• 제목/요약/키워드: polycrystalline metal

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Silicidation and Thermal Stability of the So/refreactory Metal Bilayer on the Doped Polycrystalline Si Substrate (Co/내열금속/다결정 Si 구조의 실리사이드화와 열적안정성)

  • 권영재;이종무
    • Journal of the Korean Ceramic Society
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    • v.36 no.6
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    • pp.604-610
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    • 1999
  • Silicide layer structures and morphology degradation of the surface and interface of the silicide layers for he Co/refractory metal bilayer sputter-deposited on the P-doped polycrystalline Si substrate and subjected to rapid thermal annealing were investigated and compared with those on the single Si substrate. The CoSi-CoSi2 phase transition temperature is lower an morphology degradation of the silcide layer occurs more severely for the Co/refractorymetal bilayer on the P-doped polycrystalline Si substrate than on the single Si substrate. Also the final layer structure and the morphology of the films after silicidation annealing was found to depend strongly upon the interlayer metal. The layer structure after silicidation annealing of Co/Hf/doped-poly Si is Co-Hf alloy/polycrystalline CoSi2/poly Si substrate while that of Co/Nb is polycrystalline CoSi2/NbSi2/polycrystalline CoSi2/poly Si.

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The Study on the WEDM of Polycrystalline Diamond (다결정 다이아몬드의 와이어방전가공에 관한 연구)

  • Kim, Chang-Ho;Kang, Jae-Won;Oh, Jang-Uk;Seo, Jae-Bong
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.7 no.3
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    • pp.67-74
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    • 2008
  • Polycrystalline diamonds(PCD) tools are widely used in machining a large variety of advanced materials. However, the manufacture of PCD tool blanks is not an economical process. The shaping of PCD blanks with conventional machining methods(such a grinding) is long, labor-intensive process. This paper reports experimental investigation of the influence of electrical machining conditions on the metal removal rate of WEDM of PCD. Experimental results show that the longer pulse-on time and the shorter pulse-off time increase the metal removal rate and worsen the surface quality. The smaller grain size of diamond yields the metal removal rate and shows the better surface quality. Higher electrical conductivity of water yields worse surface roughness.

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Edge Cut Process for Reducing Ni Content at Channel Edge Region in Metal Induced Lateral Crystallization Poly-Si TFTs

  • SEOK, Ki Hwan;Kim, Hyung Yoon;Park, Jae Hyo;Lee, Sol Kyu;Lee, Yong Hee;Joo, Seung Ki
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.2
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    • pp.166-171
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    • 2016
  • Nickel silicide is main issue in Polycrystalline silicon Thin Film Transistor (TFT) which is made by Metal Induced Lateral Crystallization (MILC) method. This Nickel silicide acts as a defect center, and this defect is one of the biggest reason of the high leakage current. In this research, we fabricated polycrystalline TFTs with novel method called Edge Cut (EC). With this new fabrication method, we assumed that nickel silicide at the edge of the channel region is reduced. Electrical properties are measured and trap state density also calculated using Levinson & Proano method.

Microstructural study of polycrystalline films prepared by Ni vapor induced crystallization

  • Ahn, Kyung-Min;Lee, Kye-Ung;Ahn, Byung-Tae
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.715-717
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    • 2006
  • $NiCl_2$ vapor was introduced into conventional furnace to conduct vapor-induced crystallization (VIC) process. We made the metal chloride atmosphere by sublimating the $NiCl_2$ compound. The $NiCl_2$ atmosphere enhanced the crystallization of amorphous silicon thin films. As the result, polycrystalline Si film with large grain size and low metal contamination has been obtained.

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Preparation of Polycrystalline Mullite Fiber Using the Sol-Gel Technique (졸-겔법에 의한 다결정 물라이트 섬유의 제조)

  • 김경용;김윤호;이수원;정형진;김구대
    • Journal of the Korean Ceramic Society
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    • v.26 no.6
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    • pp.795-801
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    • 1989
  • The polycrystalline mullite fiber was synthesized from various combination of starting materials including metal alkoxides and colloidal sol by the sol-gel process. The best spinnability was observed in the sol which showed shear thinning and hysteresis (i.e., thixotropic flow), indicating that the network structure was broken down as the shear rate increased. The mullite fiber was polycrystalline after firing and characterized by thermal analysis, XRD, FT-IR spectroscopy, rheological measurements, and SEM.

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Reviews on Post-synthetic Modification of Metal-Organic Frameworks Membranes (다결정 금속 유기 골격체 분리막의 후처리 성능 제어기술 개발 동향)

  • Hyuk Taek, Kwon;Kiwon, Eum
    • Membrane Journal
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    • v.32 no.6
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    • pp.367-382
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    • 2022
  • Numerous metal-organic frameworks (MOFs) produced by periodic combinations of organic ligands and metal ions or metal-oxo clusters have led the way for the creation of energy-efficient membrane-based separations that may serve as viable replacements for traditional thermal counterparts. Although tremendous progress has been made over the past decade in the synthesis of polycrystalline MOF membranes, only a small number of MOFs have been exploited in the relevant research. Intercrystalline defects, or nonselective diffusion routes in polycrystalline membranes, are likely the reason behind the delay. Postsynthetic modifications (PSMs) are newly emerging strategies for providing polycrystalline MOF membrane diversity by leveraging advanced membranes as a platform and improving their separation capabilities via physical and/or chemical treatments; therefore, neither designing and developing MOFs nor tailoring membrane synthesis techniques for focused MOFs is necessary. In this minireview, seven subclasses of PSM techniques that have recently been adapted to polycrystalline MOF membranes are outlined, along with obstacles and future directions.

Effects of Doping Concentration of Polycrystalline Silicon Gate Layer on Reliability Characteristics in MOSFET's (MOSFET에서 다결정 실리콘 게이트 막의 도핑 농도가 신뢰성에 미치는 영향)

  • Park, Keun-Hyung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.2
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    • pp.74-79
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    • 2018
  • In this report, the results of a systematic study on the effects of polycrystalline silicon gate depletion on the reliability characteristics of metal-oxide semiconductor field-effect transistor (MOSFET) devices were discussed. The devices were fabricated using standard complimentary metal-oxide semiconductor (CMOS) processes, wherein phosphorus ion implantation with implant doses varying from $10^{13}$ to $5{\times}10^{15}cm^{-2}$ was performed to dope the polycrystalline silicon gate layer. For implant doses of $10^{14}/cm^2$ or less, the threshold voltage was increased with the formation of a depletion layer in the polycrystalline silicon gate layer. The gate-depletion effect was more pronounced for shorter channel lengths, like the narrow-width effect, which indicated that the gate-depletion effect could be used to solve the short-channel effect. In addition, the hot-carrier effects were significantly reduced for implant doses of $10^{14}/cm^2$ or less, which was attributed to the decreased gate current under the gate-depletion effects.

Dynamic Characteristics of Multi-Channel Metal-Induced Unilaterally Precrystallized Polycrystalline Silicon Thin-Film Transistor Devices and Circuits (금속 유도 일측면 선결정화에 의해 제작된 다채널 다결정 실리콘 박막 트랜지스터 소자 및 회로의 전기적 특성 평가)

  • Hwang, Wook-Jung;Kang, Il-Suk;Lim, Sung-Kyu;Kim, Byeong-Il;Yang, Jun-Mo;Ahn, Chi-Won;Hong, Soon-Ku
    • Korean Journal of Materials Research
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    • v.18 no.9
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    • pp.507-510
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    • 2008
  • Electrical properties of multi-channel metal-induced unilaterally precrystallized polycrystalline silicon thin-film transistor (MIUP poly-Si TFT) devices and circuits were investigated. Although their structure was integrated into small area, reducing annealing process time for fuller crystallization than that of conventional crystal filtered MIUP poly-Si TFTs, the multi-channel MIUP poly-Si TFTs showed the effect of crystal filtering. The multi-channel MIUP poly-Si TFTs showed a higher carrier mobility of more than 1.5 times that of the conventional MIUP poly-Si TFTs. Moreover, PMOS inverters consisting of the multi-channel MIUP poly-Si TFTs showed high dynamic performance compared with inverters consisting of the conventional MIUP poly-Si TFTs.

Low Temperature Polycrystalline Silicon Deposition by Atmospheric Pressure Plasma Enhanced CVD Using Metal Foam Showerhead (다공성 금속 샤워헤드가 적용된 상압플라즈마 화학기상증착법을 이용한 저온 다결정 실리콘 증착 공정)

  • Park, Hyeong-Gyu;Song, Chang-Hoon;Oh, Hoon-Jung;Baik, Seung Jae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.5
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    • pp.344-349
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    • 2020
  • Modern thin film deposition processes require high deposition rates, low costs, and high-quality films. Atmospheric pressure plasma-enhanced chemical vapor deposition (AP-PECVD) meets these requirements. AP-PECVD causes little damage on thin film deposition surfaces compared to conventional PECVD. Moreover, a higher deposition rate is expected due to the surface heating effect of atomic hydrogens in AP-PECVD. In this study, polycrystalline silicon thin film was deposited at a low temperature of 100℃ and then AP-PECVD experiments were performed with various plasma powers and hydrogen gas flow rates. A deposition rate of 15.2 nm/s was obtained at the VHF power of 400 W. In addition, a metal foam showerhead was employed for uniform gas supply, which provided a significant improvement in the thickness uniformity.

Characteristics of aluminum-induced polycrystalline silicon film for polycrystalline silicon solar cell fabrication (다결정 실리콘 태양전지 제조를 위한 비정질 알루미늄 유도 결정 입자 특성)

  • Jeong, Hyejeong;Kim, Ho-Sung;Lee, Ho-Jae;Boo, Seongjae
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.11a
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    • pp.49.1-49.1
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    • 2010
  • 본 연구에서는 증착법에 의해 제조된 다결정 실리콘을 이용한 태양전지 제작과 관련하여 다결정 실리콘 씨앗층 제조를 위한 기판에 대하여 연구를 수행하였다. 다결정 실리콘 씨앗층을 제조할 수 있는 기술중 aluminum-induced layer exchange(ALILE) 공정을 이용하여 다결정 실리콘 씨앗층을 제조하였다. glass/Al/oxide/a-Si 구조로 알루미늄과 비정질 실리콘 계면에 알루미늄 산화막을 다양한 두께로 형성시켜, 알루미늄 유도 결정화에서 산화막의 두께가 결정화 특성에 미치는 영향, 결정결함, 결정크기에 대하여 연구하였다. 형성된 다결정 실리콘 씨앗층 막의 특성은 OM, SEM, FIB, EDS, Raman spectroscopy, XRD, EBSD 을 이용하여 분석하였다. 그 결과 산화막의 두께가 증가할수록 결함도 함께 증가하였다. 16nm 두께의 산화막 구조에서 <111> 방향의 우선배향성을 가진, $10{\mu}m$의 sub-grain 결정립을 갖는 씨앗층을 제조 하였다.

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