• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.244-247
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• 2002

NdBaCuO thin films were prepared on $SrTiO_{3}$ substrates by RF magnetron sputtering. These as-grown films were classified into 3type. The resistivity of the deposited films are usually lower than of the YBCO film. The Tc (onset) and Tc (R=0) in the optimized thin films are as high as 90 and 80K, respectively. These as-grown films are highly uniform and semi-trans parent and have a room temperature resistivity of $0.3m{\Omega}cm$.

• Electrical & Electronic Materials
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• v.10 no.7
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• pp.700-705
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• 1997

Transparent conducting indium tin oxide (TC-ITO) thin films are deposited on soda lime glass by a dc magnetron sputtering technique having the unbalanced-magnet structure in order to improve the electrical/material characteristics and to avoid the surface damages. The material properties are measured by the x-ray diffractometer (XRD) and atomic force microscope (AFM). The (400) peak as the preferred orientation of <100> direction for ITO thin films is stabilized with the increase of substrate temperature. The surface roughness estimated by AFM 3D image at the substrate temperature of 40$0^{\circ}C$ is extremely uniform. The best resistivity of ITO films (5500 $\AA$ thick) at 40$0^{\circ}C$ is about 1.3$\times$10$^{-4}$ $\Omega$cm on the position of 4 cm from substrate center.

• Korean Journal of Materials Research
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• v.20 no.11
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• pp.575-580
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• 2010

The microstructure and positive temperature coefficient of resistivity (PTCR) characteristics of 0.1 mol%$Na_2Ti_6O_{13}$ doped $0.94BaTiO_3-0.06(Bi_{0.5}Na_{0.5})TiO_3$ (BBNT-NT001) ceramics sintered at various temperatures from $1200^{\circ}C$ to $1350^{\circ}C$ were investigated in order to develop eco-friendly PTCR thermistors with a high Curie temperature ($T_C$). Resulting thermistors showed a perovskite structure with a tetragonal symmetry. When sintered at $1200^{\circ}C$, the specimen had a uniform microstructure with small grains. However, abnormally grown grains started to appear at $1250^{\circ}C$ and a homogeneous microstructure with large grains was exhibited when the sintering temperature reached $1325^{\circ}C$. When the temperature exceeded $1325^{\circ}C$, the grain growth was inhibited due to the numerous nucleation sites generated at the extremely high temperature. It is considered that $Na_2Ti_6O_{13}$ is responsible for the grain growth of the $0.94BaTiO_3-0.06(Bi_{0.5}Na_{0.5})TiO_3$) ceramics by forming a liquid phase during the sintering at around $1300^{\circ}C$. The grain growth of the BBNT-NT001 ceramics was significantly correlated with a decrease of resistivity. All the specimens were observed to have PTCR characteristics except for the sample sintered at $1200^{\circ}C$. The BBNT-NT001 ceramics had significantly decreased $\tilde{n}_{rt}$ and increased resistivity jump with increasing sintering temperature at from $1200^{\circ}C$ to $1325^{\circ}C$. Especially, the BBNT-NT001 ceramics sintered at $1325^{\circ}C$ exhibited superior PTCR characteristics of low resistivity at room temperature ($122\;{\Omega}{\cdot}cm$), high resistivity jump ($1.28{\times}10^4$), high resistivity temperature factor (20.4%/$^{\circ}C$), and a high Tc of $157.9^{\circ}C$.

• Journal of the Korean GEO-environmental Society
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• v.12 no.1
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• pp.13-26
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• 2011

Because the allowable current loading of buried electrical transmission cables is frequently limited by the maximum permissible temperature of the cable or of the surrounding ground, there is a need for cable backfill materials to be maintained at a low thermal resistivity during the service period. Temperatures greater than $50^{\circ}C$ to $60^{\circ}C$ may lead to breakdown of cable insulation and thermal runaway if the surrounding backfill material is unable to dissipate the heat as rapidly as it is generated. This paper describes the results of studies aimed at the development of backfill material to reduce the thermal resistivity. A large number of different additive materials were tested to determine their applicability as a substitute material. The results of Dong-rim river sand (relatively uniform) show that as water content level increases, thermal resistivity tends to decrease, whereas the thermal resistivity on dry condition is very high value($260^{\circ}C-cm/watt$). In addition, other materials(such as Jinsan granite screenings, A-2(sand and gravel mixture), E-1(rubble and granite screenings mixture) and SGFC(sand, gravel, fly-ash and cement mixture)) are well-graded materials with low thermal resistivity($100^{\circ}C-cm/watt$ when dry). Based on this research, 4 types of improved materials were suggested as the environmentally friendly backfill materials with low thermal resistivity.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.7
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• pp.1-7
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• 1989

For H-polarized incident plane wave, an exact integral expression for the scattered field by an inversely tapered resistive half plane is obtained by using Kontorovich-Lebedev transform. Uniform asymptotic results available for all angles are obtained, and non-uniform asymptotic results which provide the ray-optical interpretation of the calculated scattered field are also obtained. The edge diffraction patterns for several values of inverse proportionality of resistivity are shown. We find out that the results are in agreement with physical reasoning.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1097-1102
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• 2010

Silver coated copper powders were prepared by a chemical reduction method with controlling the deposition process variables such as the feeding rate of the silver ionic solution and concentration of the reductants at room temperature. The characteristics of the products were evaluated by scanning electron microscope (SEM), X-ray diffractometer (XRD), atomic absorption spectrophotometer (AA) and a 4 probe resistivity measurement system. The optimum condition of the preparation of Ag coated Cu powders was at 0.05 M of potassium sodium tartrate and 2 ml/min of the feeding rate of the silver ionic solution. Our method successfully produced dense, uniform, and well-dispersed Ag coated Cu powder of $2{\sim}2.5{\mu}m$ witha silver layer of 100~200 nm. Additionally, we found that thespecific resistivity of the 30 wt.% Ag coated Cu powder was similar to that of pure silver, so that the composite powder could be used as an alternative electromagnetic shielding material for silver.

• Korean Journal of Metals and Materials
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• v.48 no.10
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• pp.951-956
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• 2010

This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded $20mA/cm^2$ was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a $Cu^{2+}:H_2SO_4$ ratio of 50:100 g/l.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.586-590
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• 2009

The effects of additives on the surface morphology and physical properties of copper electrodeposited on polyimide(PI) film were investigated here. Two kinds of additives, an activator(additive A) and a leveler(additive B),were used in this study. Electrochemical experiments, in conjunction with scanning electron microscopy(SEM), X-ray diffraction(XRD) and a four-point probe, were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity could be controlled using various quantities of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated onto the electrolyte with no additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm of additive A and 100 ppm of additive B.

• Economic and Environmental Geology
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• v.46 no.3
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• pp.215-220
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• 2013

We estimated the hydraulic conductivity of the sediments using constant-head permeability tests and electrical resistivity measurements with Jumoonjin standard sand of a uniform size and glass beads of different grain sizes. In this study, we determined the variations of the porosity, the hydraulic conductivity, and the resistivity in case 1 (changing the packing of the Jumoonjin standard sand) and in case 2 (varying the size of the glass beads). The results of case 1 showed that the hydraulic conductivity decreased with an increase in the electrical resistivity. This occurred because the sand grain while packing became rhombohedral with the a decrease of both the pore size and porosity. The results of the case 2 showed that the hydraulic conductivity increased due to the increase in the pore size as caused by the increased glass bead size. In addition, the porosity decreased and the electrical resistivity increased. Therefore, the relationship between the hydraulic conductivity and the electrical resistivity is negatively proportional as regards the grain packing with a change from cubic to rhombohedral whereas this relationship is positively proportional to the increase in the grain size.

• Journal of the Korean GEO-environmental Society
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• v.12 no.1
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• pp.51-60
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• 2011

Electrical resistivity is applied for understanding details about layers and obtaining basic properties of soils to various measurement devices. The objective of this study is development of TRP(Temperature-compensated Resistivity Probe), analysis about effects of temperature changes during cone penetration test, and observation of characteristics of cone penetration. In order to observation of temperature changes according to a diameter difference of resistivity cone probe, the cone which has wedge type cone tip is made to two types, 2mm and 5mm. Temperature sensor is attached at 15mm below from cone tip because of an electrical interference with elecrical resistance probe. Delectrical connector is used to prevent electric disturbance between motor type penetrating machine and electrical resistivity cone probe. Application tests are carried out in acrylic cell whose diameter is 30cm with uniform Jumunjin sand according to densification caused by blows. The test results indicate that the temperature is increased uniformly during penetration and a tendency, characteristics of cone penetration, is discovered during altering state of soils. This study suggests that the temperature effects and characteristics of penetration should be considered in penetrating tests in order to conduct an accurate ground investigation using TRP(Temperature-compensated Resistivity Probe).