• Title/Summary/Keyword: spice model

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The Learning Capability Diagnosis System based on SPICE Model (SPICE 모델을 기반으로한 학습능력 진단 시스템)

  • Song, Ki-Won;Lee, Yu-Young;Jeong, Je-Hong;Kim, Jin-Soo
    • Proceedings of the Korea Information Processing Society Conference
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    • 2001.10a
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    • pp.485-488
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    • 2001
  • 본 논문에서는 웹상에서 학습자의 학습능력을 진단하기 위하여 SPICE 모델에서 제시하는 능력수준을 사용하여 각 단계별로 질문을 제시하고 해당 질문의 응답 여부에 따라 자신의 학습 능력을 평가받고 향후 자신의 능력을 좀더 향상시킬 수 있는 지침을 제공하는 학습능력 진단 시스템을 개발하였다. 본 시스템은 다양한 학습자의 학습능력을 진단할 수 있도록 학습자의 직업에 따라 별도의 질문 리스트를 준비하였으며 질문 리스트와 메세지 및 가산점을 조정한다면 다양한 분야에서도 활용될 수 있을 것이다.

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Design of Software Process Metrics and Procedures for Software Process Measurement (소프트웨어 프로세스 측정절차와 메트릭스 설계)

  • Hwang, Sun-Myung
    • The KIPS Transactions:PartD
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    • v.10D no.4
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    • pp.719-726
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    • 2003
  • A SPICE (Software Process Improvement and Capability dEtermination) and CMM (Capability Maturity Model) assessment can be considered as representative software process assessment models since assessors assign ratings to indicators and metrics to measure the capability of software precesses. But ail of process assessment models don't provide a subjective measurement procedure and metrics. In this paper we define basic quality process metrics and propose standard metrics for each process based on SPICE and CMM. This study also proposed a guideline for a subjective measurement procedure and the metrics are effectively use to SPI.

Heat kTransfer Modeling and Characteristics Analysis of Impulsed Magnetizing Fisture (임펄스 착자요크의 열전달 모델링 및 특성 해석)

  • 백수현;김필수
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.43 no.3
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    • pp.381-387
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    • 1994
  • In this paper, we found the improved SPICE heat transfer modeling of impulsed magnetizing fixture system and investigated temperature characteristics using the proposed model. As the detailed thermal characteristics of magnetizing fixture can be obtained, the efficient design of the impulsed magnetizing fixture which produce desired magnet will be possible using our heat transfer modeling. The knowledge of the temperature of the magnetizing fixture is very important of forecast the characteristics of the magnetizing fixture which produce desired magnet will be possible using our heat transfer modeling. The knowledge of the temperature of the magnetizing fixture is very important to forecast the characteristics of the magnetizing circuits under different conditions. The capacitor voltage was not raised above 810[V] to protect the magnetizing fixture from excessive heating. The purpose of this work is to compute the temperature increasing for different magnetizing conditions. The method uses multi-lumped model with equivalent thermal resistance and thermal capacitance. The reliable results are obtained by using iron core fixture (stator magnet of air cleaner DC motor) coupled to a low-voltage magnetizer(charging voltage : 1000[V], capacitor : 3825[$\mu$F]. The modeling and experimental results are in close aggrement.

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Macro Modeling of a Feedback Field-effect Transistor (피드백 전계 효과 트랜지스터의 메크로 모델링 연구)

  • Oh, Jong Hyeok;Yu, Yun Seop
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2021.10a
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    • pp.634-636
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    • 2021
  • In this study, we studied the macro-modeling of an feedback field-effect transistor (FBFET) using SPICE simulation. The previously presented macro-model of the FBFET is consisting of two circuits. one is charge integration circuit, and the other is current generation circuit. The previous current generation circuit has problem that can't predict performance accurately of the circuits, due to implementing only IDS-VGS characteristics. To solve this problem, we presents a model that can implement not only IDS-VGS characteristics but alos IDS-VDS characteristics by adding the diode in the current generation circuit.

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Electrical modelling for thermal behavior and gas response of combustible catalytic sensor (접촉연소식 센서의 열 특성 및 가스반응의 모델링)

  • Lee, Sang-Mun;Song, Kap-Duk;Joo, Byung-Su;Lee, Yun-Su;Lee, Duk-Dong
    • Journal of Sensor Science and Technology
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    • v.15 no.1
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    • pp.34-39
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    • 2006
  • This study provides the electrical model of combustible catalytic gas sensor. Physical characteristics such as thermal behavior, resistance change were included in this model. The finite element method analysis for sensor device structure showed that the thermal behavior of sensor is expressed in a simple electrical equivalent circuit that consists of a resistor, a capacitor and a current source. This thermal equivalent circuit interfaces with real electrical circuit using two parts. One is 'power to heat' converter. The other is temperature dependent variable resistor. These parts realized with the analog behavior devices of the SPICE library. The gas response tendency was represented from the mass transferring limitation theory and the combustion theory. In this model, Gas concentration that is expressed in voltage at the model, is converted to heat and is flowed to the thermal equivalent circuit. This model is tested in several circuit simulations. The resistance change of device, the delay time due to thermal capacity, the gas responses output voltage that are calculated from SPICE simulations correspond well to real results from measuring in electrical circuits. Also good simulation result can be produced in the more complicated circuit that includes amplifier, bios circiut, buffer part.

Mulberry Paper Bag μ-Solid Phase Extraction for the Analysis of Five Spice Flavors by Gas Chromatography-Mass Spectrometry

  • Yoon, Ok-Kyung;Lee, Dong-Sun
    • Bulletin of the Korean Chemical Society
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    • v.30 no.1
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    • pp.35-42
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    • 2009
  • Headspace micro solid phase extraction using mulberry paper bag (HS-MPB-$\mu$-SPE) has been developed and validated for the analysis of volatile flavor compounds from five spice by gas chromatography-mass spectrometry (GC/MS). HS-MPB-$\mu$-SPE was performed with adsorbent particles enclosed inside a mulberry paper bag. Four different kinds of adsorbents such as Tenax TA, Porapack Q, dimethylpolysiloxane and polyethylene glycol were tested. The extraction solvents compared were petroleum ether, methylene chloride, and chloroform. Better results were obtained when Tenax TA and petroleum ether were used. The limit of detection (LOD) and the limit of quantitation (LOQ) were in the range of 1.3 ng/mL and 4.3 ng/mL, respectively, for o-cymene as a model compound of monoterpene. Proposed method showed good reproducibility (3.3%, RSD) and good recoveries (94.0%). The HS-MPB- μ-SPE is very simple to use, inexpensive, rapid, requires small sample amounts and solvent consumption. Because the solvent for extraction is reduced to only a very small volume (0.6 mL), there is minimal waste or exposure to toxic organic solvent and no further concentration step. This method allows successful characterization of the headspace in contact with the five spice sample. Strong trans-anethole from star anise or fennel is a characteristic flavor of five spice powders. HS-MPB-$\mu$-SPE combined with GC/MS can be a promising technique for the broad spectrum measurement of volatile aroma compounds from solid spices.

Macro-Modeling for Magnetic Tunnel Junction (Magnetic Tunnel Junction 의 Macro-Modeling)

  • 홍승균;송상헌;김수원
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.943-946
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    • 2003
  • This paper proposes new SPICE Macro-Model of MTJ(Magnetic Tunnel Junction). This Macro-Model has five I/O terminals, reproduces MR characteristics including hysteresis and behaves correctly to time varying input signals. Furthermore, this Model can be easily modified to various MTJs with different characteristics by simply varying internal parameters.

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Accurate SSN Analysis using Wideband Decoupling Capacitor Model (광대역 디커플링 캐패시터 모델을 이용한 정확한 SSN 분석)

  • 손경주;권덕규;이해영;최철승;변정건
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.12 no.7
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    • pp.1048-1056
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    • 2001
  • Decoupling capacitors are commonly used to reduce the effect of SSN propagated through parallel power and ground planes in high-speed multilayer printed circuit boards (PCBs). In this paper, we introduced a simple high frequency measurement and proposed a wideband (50 MHz ∼3 GHz) equivalent circuit model for decoupling capacitor considering high frequency parasitic effects. The proposed model can be easily combined with the SPICE model of power supply planes far SSN analysis. The circuit simulations with the proposed model show good agreement with the measurement results. Also, we expect to accurately analyze the noise reduction effect as a function of value and location using the proposed model of decoupling capacitor.

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Integrated Circuit Implementation and Analysis of a Pulse-type Hodgkin-Huxley Neuron Model (펄스형 호지킨-혁슬리 신경세포 모델의 집적회로 구현 및 분석)

  • Kwon, Bo-Min;Jung, Jin-Woo;Park, Ju-Hong;Lee, Je-Won;Park, Yong-Su;Song, Han-Jung
    • 전자공학회논문지 IE
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    • v.46 no.1
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    • pp.16-22
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    • 2009
  • Integrated circuit of a pulse-type neuron for Hodgkin-Huxley model is implemented in a $0.5{\mu}m$ 1 poly 2 metal CMOS technology. Proposed pulse-type neuron model consist of input stage with summing function and pulse generating block which make neuron pulse above threshold value. Pulse generating circuit consist of several transistors, capacitors and negative resistor with a charge supply function. SPICE simulation results show that neuron pulse is generated above threshold current of 70 nA. Measurements of the fabricated pulse type neuron chip in condition of 5 V power supply are shown and compared with the simulated results.

A Design of Thin Film Thermoelectric Cooler for Chip-on-Board(COB) Assembly (박막형 열전 소자를 이용한 Chip-on-Board(COB) 냉각 장치의 설계)

  • Yoo, Jung-Ho;Lee, Hyun-Ju;Kim, Nam-Jae;Kim, Shi-Ho
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.9
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    • pp.1615-1620
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    • 2010
  • A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.