• Journal of the Korean Ceramic Society
• /
• v.35 no.6
• /
• pp.635-639
• /
• 1998

When the low pressure injection molded parts are debinded by wicking and subsequent thermal pyrolysis the optimum transition point from wicking to thermal pyrolysis is just after the completion of the constant wicking rate period. Even when the partially debinded parts were heated at 5$^{\circ}C$/min after reaching the 1st falling rate period the debinding defects such as distortion and cracks were not found.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.37 no.7
• /
• pp.709-716
• /
• 2009

Thermal condition according to the operation attitude of a satellite in orbit would be essential to be known because the orbit attitude is a dominant factor to affect satellite thermal design. In this paper, the change in space thermal environment and the thermal effect in thermal design are studied for a low earth orbit satellite according to the yaw motion. The present satellite retains sun-pointing attitude during daylight due to the fixed type solar arrays. And it also moves along the orbit with constant yaw motion in a longitudinal axis so that a star tracker which is a star sensor for satellite's attitude control always looks into the deep space. This attitude is considered in its better visibility to the stars for a successful mission operation. Also, it is required to access the corresponding thermal effects due to the yaw motion. Therefore, we try to verify these by the thermal analysis for the satellite thermal model with the yaw motion.

• Journal of Ceramic Processing Research
• /
• v.19 no.6
• /
• pp.450-454
• /
• 2018

In recent years, thermal insulation coating technology for automotive engine parts has received significant attention as a means of improving the thermal efficiency of automotive engines. One of the characteristics of thermal insulation coatings is their low thermal conductivity, and, materials such as YSZ (Yttria-stabilized zirconia), which have low thermal conductivity, are used for this purpose. This research presents a study of the changes in the microstructure and thermal conductivity of $8YSZ/SiO_2$ multi compositional thermal insulation coating for different compositions, and particle size distributions of suspension, when it is subjected to suspension plasma spraying. To obtain a porous coating structure, the mixing ratio of 8YSZ and $SiO_2$ particles and the particle sizes of the $SiO_2$ were changed. The microstructure, phase formation behavior, porosity and thermal conductivity of the coatings were analyzed. The porosities were found to be 1.2-32.1%, and the thermal conductivities of the coatings were 0.797-0.369 W/mK. The results of the study showed that the microstructures of the coatings were strongly influenced by the particle size distributions, and that the thermal conductivities of the coatings were greatly impacted by the microstructures of the coatings.

• Korean Journal of Metals and Materials
• /
• v.47 no.8
• /
• pp.500-507
• /
• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.6
• /
• pp.376-380
• /
• 2017

In this paper, we prepared a metal alloy resistor with stable thermal electro motive force (thermal EMF) as well as a low temperature coefficient of resistance (TCR) by adjusting the manganese proportion from 3 to 12 wt% in the Cu-Mn-Ni alloy. Composition of the fabricated metal alloy was investigated using energy dispersive X-ray (EDX) analysis. The TCR of each sample was measured as 44.56, 40.54, 35.60, and 31.56 ppm for Cu-3Mn-2Ni, Cu-5Mn-2Ni, Cu-10Mn-2Ni, and Cu-12Mn-2Ni, respectively. All the resistor samples were available for the F grade (${\pm}1%$ of the allowable error of resistance) high-precision resistor. All the samples satisfied the baseline of high thermal EMF (under 3 mV at $60^{\circ}C$); however, Cu-3Mn-2Ni and Cu-5Mn-2Ni satisfied the baseline of low thermal EMF (under 0.3 mV at $25^{\circ}C$). We were thus able to design and fabricate the metal alloy resistor of Cu-3Mn-2Ni and Cu-5Mn-2Ni to have low TCR and stable thermal EMF at the same time.

• Korean Journal of Materials Research
• /
• v.26 no.4
• /
• pp.216-221
• /
• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• Journal of the Korean Applied Science and Technology
• /
• v.27 no.4
• /
• pp.552-558
• /
• 2010

Zinc soap and Zn/Ba mixed metal soap were synthesized and PVC plastisol with mixed metal soap and various costabilizers were also synthesized with good structures and characterized by IR and $^1H$-NMR. The IR spectrums and $^1H$-NMR spectrums of the synthesized soaps were in very good accordance with the structures proposed by earlier workers. In using phosphite as a costabilizer, TIDP phosphite was shown to be the excellent thermal stabilization effect at the low temperature and TNPP phosphite was shown to be the excellent thermal stabilization effect at the high temperature. In case of antioxidant, it was revealed that antioxidant was not effective in the low temperature thermal stabilization effect while highly effective in the high temperature thermal stability. $NaClO_4$ solution with sorbitol solvent had the best thermal stabilization effect among $NaClO_4$ solution series at low and high temperature.

• 한국태양에너지학회:학술대회논문집
• /
• 2011.04a
• /
• pp.133-137
• /
• 2011

Low-e glazing is classified as soft low-e glazing and hard low-e glazing. Hard low-e glazing can be temperable and its handling is comfortable because its coating film is a oxide film generated at high temperatures. But there is a fatal weakness that its insulation performance and shielding performance are lower compared to soft low-e glazing by low electrical conductivity of coating film. Soft low-e glazing is excellent because its coating film consists of Ag that is excellent electrical conductivity and it has strength that can supply various product consumers want. But soft low-e glazing has weaknesses that temperable and handling are difficult because Ag is oxidized easily. Therefore this study analyzes thermal performance of glazing by changing filling gas according to applying low-e glazing through simulation to judge performance before making sample. After this process, a comparative experimental study was done through TVS by making temperable low-e glazing.

• Journal of the Korean Solar Energy Society
• /
• v.27 no.3
• /
• pp.155-160
• /
• 2007

This study shows the results on thermal performance test with domestic solar collector for low-temperature applications using KS, then reveals the efficiency difference between KS and EN standard. Using the test results, this study Presents the status of thermal performance with domestic solar collector including flat-plate, single evacuated, and double evacuated (with mirror or U-tube) solar collector.

• Carbon letters
• /
• v.11 no.4
• /
• pp.347-356
• /
• 2010

Recently, the use of thermal conductive polymeric composites is growing up, where the polymers filled with the thermally conductive fillers effectively dissipate heat generated from electronic components. Therefore, the management of heat is directly related to the lifetime of electronic devices. For the purpose of the improvement of thermal conductivity of composites, fillers with excellent thermally conductive behavior are commonly used. Thermally conductive particles filled polymer composites have advantages due to their easy processibility, low cost, and durability to the corrosion. Especially, carbon-based 1-dimensional nanomaterials such as carbon nanotube (CNT) and carbon nanofiber (CNF) have gained much attention for their excellent thermal conductivity, corrosion resistance and low thermal expansion coefficient than the metals. This paper aims to review the research trends in the improvement of thermal conductivity of the carbon-based materials filled polymer composites.