• KSII Transactions on Internet and Information Systems (TIIS)
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• v.5 no.11
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• pp.2121-2142
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• 2011

In this paper, we propose an e-Learning process control model that aims to graphically describe and automatically generate the manifest of sequencing prerequisites in packaging SCORM's content aggregation models. In specifying the e-Learning activity sequencing, SCORM provides the concept of sequencing prerequisites to be manifested on each e-Learning activity of the corresponding tree-structured content organization model. However, the course developer is required to completely understand the SCORM's complicated sequencing prerequisites and other extensions. So, it is necessary to achieve an efficient way of packaging for the e-Learning content organization models. The e-Learning process control model proposed in this paper ought to be an impeccable solution for this problem. Consequently, this paper aims to realize a new concept of process-driven e-Learning content aggregating approach supporting the e-Learning process control model and to implement its e-Learning process modeling system graphically describing and automatically generating the SCORM's sequencing prerequisites. Eventually, the proposed model becomes a theoretical basis for implementing a SCORM-based e-Learning process management system satisfying the SCORM's sequencing prerequisite specifications. We strongly believe that the e-Learning process control model and its modeling system achieve convenient packaging in SCORM's content organization models and in implementing an e-Learning management system as well.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.37-37
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.107-111
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• 2000

• Journal of Welding and Joining
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• v.22 no.4
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• pp.24-28
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• 2004

마이크로 접합 공정은 미세 부품이나 박판의 접합에 사용되며, 이를 위해 다양한 공정이 개발되었다. 최근 MEMS(Micro Electro Mechanical System)활용 범위가 증가하고 있으며, MEMS에 사용되는 미세한 구조물의 접합이나 패키징에 접합 공정이 활용되고 있다. MEMS는 발전 단계이지만 전자 패키징(electronic packaging)은 성숙 단계인 반도체 산업에 사용되고 있다.(중략)

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.1-10
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• 2016

This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.12 no.2
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• pp.97-102
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• 2006

Shock and vibration inputs are transmitted from the transporting vehicle through the packaging to the fruit. The vibration causes sustained bouncing of fruits against each other and the container wall. The steady state vibration input may cause serous fruit injury, and the damage is particularly severe if the fruits are bounced at its resonance frequency. The determination of the resonance frequencies of the fruits and vegetables may help the packaging designer to determine the proper packaging system providing adequate protection for the fruits, and to understand the complex interaction between the components of the fruits when they relate to expected transportation vibration inputs. To analyze the vibration properties of the watermelon for optimum packaging design during transportation, sinusoidal sweep vibration tests were carried out. The resonance frequency of the watermelon ranged from 19 to 32 Hz and the amplitude at resonance was between 1.6 and 2.9 G. The resonance frequency and amplitude at resonance frequency band of the watermelon decreased with the increase of the sample mass. The multiple nonlinear regression equation for predicting the resonance frequency of the watermelon were developed using the independent variables such as mass, input acceleration and sphericity.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.9 no.1
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• pp.33-54
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• 2003

The aim of this study was to develop a model that could be used in the design of modified atmosphere packaging (MAP) for peaches. Respiratory data at 5, 10, $20^{\circ}C$ for peaches were gathered and altered for create useful respiration model. Packaging materials were conventional low density polyethylene and polypropylene with anti-fog, and anti-fungi treatments, and thickness was $30{\mu}m$ and $50{\mu}m$ each. Permeability tests were performed to find their oxygen, carbon dioxide, water vapor transmission rate as increases in temperature. Test results were then converted to logarithm format for MAP modeling. The maximum rate of oxygen uptake increased with increasing temperature. Optimum gas composition in the package system for fruits were set according to literature and upper or lower limits of oxygen and dioxide established. To predict gas composition at certain storage time, weight of fruits, film thickness, film type, and other variables, respiration rate was studied at various storage conditions. The results of tests were used to calculate Cameron's model and converted to a cubic estimation equation. The validity of the model was tested experimentally by observing actual atmospheric changes inside packages. This result of study may be useful for designing dynamic gas exchange MAP systems for similar agricultural products.