• 한국진공학회지
• /
• 제14권4호
• /
• pp.245-251
• /
• 2005

A high performance dual rocking magnet sputtering gun has been developed. The rocking magnet sputtering gun introduces full-face erosion by rapidly rocking the magnet in the region where the high plasma density is maintained. The newly developed dual rocking magnet sputtering gun whose target utilization was 77 percent achieved high performance in quality in the view of target utilization and target life-time comparing to the existing magnetron sputtering gun. The PIC-MCC target erosion simulation has been performed simultaneously. Comparing experimental target erosion profiles with simulated target erosion profiles, the simulation could estimate the tendency of the target erosion profiles but could not estimate an exact target erosion profile. If the simulation were improved more precisely, the cost reduction for the development of the multiple rocking magnet sputtering gun would be expected.

• 한국진공학회지
• /
• 제17권2호
• /
• pp.165-169
• /
• 2008

반도체 소자공정에서 균일한 두께의 금속박막을 증착하는 것은 매우 중요하다. 기존의 기판고정식 sputtering 장비로 증착한 indium tin oxide(ITO)박막의 두께 균일도가 $\pm4%\sim\pm5%$ 정도로 중앙부분이 더 두껍다. 방전전극 구조물을 설계하고 제작하여 sputtering되는 물질의 방향을 조절하였다. 개량된 sputtering gun을 사용하여 기판고정식 sputtering 장비에서 4" wafer 내에서 $\pm0.8\sim1.3%$ 정도로 두께 균일도를 증가시켰다. wafer to wafer에서는 $\pm$5.3%에서 $\pm$1.5%로 두께 균일도가 향상되었다. Al박막의 경우 $\pm$1.0% 이내의 두께 균일도를 얻을 수 있었다.

• Applied Science and Convergence Technology
• /
• 제27권1호
• /
• pp.1-4
• /
• 2018

A sputtering-assisted magnetic field system was successfully developed for depositing crystalline Cu thin films at room temperature. This system employs a plasma source and an ion-beam gun with two magnetic field generators, which is covered with sputtering target and the ion-beam gun, simultaneously serving as sputtering plasma and a magnetic field generator. The formation of crystalline Cu thin films at room temperature was dominated by magnetic fields, which was revealed by preliminary experiments. This system can be employed for producing crystalline metal thin films at room temperature.

• 한국세라믹학회지
• /
• 제40권12호
• /
• pp.1165-1169
• /
• 2003

이중 이온빔 스퍼터링(Dual ion-beam sputtering)을 사용하여 보조이온건의 Ar/O$_2$가스유량 변화에 따라 Si-(III) 기판과 glass에 Ta$_2$O$_{5}$ 박막을 증착시켰다. 보조 이온총의 산소 가스량의 비가 감소함에 따라서 증착되는 Ta$_2$O$_{5}$ 박막의 성장속도는 감소하였으며, 굴절률은 $O_2$ 가스의 양이 0∼12sccm인 범위에서 2.09(at 1550nm)로 일정한 값을 나타내었다. Ar:O$_2$가 3: 12인 조건에서 화학양론 조성인 Ta$_2$O$_{5}$를 형성하였으며, 표면 거칠기도 가장 작은 값을 나타내었다.나타내었다.

• Journal of Information Display
• /
• 제8권3호
• /
• pp.5-10
• /
• 2007

Twin target sputtering (TTS) system with a configuration of vertically parallel facing Al targets and a substrate holder perpendicular to the Al target plane has been designed to realize a direct Al cathode sputtering on organic light emitting diodes (OLEDs). The TTS system has a linear twin target gun with ladder type magnet array for effective and uniform confinement of high density plasma. It is shown that OLEDs with Al cathode deposited by the TTS show a relatvely lower leakage current density $({\sim}1{\times}10^{-5}mA/cm^2)$ at reverse bias of -6V, compared to that ($1{\times}10^{-2}{\sim}10^{-3}$ $mA/cm^2$ at -6V) of OLEDs with Al cathodes grown by conventional DC magnetron sputtering. In addition, it was found that Al cathode films prepared by TTS were amorphous structure with nanocrystallines due to low substrate temperature. This demonstrates that there is no plasma damage caused by the bombardment of energetic particles. This indicates that the TTS system with ladder type magnet array could be useful plasma damage free deposition technique for direct Al cathode sputtering on OLEDs or flexible OLEDs.

• 한국자기학회지
• /
• 제6권3호
• /
• pp.170-173
• /
• 1996

3-gun 마그네트론 스퍼터 장치로 Co-Zr 다층 박막을 제작하여 저온 비정질화를 시도하였다. 박막 x-ray와 단면 투과 전자현미경 분석에 의해 지르코늄 층이 코발트의 확산에 의해 비정질화 됨과 그의 위쪽 계면의 지르코늄 비정질화 속도가 아래쪽 계면의 그것보다 두 내지 세배 빠른 것을 발견하였다. 이 현상은 스퍼터링 중의 분자 섞임으로 설명되었다.

• Transactions on Electrical and Electronic Materials
• /
• 제14권2호
• /
• pp.86-89
• /
• 2013

Dye-sensitized solar cells have a FTO/$TiO_2$/Dye/Electrode/Pt counter electrode structure, yet more than a 10% electron loss occurs at each interface. A passivating layer between the $TiO_2$/FTO glass interface can prevent this loss of electrons. In theory, ZnO has excellent electron collecting capabilities and a 3.4 eV band gap, which suppresses electron mobility. FTO glass was coated with ZnO thin films by RF-magnetron sputtering; each film was deposited under different $O_2$:Ar ratios and RF-gun power. The optical transmittance of the ZnO thin film depends on the thickness and morphology of ZnO. The conversion efficiency was measured with the maximum value of 5.22% at an Ar:$O_2$ ratio of 1:1 and RF-gun power of 80 W, due to effective prevention of the electron recombination into electrolytes.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
• /
• pp.67-70
• /
• 1999

We have fabricated YBa$_2Cu_3O_{7-x}$ thin films by cylindrical hollow cathode sputtering. For 2 inch diameter of MgO (100) substrate, we obtained the zero resistance temperature in the range from 83 K to 86 K and thickness uniformity better than 5 % over the whole area. Also, the average deposition rate was 100nm/h which is higher than 10 times compare to conventional off-axis sputtering method. These results indicate that cylindrical hollow cathode sputtering seems to have unique capabilities for high rate and homogeneous deposition of large area thin film.

• 한국초전도ㆍ저온공학회논문지
• /
• 제6권3호
• /
• pp.27-32
• /
• 2004

High temperature superconducting coated conductor has a structure of /< superconducting layer>//. The buffer layer consists of multi layer, and the architecture most widely used in RABiTS approach is CeO$_2$(cap layer)/YSZ(diffusion barrier layer)/CeO$_2$(seed layer). Evaporation technique is used for the CeO$_2$ layer and DC reactive sputtering technique is used for the YSZ layer, A chamber was set up specially for DC reactive sputtering, Detailed features are as following. A separator divided the chamber into two halves a sputtering chamber and a reaction chamber. The argon gas for sputtering target elements flows out of the cap of sputtering gun, and water vapor for reaction with depositing species spouts near the substrate. Turbo pump is connected with reaction chamber. High speed deposition of YSZ film could be achieved in the chamber. Detailed deposition conditions (temperature and partial pressure of reaction gas) were investigated for the rapid growth of high quality YSZ film.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
• /
• pp.500-501
• /
• 2005

Aluminum doped zinc oxide films (ZnO:Al) were deposited on glass substrate by DC magnetron sputtering from a ZnO target mixed with 2 wt% $Al_2O_3$. The effects of substrate bias on the electrical properties and film structure were studied. Films deposited with positive bias have been annealed at $600^{\circ}C$ using rapid thermal anneal (RTA) process. The effects of RTA on the evolution of film microstructure are to be also studied using X-ray diffraction, transmission electron microscopy, and atomic force microscopy. Positive bias sputtering may induce lattice defects caused by electron bombardments during deposition. The as-deposited film microstructure evolves from the film with high defect density to more stable film condition. The electrical properties of the films after RTA process were also studied and the results were correlated with the evolution of film microstructures.