• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.1
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• pp.13-15
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• 2004

The current driven in an MOSFET is limited by the intrinsic channel resistance. All the other parasitic elements in a device structure play a significant role and degrade the device performance. These other resistances need to be less than 15％ of the channel resistance. To achieve the requirements, we should investigate the methodology of separation and quantification of those resistances. In this paper, we developed the extraction method of resistances using calibrated TCAD simulation. The resistance of the extension region is also partially determined by the formation of a surface accumulation region that forms under the gate in the tail region of the extension profile. This resistance is strongly affected by the abruptness of the extension profile because the steeper the profile is, the shorter this accumulation region will be.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.10
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• pp.67-75
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• 2013

In this paper, an analytical model is presented for the source/drain parasitic resistance of FinFET. The parasitic resistance is a important part of a total resistance in FinFET because of current flow through the narrow fin. The model incorporates the contribution of contact and spreading resistances considering three-dimensional current flow. The contact resistance is modeled taking into account the current flow and parallel connection of dividing parts. The spreading resistance is modeled by difference between wide and narrow and using integral. We show excellent agreement between our model and simulation which is conducted by Raphael, 3D numerical field solver. It is possible to improve the accuracy of compact model such as BSIM-CMG using the proposed model.

• Journal of IKEEE
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• v.11 no.3
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• pp.95-99
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• 2007

In this study, the electrical characteristics of Symmetric and Asymmetric High Voltage MOSFET(HV-MOSFET) under high temperature were investigated. And, the specific on-resistance, threshold voltage, transconductance, drain current of the HV-MOSFETs were measured over a temperatures range of 300K ${\leq}$ T ${\leq}$400K. From the result of measured data, specific on-resistance increases slightly with increasing temperature. Especially, at high temperature(at 400K) specific on-resistance was increased about 30% than that in room temperature. And, in high temperature condition (at 400K), drain current was decreased about 30%, Also, transconductance(gm) was decreases with increasing temperature.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.12
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• pp.1-9
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• 2000

A new method, the external resistance method (ERM method), is proposed for accurate extraction of the gate bias-dependent effective channel carrier mobility (${\mu}_{eff}$) and separated parasitic source/drain resistances ($R_S$ and $R_D$) of n-channel MOSFET's. The proposed ERM method is applied to n-channel LDD MOSFETs with two different gate lengths ($W_m/L_m=30{\mu}m/0.6{\mu}m,\;30{\mu}m/1{\mu}m$) in the linear mode of current-voltage characteristics ($I_D-V_{GS},\;V_{DS}$). We also considered gate voltage dependence of separated $R_2$ and $R_D$ in the accurate modeling and extraction of effective channel carrier mobility. Good agreement of experimental data is observed in submicron n-channel LDD MOSFETs. Combining with capacitance-voltage characteristics, the ERM method is expected to be very useful for accurate and efficient extraction of ${\mu}_{eff},\;R_D,\;R_S$, and other characteristic parameters in both symmetric and asymmetric structure MOSFET's in which parasitic resistances are critical to the improvement of high speed performance and reliability.

• Journal of Convergence for Information Technology
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• v.11 no.7
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• pp.104-110
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• 2021

A novel selective oxidation process has been developed for low source/drain (S/D) series resistance of the fin channel metal oxide semiconductor field effect transistor (MOSFET). Using this technique, the selective oxidation fin-channel MOSFET (SoxFET) has the gate-all-around structure and gradually enhanced S/D extension regions. The SoxFET demonstrated over 70% reduction in S/D series resistance compared to the control device. Moreover, it was found that the SoxFET behaved better in performance, not only a higher drive current but also higher transconductances with suppressing subthreshold swing and drain induced barrier lowering (DIBL) characteristics, than the control device. The saturation current, threshold voltage, peak linear transconductance, peak saturation transconductance, subthreshold swing, and DIBL for the fabricated SoxFET are 305 ㎂/㎛, 0.33 V, 13.5 𝜇S, 76.4 𝜇S, 78 mV/dec, and 62 mV/V, respectively.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.2
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• pp.6-11
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• 2000

In this paper, suggesting a new linearly -graded depletion edge approximation, the current-voltage characteristics of an n-type short-channel GaAs MESFET device has been analyzed by solving the two dimensional Poisson's equation in the depletion region. In this model, the expressions for the threshold voltage, the source and the drain ohmic resistance, and the drain current were derived. As a result, typical Early effect of a short channel device was shown and the ohmic voltage drop by source and drain contact resistances could be explained. Furthermore our model could analyze both the short-channel device and the long-channel device in a unified manner.

• Electrical & Electronic Materials
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• v.8 no.5
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• pp.626-632
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• 1995

In this paper, The effect of the impedances in SNOSFET's memory devices has been developed. The effect of source and drain impedances measured by means of two bias resistances - field effect bias resistance by inner region, external bias resistance. The effect of the impedances by source and drain resistance shows the dependence of the function of voltages applied to the gate. It shows the differences of change in source drain voltage by means of low conductance state and high conductance state. It shows the delay of threshold voltages. The delay time of low conductance state and high conductance state by the impedances effect shows 3[.mu.sec] and 1[.mu.sec] respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.146-146
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• 2010

일반적인 MOSFET (Metal-Oxide-Semiconductor-Field-Effect-Transistor)은 소스와 드레인의 형성을 위해서 불순물을 주입하고 고온의 열처리 과정을 거치게 된다. 이러한 고온의 열처리 과정 때문에 녹는점이 낮은 메탈게이트와 게이트 절연막으로의 high-k 물질의 사용에 제한을 받게된다. 이와 같은 문제점을 보완하기 위해서 소스와 드레인 영역에 불순물 주입공정 대신에 금속접합을 이용한 Schottky Barrier Tunnel Transistor (SBTT)가 제안되었다. SBTT는 $500^{\circ}C$ 이하의 저온에서 불순물 도핑없이 소스와 드레인의 형성이 가능하며 실리콘에 비해서 수십~수백배 낮은 면저항을 가지며, 단채널 효과를 효율적으로 제어할 수 있는 장점이 있다. 또한 고온공정에 치명적인 단점을 가지고 있는 high-k 물질의 적용 또한 가능케한다. 본 연구에서는 p-type SOI (Silicon-On-Insulator) 기판을 이용하여 Pt-silicide 소스와 드레인을 형성하고 전기적인 특성을 분석하였다. 또한 본 연구에서는 기존의 sidewall을 사용하지 않는 새로운 구조를 적용하여 메탈게이트의 사용을 최적화하였고 게이트 절연막으로써 실리콘 옥사이드를 스퍼터링을 이용하여 증착하였기 때문에 저온공정을 성공적으로 수행할 수 있었다. 이러한 게이트 절연막은 열적으로 형성시키지 않고도 70 mv/dec 대의 우수한 subthreshold swing 특성을 보이는 것을 확인하였고, $10^8$정도의 높은 on/off current ratio를 갖는 것을 확인하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.8
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• pp.1-12
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• 2001

The adaptive learning circuit is designed on the basis of modeling of MFSFET (Metal-Ferroelectric-Semiconductor FET) and the numerical results are analyzed. The output frequency of the adaptive learning circuit is inversely proportional to the source-drain resistance of MFSFET and the capacitance of the circuit. The saturated drain current with input pulse number is analogous to the ferroelectric polarization reversal. It indicates that the ferroelectric polarization plays an important role in the drain current control of MFSFET. The output frequency modulation of the adaptive learning circuit is investigated by analyzing the source-drain resistance of MFSFET as functions of input pulse numbers in the adaptive learning circuit and the dimensionality factor of the ferroelectric thin film. From the results, the frequency modulation characteristic of the adaptive learning circuit are confirmed. In other words, adaptive learning characteristics which means a gradual frequency change of output pulse with the progress of input pulse are confirmed. Consequently it is shown that our circuit can be used effectively in the neuron synapses of nueral networks.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.3
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• pp.534-540
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• 2008

The adaptive learning circuit is designed on the basis of modeling of MFSFET (Metal-Ferroelectric-Semiconductor FET) and the numerical results is analyzed. The output frequency of the adaptive learning circuit is inversely proportional to the source-drain resistance of MFSFET and the capacitance of the circuit. The saturated drain current with input pulse number is analogous to the ferroelectric polarization reversal. It indicates that the ferroelectric polarization plays an important role in the drain current control of MFSFET. The output frequency modulation of the adaptive learning circuit is investigated by analyzing the source-drain resistance of MFSFET as functions of input pulse numbers in the adaptive learning circuit and the dimensionality factor of the ferroelectric thin film. From the results, adaptive learning characteristics which means a gradual frequency change of output pulse with the progress of input pulse, are confirmed. Consequently it is shown that our circuit can be used effectively in the neuron synapses of neural networks.