Browse > Article

Novel Power Bus Design Method for High-Speed Digital Boards  

Wee, Jae-Kyung (SoongSil University)
Publication Information
Abstract
Fast and accurate power bus design (FAPUD) method for multi-layers high-speed digital boards is devised for the power supply network design tool for accurate and precise high speed board. FAPUD is constructed, based on two main algorithms of the PBEC (Path Based Equivalent Circuit) model and the network synthesis method. The PBEC model exploits simple arithmetic expressions of the lumped 1-D circuit model from the electrical parameters of a 2-D power distribution network. The circuit level design based on PBEC is carried with the proposed regional approach. The circuit level design directly calculates and determines the size of on-chip decoupling capacitors, the size and the location of off-chip decoupling capacitors, and the effective inductances of the package power bus. As a design output, a lumped circuit model and a pre-layout of the power bus including a whole decoupling capacitors are obtained after processing FAPUD. In the tuning procedure, the board re-optimization considering simultaneous switching noise (SSN) added by I/O switching can be carried out because the I/O switching effect on a power supply noise can be estimated over the operation frequency range with the lumped circuit model. Furthermore, if a design changes or needs to be tuned, FAPUD can modify design by replacing decoupling capacitors without consuming other design resources. Finally, FAPUD is accurate compared with conventional PEEC-based design tools, and its design time is 10 times faster than that of conventional PEEC-based design tools.
Keywords
Partial Equivalent Electrical Circuit (PEEC); Power Distribution network (PDN); Path-Based Equivalent Circuit(PBEC);
Citations & Related Records
연도 인용수 순위
  • Reference
1 Y-J. Kim, et. al, 'An Efficient Path Based Circuit Model for Design, Synthesis, and Optimization of Power Distribution Networks in Multi-Layers Printed Circuit Board,' IEEE Trans. Adv. Packag., vol. 27, no. 1, pp. 97-106, Feb., 2004   DOI   ScienceOn
2 Y -J. Kim, J. H. Kang, et. al., 'Synthesis Method for Design of power Distribution Networks in High-Speed Digital Systems,' IEEE Conf. Elect. Perform. Electr. Packag., pp. 133-136, 2003   DOI
3 C. Ho, A. Ruehli, and P. Brennan, 'The modified nodal approximation to network analysis,' IEEE Trans. Circuits Syst., vol. CAS-22, pp. 504-509, June 1975
4 L. D. Smith, R. E. Anderson, et. al., 'Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS Technology,' IEEE Trans. Adv. Packag., vol. 22, no. 3, pp. 284-290, Aug. 1999   DOI
5 Y-J. Kim, S. Lee and J.-K Wee, 'Power distribution Network Design through Network Synthesis in High-Speed Digital Systems,' IEICE trans. on Electronics, Vol.E87-C, No.11, pp.2001-2005, Nov. 2004
6 D. Herrel and B. Becker, 'Modeling of Power Distribution Systems for High Performance Microprocessors,' IEEE Trans. Adv. Packag., vol. 22, pp. 240-248, Aug. 1999   DOI
7 N. Na, J. Choi, S. Chon, M. Swaminathan, and J. Srinivasan, 'Modeling and Transient Simulation of Plane in Electronic Packages,' IEEE Trans., Adv. Packag., vol. 23, no. 3, pp. 340-352, Aug. 2000   DOI   ScienceOn
8 Y Eo, W. R. Eisenstadt, W.Jin, J. Choi, and J. Shim,'A Compact Multulayer IC Package Model for Efficient Simulations, Analysis, and Design of High-Performance VLSI Circuits,' IEEE Trans., Adv. Packag., vol. 26, no. 4, pp. 392-401, Nov. 2003   DOI   ScienceOn
9 J -G Yook, V. Chandramouli, et al, 'Computation of Switching noise in Printed Circuit Boards,' IEEE Trans. CPMT-Part A, vo. 20, no. 1, pp.64-74, Mar., 1997   DOI   ScienceOn
10 L. D. Larry, et. al 'Power Plane SPICE Models and Simulated Performance for material and geometries,' IEEE Trans. Adv. Packag., vol.24, pp. 277-287, Aug. 2001   DOI   ScienceOn