Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Effect of Electrolyte Compositions on the Physical Property and Surface Morphology of Copper Foil

전해액 조성에 의한 구리 박막의 표면형상과 물성변화

  • Woo, Tae-Gyu (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Park, Il-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Jeon, Woo-Yong (Department of Dental Technology, Kwang Yang Health College) ;
  • Park, Eun-Kwang (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Jung, Kwang-Hee (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Lee, Hyun-Woo (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Lee, Man-Hyung (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Seol, Kyeong-Won (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
  • 우태규 (전북대학교 공과대학 신소재공학부) ;
  • 박일송 (전북대학교 공과대학 신소재공학부) ;
  • 전우용 (광양보건대학 치기공과) ;
  • 박은광 (전북대학교 공과대학 신소재공학부) ;
  • 정광희 (전북대학교 공과대학 신소재공학부) ;
  • 이현우 (전북대학교 공과대학 신소재공학부) ;
  • 이만형 (전북대학교 공과대학 신소재공학부) ;
  • 설경원 (전북대학교 공과대학 신소재공학부)
  • Received : 2010.03.23
  • Published : 2010.10.22
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Abstract

This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded $20mA/cm^2$ was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a $Cu^{2+}:H_2SO_4$ ratio of 50:100 g/l.

Keywords

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