• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.327-331
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• 2008

An in-line wet etch/cleaning system was established for the research and development in wet etch process as a formation of electrode such as metal or transparent conductive oxide layer. A reverse moving system was equipped in the in-line wet etch/cleaning system for the alternating motion of glass substrate in a wet etch bath of the system. Therefore, it was possible for the glass substrate to be moved back and forth and it was possible to reduce the size of the system by using the reversing moving system. For the effect of the alternating motion of substrate on the etch rate in the in-line wet etch bath, indium tin oxide(ITO) patterns were obtained through wet etch process in the in-line system in which the substrate was moved back and forth. From the CD(critical dimension) skews resulted from the ADI CD and ACI CD of the ITO patterns, it was concluded that the alternating motion of glass substrate are possible to be applied to the mass production of wet etch process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.1-8
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• 2013

Roll-based, nanoimprint lithography (Roll-NIL) is one effective method to produce large-area nanopatterns continuously. Systems and processes for Roll-NIL have been developed and studied for more than 15 years. Since the shapes of the stamp and the substrate for Roll-NIL can be plates, films, and rolls, there exist many concepts to design and implement roll-NIL systems. Combinations and variations of contact-methods for variously shaped stamps and substrates are analyzed in this paper. The contact-area can be changed by using soft materials such as polydimethylsiloxane (PDMS) or silicone rubber. Ultraviolet (UV) sources appropriate for the roll-to-plate or roll-to-roll process are introduced. Finally, two roll-to-plate nanoimprint lithography systems are illustrated.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.132-132
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• 2010

In the nano-scale Si processing, patterning processes based on multilevel resist structures becoming more critical due to continuously decreasing resist thickness and feature size. In particular, highly selective etching of the first dielectric layer with resist patterns are great importance. In this work, process window for the infinitely high etch selectivity of silicon oxynitride (SiON) layers and silicon nitride (Si3N4) with EUV resist was investigated during etching of SiON/EUV resist and Si3N4/EUV resist in a CH2F2/N2/Ar dual-frequency superimposed capacitive coupled plasma (DFS-CCP) by varying the process parameters, such as the CH2F2 and N2 flow ratio and low-frequency source power (PLF). It was found that the CH2F2/N2 flow ratio was found to play a critical role in determining the process window for ultra high etch selectivity, due to the differences in change of the degree of polymerization on SiON, Si3N4, and EUV resist. Control of N2 flow ratio gave the possibility of obtaining the ultra high etch selectivity by keeping the steady-state hydrofluorocarbon layer thickness thin on the SiON and Si3N4 surface due to effective formation of HCN etch by-products and, in turn, in continuous SiON and Si3N4 etching, while the hydrofluorocarbon layer is deposited on the EUV resist surface.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.6
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• pp.551-557
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• 2009

A development of smart materials is becoming a prominent issue on present industries. A smart material, included in functions, is needed for micro fabrication. A shape memory alloy(SMA) in a smart material is best known material. Ni-Ti alloy, composed of nikel and titanium is one of the best shape memory alloy(SMA). Nitinol SMA is used for a lot of high tech industry such as aero space, medical device, micro actuator, sensor system. However, Ni-Ti SMA is difficult to process to make a shape and fabrications as traditional machining process. Because nitinol SMA, that is contained nikel content more than titanium content, has similar physical characteristics of titanium. In this paper, the characteristics of ECM grooving process for nitinol SMA are investigated by experiments. The experiments in this study are progressed for power, gap distance and machining time. The characteristics are found each part. Fine shape in work piece can be found on conditions; current 6A, duty factor 50%, gap distance 15%, gap distance $15{\mu}m$, machining time 10min.

• The International Journal of Costume Culture
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• v.5 no.3
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• pp.151-163
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• 2002

This study attempted to creat patent map 163 cases of patent for technology of apparel design using computer technology and researched the trend of Patent application by count교, technologies, applicant and filing date. In regard to application by country, the United States mark the first place with 99 cases (61%), Japan marks the second with 34 cases (21%), Korea the third with 19 cases (12%). Comparing the patent applications in specialized technologies, we find the United States is overwhelming the technologies for garment Production Process, Patterning Process and preparatory process, and Japan is currently undergoing development work in this area, while most of Korean applications are focused in the technologies for selection or substitution methods related to Purchase and sale of apparels, body image and design service Therefore, it is required to preoccupy and defend patent rights as well as develop technologies aggressively and extensively in preparation for the expansion of e-commerce market. Analysing the speed of progress in technology in terms of number of applicants and application cases, we can say it entered into developing stage from the middle of 1990s and it seems that they will continue the development work from now on. in case of Korea, they began in 1996, somewhat late, but reached a similar level with the United States in 2000.

• Korean Journal of Materials Research
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• v.17 no.5
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• pp.273-277
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• 2007

Vertically aligned Zinc Oxide rod arrays were grown by the self-assembly hydrothermal process on the GaN epitaxial layer which has a same lattice structure with ZnO. Zinc nitrate and DETA solutions are used in the hydrothermal process. The $(HfO_2)$ thin film was deposited on GaN and the patterning was made by the photolithography technique. The selective growth of ZnO rod was achieved with the patterned GaN substrate. The fabricated ZnO rods are single crystal, and have grown along hexagonal c-axis direction of (002) which is the same growth orientation of GaN epitaxial layer. The density and the size of ZnO rod can be controlled by the pattern. The optical property of ordered array of vertical ZnO rods will be discussed in the present work.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.12
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• pp.871-876
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• 2014

Efficiency of crystalline Si solar cell can be maximized as minimizing optical loss through antireflection texturing with inverted pyramids. Even if cost-competitive, soft lithography can be employed instead of photolithography for the purpose, some limitations still remain to apply the soft lithography directly to as-received solar grade wafer with a bunch of micro trenches on surface. Therefore, it is needed to develop a low-cost, effective planarization process and evaluate its output to be applicable to patterning process with PDMS stamp. In this study new surface planarization process is proposed and the change of micro scale trenches on the surface as a function of etching time is observed. Also, the effect of trenches on pattern quality by soft lithography is investigated using FEM structural analysis. In conclusion it is clear that the geometry and shape of trenches would be basic considerations for soft lithography application to low quality wafer.

• Journal of the Semiconductor & Display Technology
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• v.9 no.2
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• pp.91-96
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• 2010

In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we consider the roll-to-plate type imprinting process. In the process a glass mold, which is placed upon the 2nd generation TFT-LCD glass sized substrate(370${\yen}$470 mm), is rolled by a rubber roller to achieve a uniform residual layer. The pressure distribution on the glass mold by rolling of the rubber roller is crucial information to analyze mold deformation, transferred pattern quality, uniformity of residual layer and so forth. In this paper the quantitative pressure distribution induced by rolling of the rubber roller was calculated with finite element analysis under the assumption of Neo-Hookean hyperelastic constitutive relation. Additionally the numerical results were verified by the experiments.

• Journal of the Semiconductor & Display Technology
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• v.18 no.2
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• pp.58-62
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• 2019

Diffractive Optical Elements(DOEs) diffracts incident light using the diffraction phenomenon of light to generate a desired diffraction image. In recent years, the use of diffraction optics, which can replace existing refractive optical elements with flat plates, has been increased by implementing various optical functions that could not be implemented in refractive optical devices and by becoming miniaturized and compacted optical elements. Direct laser lithography is typically used to effectively fabrication such a diffractive optical element in a large area with a low process cost. In this study, the process conditions for fabricating patterns of diffractive optical elements in various shapes were found using direct laser lithographic system, and optical performance evaluation was performed through fabrication.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.8
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• pp.47-54
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• 2012

In this paper, we have fabricated the Schottky diode for THz applications by heterogeneous resist patterning method. The Schottky diode was developed using electron beam lithography and photolithography to connect the anode and the anode pad for a simple process. The measured performance of developed Schottky diode are $11.2{\Omega}$ of series resistance, 25.96 fF of junction capacitance, 1.25 of ideality factor and 547.6 GHz of cut-off frequency.