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Effect of Additives on the Physical Properties and Surface Morphology of Copper Foil  

Woo, Tae-Gyu (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Park, Il-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Park, Eun-Kwang (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Jung, Kwang-Hee (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Lee, Hyun-Woo (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Seol, Kyeong-Won (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Publication Information
Korean Journal of Metals and Materials / v.47, no.9, 2009 , pp. 586-590 More about this Journal
Abstract
The effects of additives on the surface morphology and physical properties of copper electrodeposited on polyimide(PI) film were investigated here. Two kinds of additives, an activator(additive A) and a leveler(additive B),were used in this study. Electrochemical experiments, in conjunction with scanning electron microscopy(SEM), X-ray diffraction(XRD) and a four-point probe, were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity could be controlled using various quantities of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated onto the electrolyte with no additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm of additive A and 100 ppm of additive B.
Keywords
additive; plating; peel strength; resistivity; flexibility;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By Web Of Science : 1  (Related Records In Web of Science)
Times Cited By SCOPUS : 1
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