The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles |
Oh, Chulmin
(Physics-of-Failure Research Center, Korea Electronic Technology Institute)
Park, Nochang (Physics-of-Failure Research Center, Korea Electronic Technology Institute) Han, Changwoon (Physics-of-Failure Research Center, Korea Electronic Technology Institute) Bang, Mansoo (Engineering Division, Medison) Hong, Wonsik (Physics-of-Failure Research Center, Korea Electronic Technology Institute) |
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