• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.2
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• pp.118-129
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• 2010

A lower-threshold-voltage (LVth) SRAM cell with an elevated cell biasing scheme, which enables to reduce the random threshold-voltage (Vth) variation and to alleviate the stability-degradation caused by word-line (WL) and cell power line (VDDM) disturbed accesses in row and column directions, has been proposed. The random Vth variation (${\sigma}Vth$) is suppressed by the proposed LVth cell. As a result, the LVth cell reduces the variation of static noise margin (SNM) for the data retention, which enables to maintain a higher SNM over a larger memory size, compared with a conventionally being used higher Vth (HVth) cell. An elevated cell biasing scheme cancels the substantial trade-off relationship between SNM and the write margin (WRTM) in an SRAM cell. Obtained simulation results with a 45-nm CMOS technology model demonstrate that the proposed techniques allow sufficient stability margins to be maintained up to $6{\sigma}$ level with a 0.5-V data retention voltage and a 0.7-V logic bias voltage.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.4
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• pp.217-222
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• 2003

A new two-dimensional analytical model for the potential distribution and drain-induced barrier lowering (DIBL) effect of fully depleted short-channel Silicon-on-insulator (SOI)-MESFET's has been presented in this paper. The two dimensional potential distribution functions in the active layer of the device is approximated as a simple parabolic function and the two-dimensional Poisson's equation has been solved with suitable boundary conditions to obtain the bottom potential at the Si/oxide layer interface. It is observed that for the SOI-MESFET's, as the gate-length is decreased below a certain limit, the bottom potential is increased and thus the channel barrier between the drain and source is reduced. The similar effect may also be observed by increasing the drain-source voltage if the device is operated in the near threshold or sub-threshold region. This is an electrostatic effect known as the drain-induced barrier lowering (DIBL) in the short-gate SOI-MESFET's. The model has been verified by comparing the results with that of the simulated one obtained by solving the 2-D Poisson's equation numerically by using the pde toolbox of the widely used software MATLAB.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.10
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• pp.25-32
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• 2011

We have analyzed adjacent cell dependency of threshold voltage shift caused by the cell to cell interference, and we proposed a 3-adjacent-cell model to model the pattern dependency of the threshold voltage shift. The proposed algorithm is verified by using MATLAB simulation and measurement results. In the experimental results, we found that accuracy of the proposed simple 3-adjacient-cell model is comparable to the widely used conventional 8-adjacient-cell model. The Bit Error Rate (BER) of LSB and of MSB is improved by 28.9% and 19.8%, respectively, by applying the proposed algorithm based on 3-adjacent-cell model to 20nm-class 2-bit MLC NAND flash memories.

• Proceedings of the KIEE Conference
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• 2008.10b
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• pp.165-168
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• 2008

The experimental results of exposing IGBT (Insulated Gate Bipolar Transistor) samples to gamma radiation source show shifting of threshold voltages in the MOSFET and degradation of carrier mobility and current gains. At low total dose rate, the shift of threshold voltage is the major contribution of current increases, but for more than some total dose, the current is increased because of the current gain degradation occurred in the vertical PNP at the output of the IGBTs. In the paper, the collector current characteristics as a function of gate emitter voltage (VGE) curves are tested and analyzed with the model considering the radiation damage on the devices for gate bias and different dose. In addition, the model parameters between simulations and experiments are found and studied.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.1
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• pp.104-109
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• 2008

A simple and efficient way of modeling backgating in GaAs MESFET's is presented through depletion width modulation of Schottky junction and channel-substrate interface. It is shown semi-empirically that such a modulation of depletion widths causes serious troubles in designing precision circuits since backgating drastically reduces threshold voltage of MESFET as well as drain current. Finally, some of the results are compared with reported experimental results. This model may serve as a starting point for rigorous characterization of backgating effect on various device parameters of GaAs MESFET's.

• The KIPS Transactions:PartA
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• v.17A no.3
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• pp.121-126
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• 2010

This paper proposes a low-power MOS current-mode logic circuit with the low voltage swing technology and the high-threshold sleep-transistor. The sleep-transistor is used to high-threshold voltage PMOS transistor to minimize the leakage current. The $16{\times}16$ bit parallel multiplier is designed by the proposed circuit structure. Comparing with the conventional MOS current-model logic circuit, the circuit achieves the reduction of the power consumption in sleep mode by 1/104. The proposed circuit is achieved to reduce the power consumption by 11.7% and the power-delay-product by 15.1% compared with the conventional MOS current-model logic circuit in the normal mode. This circuit is designed with Samsung $0.18\;{\mu}m$ standard CMOS process. The validity and effectiveness are verified through the HSPICE simulation.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.228-239
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• 2004

In this paper, an analytical model accounting for the quantum effects in MOSFETs has been developed to study the behaviour of $high-{\kappa}$ dielectrics and to calculate the threshold voltage of the device considering two dielectrics gate stack. The effect of variation in gate stack thickness and permittivity on surface potential, inversion layer charge density, threshold voltage, and $I_D-V_D$ characteristics have also been studied. This work aims at presenting a relation between the physical gate dielectric thickness, dielectric constant and substrate doping concentration to achieve targeted threshold voltage, together with minimizing the effect of gate tunneling current. The results so obtained are compared with the available simulated data and the other models available in the literature and show good agreement.

• Journal of Electrical Engineering and Technology
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• v.4 no.3
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• pp.410-417
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• 2009

The objective of this paper is to study the discharge phenomenon for a point-plane air interval using an original fuzzy logic system. Firstly, a physical model based on streamer theory with consideration of the space charge fields due to electrons and positive ions is proposed. To test this model we have calculated the breakdown threshold voltage for a point-plane air interval. The same model is used to determine the discharge steps for different configurations as an inference data base. Secondly, using results obtained by the numerical simulation of the previous model, we have introduced the fuzzy logic technique to predict the breakdown threshold voltage of the same configurations used in the numerical model and make estimation on the insulating state of the air interval. From the comparison of obtained results, we can conclude that they are in accordance with the experimental ones obtained for breakdown discharges in different point-plane air gaps collected from the literature. The proposed study using fuzzy logic technique shows a good performance in the analysis of different discharge steps of the air interval.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.7
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• pp.1079-1083
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• 2002

We made ESD tester to measure ESD threshold voltage of semiconductor devices. The HBM ESD test is the most popular method to measure the ESD threshold voltage of MMSIC. We use flyback method which is one of the DC-DC converter to get high ESD voltage. With flvback method, we can isolate the 1ow voltage part from the high voltage part of HBM ESD tester. We use an air gap of the relay which is used for switch to satisfy the rise time of ESD standard(MIL-STD). As a result, with the flyback method and the air gap of relay, we can make ESD tester whose parasitic components are minimized.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.469-472
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• 2002

We made ESD tester to measure ESD threshold voltage of semiconductor devices. The HBM ESD test is the most popular method to measure the ESD threshold voltage of MMIC. We use flyback method which is one of the DC-DC converter to get high ESD voltage. With flyback method, we can isolate the low voltage part from the high voltage part of HBM ESD tester. We use an air gap of the relay which is used for switch to satisfy the rise time of ESD standard(MIL-STll-883D). As a result, with the flyback method and the air gap of relay, we can make ESD tester whose parasitic components are minimized.