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Effect of Reductants and their Properties of Electric Resistivity on the Preparation of Ag coated Cu Powders by Chemical Reduction Method

화학환원법을 이용한 은 코팅 구리 분말 제조 시 환원제의 영향 및 전기비저항 특성

  • Ahn, Jong-Gwan (Mineral Resource Research Division, Korea Institute of Geosciences and Mineral Resources (KIGAM)) ;
  • Yoon, Chi-Ho (Daejoo Co.) ;
  • Kim, Dong-Jin (Mineral Resource Research Division, Korea Institute of Geosciences and Mineral Resources (KIGAM)) ;
  • Cho, Sung-Wook (Mineral Resource Research Division, Korea Institute of Geosciences and Mineral Resources (KIGAM)) ;
  • Park, Je-Shin (Div. of Advanced Materials Engineering, Chonbuk University)
  • 안종관 (한국지질자원연구원 광물자원연구본부) ;
  • 윤치호 (대주전자재료(주)) ;
  • 김동진 (한국지질자원연구원 광물자원연구본부) ;
  • 조성욱 (한국지질자원연구원 광물자원연구본부) ;
  • 박제신 (전북대학교 신소재공학부)
  • Received : 2010.08.17
  • Published : 2010.12.25

Abstract

Silver coated copper powders were prepared by a chemical reduction method with controlling the deposition process variables such as the feeding rate of the silver ionic solution and concentration of the reductants at room temperature. The characteristics of the products were evaluated by scanning electron microscope (SEM), X-ray diffractometer (XRD), atomic absorption spectrophotometer (AA) and a 4 probe resistivity measurement system. The optimum condition of the preparation of Ag coated Cu powders was at 0.05 M of potassium sodium tartrate and 2 ml/min of the feeding rate of the silver ionic solution. Our method successfully produced dense, uniform, and well-dispersed Ag coated Cu powder of $2{\sim}2.5{\mu}m$ witha silver layer of 100~200 nm. Additionally, we found that thespecific resistivity of the 30 wt.% Ag coated Cu powder was similar to that of pure silver, so that the composite powder could be used as an alternative electromagnetic shielding material for silver.

Keywords

Acknowledgement

Grant : 전략금속 산업원료화 기술개발

Supported by : 한국지질자원연구원

References

  1. K. S. Yun, Y. C. Park, B. S. Yang, H. H. Min, and C. W. Won, J. Korean Powder Metall. Inst. 12, 56 (2005). https://doi.org/10.4150/KPMI.2005.12.1.056
  2. S. Y. Park, T. W. Yoon, C. H. Lee, I. B. Jeong, and S. H. Hyun, Powder Metall. World Congress 1076 (2006).
  3. V. Privman, D. V. Goia, J. S. Park, and E. Matijevic, J. Colloid Interface Sci. 213, 36 (1999). https://doi.org/10.1006/jcis.1999.6106
  4. Y. T. Yu and Y. Y. Choi, Kor. J. Mater. Res. 13, 524 (2003). https://doi.org/10.3740/MRSK.2003.13.8.524
  5. Y. M. Park, H. H. Jin, S. R. Kim, H. C. Park, and S. Y. Yoon, Kor. J. Mater. Res. 14, 790 (2004). https://doi.org/10.3740/MRSK.2004.14.11.790
  6. A. M. Litman, D. M. Staggs, and N. E. Fowler, Technical Papers, Regional Tech. Conf. 127 (1982).
  7. X. Xu, X. Luo, H. Zhuang, W. Li, and B. Zhang, Mat. Letter. 57, 3987 (2003). https://doi.org/10.1016/S0167-577X(03)00252-0
  8. D. Russev, D. Raclev, and S. Kava, J. Met. Finish. 81, 27 (1983).
  9. Koto, et al., US Patent No. 4,652,465 (1987).
  10. T. Hayashi, US Patent No. 5,178,909 (1993).
  11. H. Y. Lee and J. K. Oh, J. of Korean Inst. of Resources Recycling. 14, 21 (2005).
  12. A. Tsaliovich, Electromagnetic shielding handbook for wired and wireless EMC application, Kluwer Academic Publisher (1999).
  13. K. M. Lim, M. C. Kim, K. A. Lee, and C. G. Park, J. Kor. Inst. Met. & Mater. 41, 180 (2003).
  14. Y. Nagasawa, Plastic Korea, 10, 46 (1997).
  15. H. G. Kim, Electromagnetic waves and the human body, p.139-193, YoungPoong BookStore Co., Ltd, Korea (1996).
  16. T. Raghu, R. Sundaresan, P. Ramakrishnan, and T. R. Rama Mohan, Mater. Sci. Eng. (A) 304-306, 438 (2001). https://doi.org/10.1016/S0921-5093(00)01444-1
  17. K. I. Kim and Y. S. Park, TCI Report, BA555, 24 (2006).
  18. S. Djokic, M. Dubois, and R. H. Lepard, US Patent No. 5,945,158 (1999).
  19. H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung, and C. O. Kim, Surface & Coating Tech. 201, 3788 (2006). https://doi.org/10.1016/j.surfcoat.2006.03.025
  20. O. Keles, Hydrometallugy 95, 333 (2009). https://doi.org/10.1016/j.hydromet.2008.07.006
  21. K. H. Kim. H. J. Sohn, and T. Kang, J. Kor. Inst. Met. & Mater. 24, 663 (1986).
  22. Yaritsune Torao, Coating Materials for Electronics, Technical report no. 27, p. 13-30, CMC, Tokyo (1982).
  23. M. K. Song, S. M. Hong, and J. M. Park, Polym. Sci. Technol. 12, 690 (2001).