• Journal of the Korea Institute of Information and Communication Engineering
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• v.22 no.7
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• pp.993-1000
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• 2018

This paper proposes a low-dropout voltage regulator(LDO) using self-cascode structure. The self-cascode structure was optimized by adjusting the channel length of the source-side MOSFET and applying a forward voltage to the body of the drain-side MOSFET. The self-cascode of the input differential stage of the error amplifier is optimized to give higher transconductance, but the self-cascode of the output stage is optimized to give higher output resistance, The proposed LDO using self-cascode structure was designed by a $0.18{\mu}m$ CMOS technology and simulated using SPECTRE. The load regulation of the proposed LDO regulator was 0.03V/A, whereas that of the conventional LDO was 0.29V/A. The line regulation of the proposed LDO regulator was 2.23mV/V, which is approximately three times improvement compared to that of the conventional LDO. The transient response of the proposed LDO regulator was 625ns, which is 346ns faster than that of the conventional LDO.

• 전자공학회논문지 IE
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• v.45 no.1
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• pp.31-37
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• 2008

A Wibro RF down converter of 2.3GHz band is designed and implemented in this paper. The problems that can occur in the receiver LNA(Low Noise Amplifier) to minimize additional purposes. In addition, 2.3GHz band from the 75 MHz downward to minimize the losses in the process, transform and improve efficiency, and achieve stable characteristics can be used to make high frequency characteristics of the device. Wibro repeater uses a TDMA(Time Division Multiplexing Access) method is needed because the RF switch. Production criterion specification, the input voltage from +8 V 1.2A of current consumption, 60dB gain and the noise figure of less than 2.5dB, VSWR(Voltage Standing Wave Ratio) less than 1.5, more than IMD(Inter Modulation Distortion) 60dB satisfied. Environmental conditions ($-20^{\circ}C$ to $70^{\circ}C$) to pass the test of reliability in a long time, that seemed crafted Wibro down converter be applied to the Wibro repeater.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.6
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• pp.39-47
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• 1998

A fourth-order $\Sigma$-$\Delta$ modulator is designed and implemented in 0.6 $\mu\textrm{m}$ CMOS technology. The modulator is verified by introducing nonlinear factors such as DC gain and slew rate in system model that determines the transfer function in S-domain and in time-domain. Dynamic range is more than 110 dB and the peak SM is 102.6 dB at a clock rate of 2.8224 MHz for voiceband signal. The structure of a ∑-$\Delta$ modulator is a modified fourth-order ∑-$\Delta$ modulator using direct feedback loop method, which improves performance and consumes less power. The transmission zero for noise is located in the first-second integrator loop, which reduces entire size of capacitors, reduces the active area of the chip, improves the performance, and reduces power dissipation. The system is stable because the output variation with respect to unit time is small compared with that of the third integrator. It is easy to implement because the size of the capacitor in the first integrator, and the size of the third integrator is small because we use the noise reduction technique. This paper represents a new design method by modeling that conceptually decides transfer function in S-domain and in Z-domain, determines the cutoff frequency of signal, maximizes signal power in each integrator, and decides optimal transmission-zero frequency for noise. The active area of the prototype chip is 5.25$\textrm{mm}^2$, and it dissipates 10 mW of power from a 5V supply.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.9
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• pp.63-73
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• 2015

This work proposes a 2-channel time-interleaved (T-I) 10b 120MS/s pipeline SAR ADC minimizing offset mismatch between channels without any calibration scheme. The proposed ADC employs a 2-channel SAR and T-I topology based on a 2-step pipeline ADC with 4b and 7b in the first and second stage for high conversion rate and low power consumption. Analog circuits such as comparator and residue amplifier are shared between channels to minimize power consumption, chip area, and offset mismatch which limits the ADC linearity in the conventional T-I architecture, without any calibration scheme. The TSPC D flip-flop with a short propagation delay and a small number of transistors is used in the SAR logic instead of the conventional static D flip-flop to achieve high-speed SAR operation as well as low power consumption and chip area. Three separate reference voltage drivers for 4b SAR, 7b SAR circuits and a single residue amplifier prevent undesirable disturbance among the reference voltages due to each different switching operation and minimize gain mismatch between channels. High-frequency clocks with a controllable duty cycle are generated on chip to eliminate the need of external complicated high-frequency clocks for SAR operation. The prototype ADC in a 45nm CMOS technology demonstrates a measured DNL and INL within 0.69LSB and 0.77LSB, with a maximum SNDR and SFDR of 50.9dB and 59.7dB at 120MS/s, respectively. The proposed ADC occupies an active die area of 0.36mm2 and consumes 8.8mW at a 1.1V supply voltage.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.1
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• pp.98-106
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• 2009

This work proposes a 1280-RGB $\times$ 800-Dot 70.78mW 0.l3um CMOS LCD driver IC (LDI) for high-performance 16M-color low temperature poly silicon (LTPS) thin film transistor liquid crystal display (TFT-LCD) systems such as ultra mobile PC (UMPC) and mobile applications simultaneously requiring high resolution, low power, and small size at high speed. The proposed LDI optimizes power consumption and chip area at high resolution based on a resistor-string based architecture. The single column driver employing a 1:12 MUX architecture drives 12 channels simultaneously to minimize chip area. The implemented class-AB amplifier achieves a rail-to-rail operation with high gain and low power while minimizing the effect of offset and output deviations for high definition. The supply- and temperature-insensitive current reference is implemented on chip with a small number of MOS transistors. A slew enhancement technique applicable to next-generation source drivers, not implemented on this prototype chip, is proposed to reduce power consumption further. The prototype LDI implemented in a 0.13um CMOS technology demonstrates a measured settling time of source driver amplifiers within 1.016us and 1.072us during high-to-low and low-to-high transitions, respectively. The output voltage of source drivers shows a maximum deviation of 11mV. The LDI with an active die area of $12,203um{\times}1500um$ consumes 70.78mW at 1.5V/5.5V.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.48-57
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• 2006

This work describes a 12b 200KHz 0.52mA $0.47mm^2$ algorithmic ADC for sensor applications such as motor controls, 3-phase power controls, and CMOS image sensors simultaneously requiring ultra-low power and small size. The proposed ADC is based on the conventional algorithmic architecture with recycling techniques to optimize sampling rate, resolution, chip area, and power consumption. The input SHA with eight input channels for high integration employs a folded-cascode architecture to achieve a required DC gain and a sufficient phase margin. A signal insensitive 3-D fully symmetrical layout with critical signal lines shielded reduces the capacitor and device mismatch of the MDAC. The improved switched bias power-reduction techniques reduce the power consumption of analog amplifiers. Current and voltage references are integrated on the chip with optional off-chip voltage references for low glitch noise. The employed down-sampling clock signal selects the sampling rate of 200KS/s or 10KS/s with a reduced power depending on applications. The prototype ADC in a 0.18um n-well 1P6M CMOS technology demonstrates the measured DNL and INL within 0.76LSB and 2.47LSB. The ADC shows a maximum SNDR and SFDR of 55dB and 70dB at all sampling frequencies up to 200KS/s, respectively. The active die area is $0.47mm^2$ and the chip consumes 0.94mW at 200KS/s and 0.63mW at 10KS/s at a 1.8V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.4
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• pp.65-73
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• 2003

This paper presents the implementation of an analog signal-processing ASIS to detect an angular velocity signal from a vibrator angular velocity detection sensor. The output of the sensor to be charge appeared as the variation of the capacitance value in the structure of the sensor was detected using charge amplifiers and a self oscillation circuit for driving the sensor was implemented with a sinusoidal self oscillation circuit using the resonance characteristics of the sensor. Specially an automatic gain control circuit was utilized to prevent the deterioration of self-oscillation characteristics due to the external elements such as the characteristic variation of the sensor process and the temperature variation. The angular velocity signal, amplitude-mod)Hated in the operation characteristics of the sensor, was demodulated using a synchronous detection circuit. A switching multiplication circuit was used in the synchronous detection circuit to prevent the magnitude variation of detected signal caused by the amplitude variation of the carrier signal. The ASIC was designed and implemented using 0.5${\mu}{\textrm}{m}$ CMOS process. The chip size was 1.2mm x 1mm. In the experiment under the supply voltage of 3V, the ASIC consumed the supply current of 3.6mA and noise spectrum density from dc to 50Hz was in the range of -95 dBrms/√Hz and -100 dBrms/√Hz when the ASIC, coupled with the sensor, was in normal operation.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.5
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• pp.87-97
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• 2016

This work proposes a time-shared 10b DAC based on a two-step resistor string to minimize the effective area of a DAC channel for driving each AMOLED display column. The proposed DAC shows a lower effective DAC area per unit column driver and a faster conversion speed than the conventional DACs by employing a time-shared DEMUX and a ROM-based two-step decoder of 6b and 4b in the first and second resistor string. In the second-stage 4b floating resistor string, a simple current source rather than a unity-gain buffer decreases the loading effect and chip area of a DAC channel and eliminates offset mismatch between channels caused by buffer amplifiers. The proposed 1-to-24 DEMUX enables a single DAC channel to drive 24 columns sequentially with a single-phase clock and a 5b binary counter. A 0.9pF sampling capacitor and a small-sized source follower in the input stage of each column-driving buffer amplifier decrease the effect due to channel charge injection and improve the output settling accuracy of the buffer amplifier while using the top-plate sampling scheme in the proposed DAC. The proposed DAC in a $0.18{\mu}m$ CMOS shows a signal settling time of 62.5ns during code transitions from '$000_{16}$' to '$3FF_{16}$'. The prototype DAC occupies a unit channel area of $0.058mm^2$ and an effective unit channel area of $0.002mm^2$ while consuming 6.08mW with analog and digital power supplies of 3.3V and 1.8V, respectively.