• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.149-167
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• 2004

Passive components are indispensable in the design and development of microchips for high-frequency applications. Inductors in particular are used frequently in radio frequency (RF) IC's such as low-noise amplifiers and oscillators. This paper gives a broad overview on the on-chip spiral inductors. The design concept and modeling approach of the typical square-shaped spiral inductor are first addressed. This is followed by the discussions of advanced structures for the enhancement of inductor performance. Research works reported in the literature are summarized to aid the understanding of the recent development of such devices.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.909-912
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• 2005

According to miniaturization trend of rehabilitation medical equipment such as hearing aid, study to replace previous complex system with semiconductor SOC (System-on-Chip) chip becomes lively. In this study, after investigating of existent hearing aid performance in circuit design approach, low electric power consuming, single power supply (1.4V battery) CMOSS OP AMP was designed. Analog circuit design tools such as Hspice and Cadence were used for circuit simulation and implementing layout design. This study shows technical methods particularly for layout design. The work is done in pmos and nmos active element layout design in addition to passive element design such as resister, capacitor and inductor.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.11a
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• pp.597-602
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• 2006

In this paper, a proper support tuning method is established by identifying the dynamic characteristics of the machine, the floor. and the inertia force. Also, the limitation of a passive isolation is presented. To simplify the dynamic analysis and to establish a proper design method for supporting system, each of the machine and the floor is modeled as a single degree of freedom spring-mass-damper system under careful investigation of the dynamic characteristics of each system and appropriate assumptions. Then, the dynamic behavior of a 2DOF system and the effect of the mass and the damping are investigated. Also, the characteristics of motion profiles are investigated. In addition, a quasi-static analysis on the transmitted force through support is performed and related tests are performed.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.487-490
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• 1998

During driving an automobile, drivers push the clutch and transmit gear by their feeling. At the automobile which have the manually operated gear box by using apart designed equipment, for get the semi-auto function, a lot of research to realize the system which have passive transmission and automotive transmission has developed. In this paper, basically using one chip .mu.-comcontrolled the clutch of automobile by means of LPF, F/V converter and TR driver circuit which is designed. In the past, it was controlled the motor by operating relay which is int eh output system to control the clutch. This system some noises is made by on and off the relay, lessen the motor speed and causes many error due to consume the large power on driving the motor. In this paper, to solve these problems the output TR is operated by using one chip .mu.-com decrease the electic power consumption and designed the actuator to control the clutch by measns of vacuum.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.6
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• pp.412-419
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• 2001

In accordance with the PON(passive optical network) could be setup, effective connections with light sources, optical detectors, and optical fibers are the best sensitive points to represent the efficiency of network. Therefore, in this paper we designed and fabricated optical transceiver connection chip that was consisted of channel waveguide, Y-branch, and CWDM on the 2" BK7 glass substrate. This chip can be used for 1.31/1.55${\mu}{\textrm}{m}$ CWDM network and 1.55${\mu}{\textrm}{m}$ region dense WDM network.work.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.179-186
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• 2009

Electronic components in an enclosure have been investigated to prevent undesired thermal problems. The electronic devices, such as ECUs of automotive engines, are operated under the contaminated environments, so that they rely on the passive cooling without any fluid-driving methods. Therefore the radiation heat dissipation plays more important role than the conduction and convection heat transfer. Hence their combined heat dissipation phenomena have been simulated by a numerical model to reveal the effects of supplied heat flux, emissivity of material, geometry of enclosure, charging gas and pressure. The result showed that the radiation had a significant effect on the heat dissipation of module in an enclosure, and some space above the module should be reserved to prevent its thermal problem. In addition, the higher thermal conductivity and pressure of gas in an enclosure could be necessary to improve the thermal dissipation from the electronic devices.

• Journal of electromagnetic engineering and science
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• v.8 no.3
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• pp.129-133
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• 2008

An integrated passive device(IPD) technology by semi-insulating(SI)-GaAs-based fabrication has been developed to meet the ever increasing needs of size and cost reduction in wireless applications. This technology includes reliable NiCr thin film resistor, thick plated Cu/Au metal process to reduce resistive loss, high breakdown voltage metal-insulator-metal(MIM) capacitor due to a thinner dielectric thickness, lowest parasitic effect by multi air-bridged metal layers, air-bridges for inductor underpass and capacitor pick-up, and low chip cost by only 6 process layers. This paper presents the Wilkinson power divider with excellent performance for digital cellular system(DCS). The insertion loss of this power divider is - 0.43 dB and the port isolation greater than - 22 dB over the entire band. Return loss in input and output ports are - 23.4 dB and - 25.4 dB, respectively. The Wilkinson power divider based on SI-GaAs substrates is designed within die size of $1.42\;mm^2$.

• Proceedings of the KIEE Conference
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• 2007.04c
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• pp.29-33
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• 2007

In this paper, time-varying parameter of passive telemetry RF sensor system is estimated using RLS(Rescursive $\leq$* Square) algorithm. In order to overcome the problems such as power limits and complication that general RF sensor system including IC chip has, the principle of inductive coupling is applied to model sensor system The model parameter is rearranged for applying RLS algorithm based on mathematical model to the derived model using inductive coupling principle. Time variant parameter of rearranged model is estimated using forgetting factor, and in case measured data is contaminated by noise and modelling error, the performance of RLS algorithm characterized by the convergence of squared error sum is verified by simulation.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.5
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• pp.509-516
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• 2004

High-performance Si integrated passive process was developed using thick oxidation process and Cu-BCB process. This passive process leads to low-cost and high-quality RF module with a small form factor. The fabricated spiral inductor with 225 um inner diameter and 2.5 turns showed the inductance of 2.7 nH and the quality factor more than 30 in the frequency region of 1 ㎓ and above. Also WLCSP-type integrated passive devices were fabricated using the high-performance spiral inductors. The fabricated low pass filter had a parallel-resonance circuit inside the spiral inductor to suppress 2nd harmonics and showed about 0.5 ㏈ insertion loss at 2.45 ㎓. And also the high/low-pass balun had the insertion loss less than 0.5 ㏈ and the phase difference of 182 degrees at 2.45 ㎓.

• The Magazine of the IEIE
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• v.42 no.7
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• pp.45-53
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• 2015

Power 소자 기술은 digital & mixed signal device와 on-chip 구현을 위해서 CMOS 공정에 대한 기본 이해가 필요하다. CMOS 공정 기반 위에 power device 공정을 추가하면서 다양한 operation voltage의 power 소자를 구현하고, passive device 들을 동일 공정에서 구현하여 다양한 components 들로 power IC 제품을 design 할 수 있도록 modular process를 제공하는 것이 중요하다. 또한 power device로 주로 사용되는 LDMOS 소자에 대한 performance 개선을 위해 simulation을 통해 key device parameter들의 특성을 예측하고, 구조를 설계하는 것이 Si process 전에 중요한 일 중의 하나이다. 아울러 power management가 potable power, consumer electronics 및 green energy에서 가장 빠르게 성장하는 분야이므로, 차별화된 power 소자 기술을 확보하여 급변하는 시장 환경에 대응하는 것이 필요하다.