• 반도체디스플레이기술학회지
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• 제12권3호
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• pp.23-27
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• 2013

This paper is for enhancing the breakdown voltage of MHEMTs with an InP-etchstop layer. Gate-recess structures has been simulated and analyzed for the breakdown of the devices with the InP-etchstop layer. The fully removed recess structure in the drain side of MHEMT shows that the breakdown voltage enhances from 2V to almost 4V and that the saturation current at gate voltage of 0V is reduced from 90mA to 60mA at drain voltage of 2V. This is because the electron-captured negatively fixed charges at the drain-side interface between the InAlAs barrier layer and the $Si_3N_4$ passivation layer deplete the InGaAs channel layer more and thus decreases the electron current passing the channel layer. In the paper, the fully-recessed asymmetric gate-recess structure at the drain side shows the on-breakdown voltage enhancement from 2V to 4V in the MHEMTs.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.1297-1298
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• 2010

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권2호
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• pp.223-229
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• 2017

This paper analyzes the effect of a dual-metal-gate structure on the electrical characteristics of AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors. These structures have two gate metals of different work function values (${\Phi}$), with the metal of higher ${\Phi}$ in the source-side gate, and the metal of lower ${\Phi}$ in the drain-side gate. As a result of the different ${\Phi}$ values of the gate metals in this structure, both the electric field and electron velocity in the channel become better distributed. For this reason, the transconductance, current collapse phenomenon, breakdown voltage, and radio frequency characteristics are improved. In this work, the devices were designed and analyzed using a 2D technology computer-aided design simulation tool.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권1호
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• pp.18-22
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• 2005

We have proposed and fabricated a dual gate AlGaN/GaN high electron mobility transistor (HEMT), which exhibits the low leakage current and the high breakdown voltage for the high voltage switching applications. The additional gate between the main gate and the drain is specially designed in order to decrease the electric field concentration at the drain-side of the main gate. The leakage current of the proposed HEMT is decreased considerably and the breakdown voltage increases without sacrificing any other electric characteristics such as the transconductance and the drain current. The experimental results show that the breakdown voltage and the leakage current of proposed HEMT are 362 V and 75 nA while those of the conventional HEMT are 196 V and 428 nA, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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• pp.10-13
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• 2000

The notching effect in etching of un doped amorphous silicon gate had different characteristics and mechanism comparing with reported ones. The undoped amorphous silicon was etched by using HBr gas plasma, First, in the region of small line width, the potential was increased as a result of ions in the exposed surface of oxide, and the incident ions between the small line width were deflected more wide range, therefore the depth of notching was shallow and wide, Second, in the region of large line width of gate, electrons were charged on the top of photoresist and the side of gate, a part of ions deflected, The deflected ions were locally charged positive on the side of gate, and then the potential difference was produced, therefore, ions stored up more at independent line than at dense line, and nothing became deeper by Br ion bombardment.

• JSTS:Journal of Semiconductor Technology and Science
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• 제6권2호
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• pp.101-105
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• 2006

Nanoscale floating-gate characteristic of colloidal Au nanoparticles electrostatically assembled on the oxidized surface of Si nanowires have been investigated. The Si nanowire split-gate transistor structure was fabricated by electron beam lithography and subsequent reactive ion etching. Colloidal Au nanoparticles with ${\sim}5$ nm diameters were selectively deposited onto the Si nanowire surface by 2 min electrophoresis. It was found that electric fields applied to the self-aligned split side gates allowed charge to be transferred on the Au nanoparticles. It was observed that the depletion mode cutoff voltage, induced by the self-aligned side gates, was shifted by more than 1 V after Au nanoparticle electrophoresis. This may be due to the semi-one dimensional nature of the narrow Si nanowire transport channel, having much enhanced sensitivity to charges on the surface.

• 한국조경학회지
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• 제27권1호
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• pp.110-121
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• 1999

The purpose of this study is to focus on the characteristics of the form and preference of the main gates of universities. The gate of a university have both functions and artistic design aspects. Fifty-two universities selected for this study were placed all around country except for Je-ju island. The following two research methods were used for this study. 1) an analysis of form character through a classification of the types. 2) and analysis of preference to the gates through a side show. The results are summarized as follows: 1. Main gates of universities were classified by covered-type and uncovered-type in existence of cover. And they were classified by eighteen types in detail. 2. Visual preference have been analyed by using the regression, the result is as follows: Y=-0.357+0.630 X$_4$+0.377X$_1$+0.075X$_2$-0.015X$_3$($R^2$=0.971, X$_4$;harmony, X $_1$;speciality, X$_2$;softness, X$_3$;complex) 3. The gate of Chung-Ang university(Ahn Sung campus) is the highest of all the universities at the average of preference 4.32 through result of slide show. Covered type has a higher preference than uncovered type. This has a good modification and decoration in front side type of main gate.

• Journal of Power Electronics
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• 제7권4호
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• pp.294-300
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• 2007

This paper deals with a design of a bootstrap power supply using snubber energy regeneration, which is used to power a high-side gate driver of a half-bridge circuit. In the proposed circuit, the energy stored in the low-side snubber capacitor is transferred to the high-side bootstrap capacitor without any magnetic components. Thus, the power dissipation in the RCD snubber can be effectively reduced. The operation principle and design method of the proposed circuit are presented. The experimental results are also provided to show the validity of the proposed circuit.

• Journal of Power Electronics
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• 제17권5호
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• pp.1372-1381
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• 2017

This paper presents a high-side switch driver IC capable of improving the current sensing accuracy and providing reverse battery protection. Power semiconductor switches used to replace relay switches are encumbered by two disadvantages: they are prone to current sensing errors and they require additional external protection circuits for reverse battery protection. The proposed IC integrates a gate driver and current sensing blocks, thus compensating for these two disadvantages with a single IC. A p-sub-based 90-V $0.13-{\mu}m$ bipolar-CMOS-DMOS (BCD) process is used for the design and fabrication of the proposed IC. The current sensing accuracy (error ${\leq}{\pm}5%$ in the range of 0.1 A-6.5 A) and the reverse battery protection features of the proposed IC were experimentally tested and verified.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2002년도 춘계학술대회논문집
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• pp.13-19
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• 2002

In inner harbour of Inchon Port, there are two lock gates (50KT, 10KT) which have two gates per lock gate in inner/outer sides except a gate in inner harbour side 7f 10KT. Due to the lack of the fore-mentioned gate, the use of 10KT lock gate Is suspended in every 3 years for regular maintenance. Now an additional gate is under construction in order to improve the efficiency of the 10KT lock gate. This paper will be aimed to evaluate the operational utilization levels of lock gates in present and future. The present operational utilization levels of lock gates are 0.2119 in 10KT lock gate, 0.2051 in 50KT lock gate which were considered the 46.5 closed days every 3 years for 10KT regular maintenance. The levels are estimated to 0.2246(10KT), 0.2539(50KT) in 2006 and 0.2241(10KT), 0.2560(50KT) in 2011. The levels of 50KT lock gate are evaluated to be more rapidly increased up to 24.5% in 2011.