• Journal of Power Electronics
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• 제18권1호
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• pp.23-33
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• 2018

Silicon Carbide (SiC) MOSFET belongs to the family of wide-band gap devices with inherit property of low switching and conduction losses. The stable operation of SiC MOSFET at higher operating temperatures has invoked the interest of researchers in terms of its application to high power density (HPD) power converters. This paper presents a performance study of SiC MOSFET based two-phase interleaved boost converter (IBC) for regulation of avionics bus voltage in more electric aircraft (MEA). A 450W HPD, IBC has been developed for study, which delivers 28V output voltage when supplied by 24V battery. A gate driver design for SiC MOSFET is presented which ensures the operation of converter at 250kHz switching frequency, reduces the miller current and gate signal ringing. The peak current mode control (PCMC) has been employed for load voltage regulation. The efficiency of SiC MOSFET based IBC converter is compared against Si counterpart. Experimentally obtained efficiency results are presented to show that SiC MOSFET is the device of choice under a heavy load and high switching frequency operation.

• 전자공학회논문지D
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• 제36D2호
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• pp.71-80
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• 1999

본 논문에서는 2${\mu}m$ 고전압 CMOS 공정을 사용한 보호 회로를 포함한 전력 ,MOSFET 구동기를 설계하였다. 제어 회로의 안정한 동작을 위하여 전원 관리 회로를 설계하였으며 전원 관리 회로의 전압 레귤레이터의 보호를 위하여 전압 검출 방식의 단락 보호 회로를 제안하였다. 전압 검출 방식(Voltage-Detection Short Circuit Protection; VDSCP)은 직렬 저항에 의한 전압 강하가 없고, 출력단 단락 상태에서 전압원의 전류를 출력단에 흐르지 못하도록 하는 특성이 있다. 전력 MOSFET를 보호하기 위하여 부하 단락 보호회로, 게이트 전압 제한 회로, 과전압 보호 회로를 설계하였으며, 50V의 항목 전압을 닺는 공정을 이용하여 전력 MOSFET 구동기를 위한 2${\mu}m$ 고전압 CMOS 공정을 개발하였다. 전력 MOSFET이 소비하는 전력 이외에 구동기가 소비하는 전력은 전력 MOSFET 구동 상태에 따라 20 ~ 100mW의 범위에 있는 것으로 확인하였다. 주문형으로 제작된 전력 MOSFET 구동기의 active area의 크기는 $3.5 {\times}2..8mm^2$이다.

• 한국전기전자재료학회논문지
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• 제28권9호
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• pp.555-560
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• 2015

This paper was proposed 900 V Power MOSFET with ESD protection circuits using zener diodes. And we were carried out and analyzed its electrical characteristics. As a result of designing 900 V power MOSFET, we obtained 1,000 V breakdown voltage, 3.49 V threshold voltage and $0.249{\Omega}{\cdot}cm^2$. And we designed ESD circuits using 2 series zener diode and 4 series zener diodes. After analyzing electrical characteristics, we obtained 26 V forward voltage drop and 47 V breakdown voltage. Therefore, This devices can enoughly use power module, SMPS and Automotive.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.353-356
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• 2004

This paper discribes the analysis of the I-V characteristics of 4H-SiC DiMOSFET with single epi-layer Silicon Carbide has been around for over a century. However, only in the past two to three decades has its semiconducting properties been sufficently studied and applied, especially for high-power and high frequency devices. We present a numerical simulation-based optimization of DiMOSFET using the general-purpose device simulator MINIMIS-NT. For simulation, a loin thick drift layer with doping concentration of $5{\times}10^{15}/cm^3$ was chosen for 1000V blocking voltage design. The simulation results were used to calculate Baliga's figure of Merit (BFOM) as the criterion structure optimization and comparison.

• 전력전자학회논문지
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• 제19권3호
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• pp.283-289
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• 2014

This paper carries out a series of analysis of power system using Gallium Nitride (GaN) FET which has wide band gap (WBG) characteristics comparing to conventional Si MOSFET-used power system. At first, for comparison of each semiconductor device, the switching-transient parameter is quantitatively extracted from released information of GaN FET. And GaN FET model which reflect this dynamic property is configured. By using this model, the performance of GaN FET is analyzed comparing to Si MOSFET. Also, in order to enable a representative assessment on the power system level, Si MOSFET and GaN FET are applied to the most common structure of power system, full-bridge, and each power systems are compared based on various criteria, such as performance, efficiency and power density. The entire process is verified with the aid of mathematical analysis and simulation.

• 전력전자학회:학술대회논문집
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• 전력전자학회 1998년도 전력전자학술대회 논문집
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• pp.460-465
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• 1998

Due to high power ratings and low conduction loss, the IGBT has become more attractive in switching power supplies. However, its turn-on and turn-off characteristics cause severe switching loss and switching frequency limitation. This paper proposes 2.4kW, 48V, high efficiency half-bridge DC-DC converter using paralleled IGBT-MOSFET switch concept, where each of IGBT and MOSFET plays its part during on-periods and switching instants. The switching loss is analyzed by using the linearized model and the opteration of the converter are investigated by simulation results.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2008년도 추계학술대회 논문집
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• pp.218-220
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• 2008

This paper describes buck converter's MOSFET driver for high-brightness LED strings. The power driving high-side MOSFET is supplied from the power source of control circuit part. The practical considerations and future work are also described.

• 전기전자학회논문지
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• 제18권4호
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• pp.532-535
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• 2014

본 논문에서는 Super Juction MOSFET의 우수한 열 특성을 검증하기 위해 도출된 공정 및 설계파라미터를 이용하여 열특성을 분석하였다. 열 특성 중 핵심공정인 Trench 식각 각도에 따른 온도차이, 열 저항, 그 때 흐르는 드레인 전류를 측정하여 전체 소비전력을 분석하였다. 분석한 결과 Trench 식각 각도가 $89.3^{\circ}$ 일 때 온도차와 열 저항 값이 가장 작게 나왔으며, 식각 각도에 따라서 분포는 경향성을 보이지 않았다. 따라서 반복 시뮬레이션과 실험을 통해 최적의 값을 도출해야 되며, 본 측정 결과 최적의 식각 각도는 $89.3^{\circ}$와 $89.6^{\circ}$의 결과를 보였다. 다른 전기적인 특성을 고려하여 최종 식각 각도를 보여야 하며, 열 특성의 우수한 SJ MOSFET이 산업에의 이용을 위해 본 논문의 자료가 충분히 활용할 수 있을 것으로 판단된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.19-22
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• 2003

In this paper, a new small size Lateral Trench Electrode Power MOSFET with local doping is proposed. This new structure is based on the conventional lateral power MOSFET. The entire electrodes of proposed device are placed in trench oxide. The forward blocking voltage of the proposed device is improved by 3.3 times with that of the conventional lateral power MOSFET. The forward blocking voltage of proposed device is about 500V. At the same size, a increase of the forward blocking voltage of about 3.3 times relative to the conventional lateral power MOSFET is observed by using TMA-MEDICI which is used for analyzing device characteristics. Because the electrodes of the proposed device are formed in trench oxide respectively, the electric field in the device are crowded to trench oxide. And because of the structure which has a narrow drain doping width, the punch through breakdown can be occurred in higher voltage than that of conventional lateral power MOSFET. We observed that the characteristics of the proposed device was improved by using TMA-MEDICI and that the fabrication of the proposed device is possible by using TMA-TSUPREM4.

• Journal of Power Electronics
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• 제5권4호
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• pp.247-256
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• 2005

In order to harvest power in an efficient manner from a micro piezoelectric (PZT) device for charging the battery of a remote system, a new AC/DC resonant pulse power converter is proposed. The proposed power converter has two stages in the power conversion process. The first stage includes N-type MOSFET full bridge rectifier. The second stage includes a boost converter having an N-type MOSFET and a P-type MOSFET. MOSFETs work in the $1^{st}$ or $3^{rd}$ quadrant region. A small inductor for the boost converter is assigned in order to make the size of the power converter as small as possible, which makes the on-interval of the MOSFET switch of the boost converter ultimately short. Due to this short on-interval, the parasitic junction capacitances of MOSFETs affect the performance of the power converter system. In this paper, the performance of the new converter is analytically and experimentally evaluated with consideration of the parasitic capacitance of switching devices.