• Transactions on Electrical and Electronic Materials
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• 제12권5호
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• pp.209-212
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• 2011

Hafnium nitride (HfN) thin films were deposited onto a silicon substrate by inductive coupled nitrogen plasma-assisted radio frequency magnetron sputtering. The films were prepared without intentional substrate heating and a substrate negative bias voltage ($-V_b$) was varied from -50 to -150 V to accelerate the effects of nitrogen ions ($N^+$) on the substrate. X-ray diffractometer patterns showed that the structure of the films was strongly affected by the negative substrate bias voltage, and thin film crystallization in the HfN (100) plane was observed under deposition conditions of -100 $V_b$ (bias voltage). Atomic force microscopy results showed that surface roughness also varied significantly with substrate bias voltage. Films deposited under conditions of -150 $V_b$ (bias voltage) exhibited higher hardness than other films.

• 한국재료학회지
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• 제17권11호
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• pp.618-621
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• 2007

Chromium nitride (CrN) films were deposited on silicon substrate by RF magnetron sputtering assisted by inductive coupled nitrogen plasma without intentional substrate heating. Films were deposited with different levels of bombarding energy by nitrogen ions $(N^+)$ to investigate the influence of substrate bias voltage $(V_b)$ on the growth of CrN thin films. XRD spectra showed that the crystallographic structure of CrN films was strongly affected by substrate bias voltage. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) results showed that surface roughness and grain size of the CrN films varied significantly with bias voltage. For - 80 $V_b$ depositions, the CrN films showed bigger grain sizes than those of other bias voltage conditions. The lowest surface roughness of 0.15 nm was obtained from the CrN films deposited at .130 $V_b$.

• 한국표면공학회지
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• 제54권3호
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• pp.133-138
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• 2021

Ternary Ti-X-N coatings, where X = Al, Si, Cr, O, etc., have been widely used for machining tools and cutting tools such as inserts, end-mills, and etc. Ti-Al-N-O coatings were deposited onto silicon wafer and WC-Co substrates by a cathodic arc evaporation (CAE) technique at various negative substrate bias voltages. In this study, the influence of substrate bias voltages during deposition on the microstructure and mechanical properties of Ti-Al-N-O coatings were systematically investigated to optimize the CAE deposition condition. Based on results from various analyses, the Ti-Al-N-O coatings prepared at substrate bias voltage of -80 V in the process exhibited excellent mechanical properties with a higher compressive residual stress. The Ti-Al-N-O (-80 V) coating exhibited the highest hardness around 30 GPa and elastic modulus around 303 GPa. The improvement of mechanical properties with optimized bias voltage of -80 V can be explained with the diminution of macroparticles, film densification and residual stress induced by ion bombardment effect. However, the increasing bias voltage above -80 V caused reduction in film deposition rate in the Ti-Al-N-O coatings due to re-sputtering and ion bombardment phenomenon.

• 한국안광학회지
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• 제9권2호
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• pp.291-299
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• 2004

ECR-PECVD 방법을 이용하여 ECR power, $CH_4/H_2$ 가스 혼합비와 유량, 증착시간을 고정 시켜놓고 기판 bias 전압을 변화 시켜가면서 유리 기판위에 DLC 박막을 제작하였다. Raman, FTIR 및 UV/Vis 스펙트럼을 측정하여 기판 bias 진압에 따른 이용 충돌이 박막의 특성 변화에 미치는 영향을 조사하였다. FTIR 분석결과로부터 기판 bias 전압을 증가시킬수록 이용충돌 현상이 두드러져 탄소와 결합하고 있던 수소원자들의 탈수소화 현상을 확인할 수 있었고, 박막의 두께는 bias 전압을 증가시킬수록 감소되었다. 그리고 Raman 스펙트럼으로부터 Gaussian curve fitting을 통하여 sp3/sp2의 결합수에 비례하는 D/G피크의 면적 강도비(ID/IG)는 기판 bias 전압을 증가시킬수록 증가하였다. 그리고 광 투과율은 증착시간을 길게 할수록, 기판 bias 전압을 크게할수록 감소하였으나, 박막의 밀도가 증가하고 더 매끄러운 DLC 박막이 형성되었다. 이 결과로부터 DLC 박막은 기판 bias 전압의 크기를 증가시킬수록 특성이 더 향상됨을 알 수 있었다.

• 한국진공학회지
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• 제9권4호
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• pp.328-334
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• 2000

ECR-PECVD 방법을 이용하여 ECR power, $CH_4/H_2$ 가스 혼합비와 유량, 증착시간을 고정시켜놓고 기판 bias 전압을 변화 시켜가면서 DLC 박막을 제작하였고, 제작된 박막의 두께, Raman과 FTIR 스펙트럼 그리고 미소경도 등을 측정 및 분석하여 기판 bias전압에 따른 이온충돌이 박막의 특성 변화에 미치는 영향을 조사하였다. FTIR 분석 결과로부터 기판 bias 전압을 증가시킬수록 이온충돌 현상이 두드러져 탄소와 결합하고 있던 수소원자들의 탈수소화 현상을 확인할 수 있었고, 박막의 두께는 bias 전압을 증가시킬수록 감소되었다. 그리고 Raman 스펙트럼으로부터 Gaussian curve fitting을 통하여 $sp^3$/$sp^2$의 결합수에 비례하는 D와 G peak의 면적 강도비(ID/IG)는 기판 bias 전압을 증가시킬수록 증가하였고, 또한 경도도 증가하였다. 이 결과로부터 본 연구에서 제작된 수소를 함유한 비정질 탄소 박막은 기판 bias 전압의 크기를 증가시킬수록 DLC 특성이 더 향상됨을 알 수 있었다.

• 한국재료학회지
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• 제33권9호
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• pp.372-376
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• 2023

Transparent conductive tungsten (W) doped indium oxide (In₂O₃; IWO) films were deposited at different substrate bias voltage (-V_b) conditions at room temperature on glass substrates by radio frequency (RF) magnetron sputtering and the influence of the substrate bias voltage on the optical and electrical properties was investigated. As the substrate bias voltage increased to -350 V_b, the IWO films showed a lower resistivity of 2.06 × 10^-4 Ωcm. The lowest resistivity observed for the film deposited at -350 V_b could be attributed to its higher mobility, of 31.8 cm²/Vs compared with that (6.2 cm²/Vs) of the films deposited without a substrate bias voltage (0 V_b). The highest visible transmittance of 84.1 % was also observed for the films deposited at the -350 V_b condition. The X-ray diffraction observation indicated the IWO films deposited without substrate bias voltage were amorphous phase without any diffraction peaks, while the films deposited with bias voltage were polycrystalline with a low In₂O₃ (222) diffraction peak and relatively high intensity (431) and (046) diffraction peaks. From the observed visible transmittance and electrical properties, it is concluded that the opto-electrical performance of the polycrystalline IWO film deposited by RF magnetron sputtering can be enhanced with effective substrate bias voltage conditions.

• 한국진공학회지
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• 제14권1호
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• pp.17-23
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• 2005

본 논문은 글로우방전 질량분석법(Glow Discharge Mass Spectrometry: GDMS)을 이용하여 구리 박막내의 미량 불순물의 농도분석과 음의 기판 바이어스에 대한 구리 박막내의 불순물의 농도변화에 대해서 고찰하였다. 구리 박막은 실리콘 기판 위에 비질량 분리형 이온빔 증착장비를 이용하여 기판 바이어스를 걸지 않은 경우와 -50 V의 기판 바이어스를 걸은 상태에서 증착하였다. 전기를 통하지 않는 분석 샘플의 경우, 직류(DC) GDMS에 의한 분석시, 샘플 표면에서의 charge-up 효과에 의해 분석에 어려움이 있었지만, 본 실험에서는 간편하게 분석이 가능하도록 샘플을 알루미늄 포일(foil)로 감싸서 구리 박막으로부터 실리콘 기판 뒤의 샘플 홀더까지 전기적 접촉이 이루어지도록 하였다. 구리 타겟과 증착된 구리 박막들에 대한 GDMS 분석결과에 의해서, 전체적으로 박막내의 불순물의 양이 음의 기판 바이어스에 의해 줄어듦으로써 구리 박막의 전체 순도를 높일 수 있다는 것을 알게 되었다. 음의 기판 바이어스에 의한 불순물들의 농도변화는 각각의 불순물의 이온화 포텐셜의 차이에 의한 것으로, 박막 증착시 플라즈마내의 Penning ionization effect와 본 논문에서 제시한 이온화 과정에 의해 각 불순물의 농도변화가 설명되어질 수 있었다. 또한, 기판 위에서의 구리 이온들의 충격에 의한 cleaning effect도 박막내의 불순물의 농도변화에 기여했다고 판단된다.

• 한국진공학회지
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• 제2권4호
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• pp.501-506
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• 1993

The spatial potential distribution of electron cyclotron resonance plasma is measured as a function of tehsubstrate DC bias by Langmuir probe method. It is observed that the substrate DC bias changes the slope of the plasma potential near the subsrate, resulting in changes in flux and energy of the impinging ions across plasma $_strate boundary along themagnetric field. The effect of the substrate DC bias on the low-temperature silicon homoepitaxy (below $560^{\circ}C$) is examine dby in situ reflection high energy electron diffraction (RHEED), cross-section transmission electron microscopy (XTEM),plan-view TEM and high resolution transmision electron microscopy(HRTEM). While the polycrystalline silicon layers are grow withnegative substrate biases, the single crystaline silicon layers are grown with negative substrate biases, the singel crystalline silicon layers are grown with positive substrate biases. As the substrate bias changes form negative to positive values, the growth rate decreases. It is concluded that the control of the ion energy during plasma deposition is very important in silicon epitaxy at low temperatures below $560^{\circ}C$ by UHV-ECRCVD.VD.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 추계종합학술대회 논문집
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• pp.879-882
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• 1999

The effects of the substrate bias on the performance of programming erasing in p-channel flash memory cell have been investigated. It is found that applying positive substrate bias can improve the programming and erasing speed. This improvements can be explained by Substrate Current Induced Hot Electron Injection. From the results, we can confirm that BTB programming method is better in programming and erasing speed than CHE programming method.

• 한국전기전자재료학회논문지
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• 제17권5호
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• pp.526-529
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• 2004

The nematic liquid crysta](NLC) aligning capabilities using a-C:H thin film deposited at the three kinds of rf bias condition were investigated. A high pretilt angle of NLC on low substrate rf bias applied a-C:H thin films was observed and the low pretilt angle of the NLC on high substrate rf bias applied a-C:H thin films was observed. Consequently, the high NLC pretilt angle and the good aligning capabilities of LC alignment by the IB alignment method on the a-C:H thin film deposited at 1 W rf bias condition can be achieved. It is considered that pretilt angle of the NLC may be attributed to substrate rf bias condition and IB energy time. Therefore, LC alignment is affected by topographical structure forming strong IB energy.