (SSN) added by I/O switching can be carried out because the I/O switching effect on a power supply noise can be estimated over the operation frequency range with the lumped circuit model. Furthermore, if a design changes or needs to be tuned, FAPUD can modify design by replacing decoupling capacitors without consuming other design resources. Finally, FAPUD is accurate compared with conventional PEEC-based design tools, and its design time is 10 times faster than that of conventional PEEC-based design tools.