Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Equivalent Circuit Model Parameter Extraction for Packaged Bipolar Transistors

패키지된 바이폴라 트랜지스터의 등가회로 모델 파라미터 추출

  • Lee Seonghearn (School of Electronics and Information Engineering, Hankuk University of Foreign Studies)
  • 이성현 (한국외국어대학교 전자정보공학부)
  • Published : 2004.12.01
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Abstract

In this paper, a direct method is developed to extact RF equivalent circuit of a packaged BJT without optimization. First, parasitic components of plastic package are removed from measured S-parameters using open and short package patterns. Using package do-embedded S-parameters, a direct and simple method is proposed to extract bonding wire inductance and chip pad capacitance between package lead and chip pad. The small-signal model parameters of internal BJT are next determined by Z and Y-parameter formula derived from RF equivalent circuit. The modeled S-parameters of packaged BJT agree well with measured ones, verifying the accuracy of this new extraction method.

본 논문에서는 package된 BJT의 RF 등가회로 모델을 optimization과정 없이 직접 추출하는 방법을 개발하였다. 먼저, open 과 short package 구조를 사용하여 plastic package의 기생성분을 측정된 S-파라미터로부터 정확히 제거하였다. 이와 같이 package do-embedding된 S-파라미터로부터 package lead와 chip pad 사이의 bonding wire 인덕턴스와 chip pad 캐패시턴스를 직접 추출하는 간단한 방법을 구축하였다. 그 후에 내부 BJT소자의 소신호 모델변수들은 RF 등가회로로부터 유도된 Z나 Y-파라미터 방정식을 이용하여 결정하였다. 이 방법으로 모델화된 packaged BJT의 S-파라미터는 측정 데이터와 아주 잘 일치하였으며 이는 새로운 추출방법의 정확성을 증명한다.

Keywords

References

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