DOI QR코드

DOI QR Code

Trends of Researches and Technologies of Electronic Packaging Using Graphene

그래핀을 이용한 전자패키징 기술 연구 동향

  • Ko, Yong-Ho (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Choi, Kyeonggon (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Kim, Sang Woo (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Yu, Dong-Yurl (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Bang, Junghwan (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Kim, Taek-Soo (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
  • 고용호 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 최경곤 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 김상우 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 유동열 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 방정환 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 김택수 (한국과학기술원 기계공학과)
  • Received : 2016.05.20
  • Accepted : 2016.06.03
  • Published : 2016.06.30

Abstract

This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

Keywords

References

  1. W. S. Basca, "A Theorist's Pencil and One Layer of Carbon Atoms, Graphene", from http://www.scitizen.com (2007).
  2. K. S. Novoselov, A. K. Geim, S. V. Morozov, D. Jiang, Y. Zhang, S. V. Dubonos, I. V. Grigorieva and A. A. Firsov, "Electric Field Effect in Atomically Thin Carbon Films", Science, 306, 666 (2004). https://doi.org/10.1126/science.1102896
  3. A. K. Geim and K. S. Novoselov, "The rise of graphene", Nature, 6, 183 (2007). https://doi.org/10.1038/nmat1849
  4. C. Lee, X. Wei, J. W. Kysar and J. Hone, "Measurement of the Elastic Properties and Intrinsic Strength of Monolayer Graphene", Science, 321, 385 (2008). https://doi.org/10.1126/science.1157996
  5. S. H. Lee , D. H. Lee , W. J. Lee and S. O. Kim, "Tailored Assembly of Carbon Nanotubes and Graphene", Adv. Funct. Mater., 21, 1338 (2011). https://doi.org/10.1002/adfm.201002048
  6. K. S. Novoselov, V. I. Fal'ko, L. Colombo, P. R. Gellert, M. G. Schwab and K. Kim, "A roadmap for graphene", Nature, 490, 192 (2012). https://doi.org/10.1038/nature11458
  7. D. R. Cooper, B. D'Anjou, N. Ghattamaneni, B. Harack, M. Hilke, A. Horth, N. Majlis, M. Massicotte, L. Vandsburger, E. Whiteway and V. Yu, "Experimental Review of Graphene", Condens. Matter Phys., 2012, 1 (2012).
  8. V. Singh, D. Joung, L. Zhai, S. Das, S. I. Khondaker and S. Seal, "Graphene based materials: Past, present and future", Mater. Sci., 56, 1178 (2011).
  9. J. D. Fowler, M. J. Allen, V. C. Tung, Y. Yang, R. B. Kaner and B. H. Weiller, "Practical Chemical Sensors from Chemically Derived Graphene," ACS Nano, 3, 301 (2009). https://doi.org/10.1021/nn800593m
  10. R. Prasher, "Graphene Spreads the Heat," Science, 328, 185 (2010). https://doi.org/10.1126/science.1188998
  11. T. Kuila, S. Bose, P. Khanra, A. K. Mishra, N. H. Kim and J. H. Lee, "Recent Advances in Graphene-based Biosensors," Biosens. Bioelectron., 26, 4637 (2011). https://doi.org/10.1016/j.bios.2011.05.039
  12. Y. Lee, S. Bae, H. Jang, S. Jang, S. E. Zhu, S. H. Sim, Y. I. Song, B. H. Hong and J. H. Ahn, "Wafer-Scale Synthesis and Transfer of Graphene Films", Nano Lett., 10, 490 (2010). https://doi.org/10.1021/nl903272n
  13. Q. Wu, Y. Xu, Z. Yao, A. Liu and G. Shi, "Supercapacitors Based on Flexible Graphene/Polyaniline Nanofiber Composite Films", ACS Nano, 4, 1963 (2010). https://doi.org/10.1021/nn1000035
  14. H. Kim, A. A. Abdala and C. W. Macosko, "Graphene/Polymer Nanocomposites", Macromolecules, 43, 6515 (2010). https://doi.org/10.1021/ma100572e
  15. A. C. Ferrari, F. Bonaccorso, V. Fal'ko, K. S. Novoselov, S. Roche, P. Boggild, S. Borini, F. H. L. Koppens, V. Palermo, N. Pugno, J. A. Garrido, R. Sordan, A. Bianco, L. Ballerini, M. Prato, E. Lidorikis, J. Kivioja, C. Marinelli, T. Ryhanen, A. Morpurgo, J. N. Coleman, V. Nicolosi, L. Colombo, A. Fert, M. Garcia-Hernandez, A. Bachtold, G. F. Schneider, F. Guinea, C. Dekker, M. Barbone, Z. Sun, C. Galiotis, A. N. Grigorenko, G. Konstantatos, A. Kis, M. Katsnelson, L. Vandersypen, A. Loiseau, V. Morandi, D. Neumaier, E. Treossi, V. Pellegrini, M. Polini, A. Tredicucci, G. M. Williams, B. H. Hong, J. H. Ahn, J. Min Kim, H. Zirath, B. J. van Wees, H. van der Zant, L. Occhipinti, A. Di Matteo, I. A. Kinloch, T. Seyller, E. Quesnel, X. Feng, K. Teo, N. Rupesinghe, P. Hakonen, S. R. T. Neil, Q. Tannock, T. Lofwander and J. Kinaret, "Science and technology roadmap for graphene, related two-dimensional crystals, and hybrid systems", Nanoscale, 7, 4598 (2015). https://doi.org/10.1039/C4NR01600A
  16. J. H. Lau, "Low Cost Flip Chip Technologies: for DCA, WLCSP, and PBGA assemblies", pp.1-2, McGraw-Hill, New York (2000).
  17. S. K. Kang and A. K. Sarkhel, "(Pb)-Free Solders for Electronic Packaging", J. Electron. Mater., 23(8), 701 (1994). https://doi.org/10.1007/BF02651362
  18. M. Abtew and G. Selvaduray, "Lead-free Solders in Microelectronics", Mater. Sci. Eng. R, 27(5), 95 (2000). https://doi.org/10.1016/S0927-796X(00)00010-3
  19. A. Sharma, H. R. Sohn and J. P. Jung, "Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy", Metall. Mater. Trans. A, 47A, 494 (2016).
  20. L. C. Tsao, "Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn-3.5Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging", J. Alloys Compd., 509, 8441 (2011). https://doi.org/10.1016/j.jallcom.2011.05.116
  21. A. K. Gain, Y. C. Chan and W. K. C. Yung, "Effect of additions of $ZrO_2$ nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads", Microelectron. Reliab., 51, 2306 (2011). https://doi.org/10.1016/j.microrel.2011.03.042
  22. M. G. Cho, S. K. Kang, D. Y. Shin and H. M. Lee, "Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging", J. Electron. Mater., 36(11), 1501 (2007). https://doi.org/10.1007/s11664-007-0254-x
  23. X. D. Liu, Y. D. Han, H. Y. Jing, J. Wei and L. Y. Xu, "Effect of graphene nanosheets reinforcement on the performance of Sn-Ag-Cu lead-free solder", Mater. Sci. Eng. A, 562, 25 (2013). https://doi.org/10.1016/j.msea.2012.10.079
  24. M. Sobhy, A. M. El-Refai and A. Fawzy, "Effect of Graphene Oxide Nano-Sheets (GONSs) on thermal, microstructure and stress-strain characteristics of Sn-5 wt% Sb-1 wt% Ag solder alloy", J. Mater. Sci.: Mater. Electron., 27, 2349 (2016). https://doi.org/10.1007/s10854-015-4032-x
  25. L. Xu, L. Wang, H. Jing, X. Liu, J. Wei and Y. Han, "Effects of graphene nanosheets on interfacial reaction of Sn-Ag-Cu solder joints", J. Alloys Compd., 650, 475 (2015). https://doi.org/10.1016/j.jallcom.2015.08.018
  26. D. Ma and P. Wu, "Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets", J. Alloys. Compd., 671, 127 (2016). https://doi.org/10.1016/j.jallcom.2016.02.093
  27. X. Hua, Y. C. Chan, K. Zhang and K. C. Yung, "Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electromigration analysis", J. Alloys. Compd., 580, 162 (2013). https://doi.org/10.1016/j.jallcom.2013.05.124
  28. L. Y. Xu, Z. K. Zhang, H. Y. Jing, J. Wei and Y. D. Han, "Effect of graphene nanosheets on the corrosion behavior of Sn-Ag-Cu solders", J. Mater Sci: Mater. Electron., 26, 5625 (2015). https://doi.org/10.1007/s10854-015-3112-2
  29. S. W. Jeong, J. H. Kim and H. M. Lee, "Effect of Cooling Rate on Growth of the Intermetallic Compound and Fracture Mode of Near-Eutectic Sn-Ag-Cu/Cu Pad: Before and After Aging", J. Electron. Mater., 33(12), 1530 (2004). https://doi.org/10.1007/s11664-004-0095-9
  30. H. K. Lee, M. H. Chun, Y. C. Chu and K. S. Oh, "A Study of Joint Reliability According to Various Cu Contents between Electrolytic Ni and Electroless Ni Pad Finish", J. Microelectron. Packag. Soc., 22(3), 51 (2015). https://doi.org/10.6117/kmeps.2015.22.3.051
  31. S. H. Huh, J. H. Lee and S. J. Ham, "Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 1. Effects of thickness and roughness of electroless Ni-P deposit", J. Microelectron. Packag. Soc., 21(3), 43 (2014). https://doi.org/10.6117/kmeps.2014.21.3.043
  32. T. Y. Lee, K. H. Kim, J. H. Bang, N. S. Park, M. S. Kim and S. Yoo, "Sn-Ag-Cu Solder Joint Properties on Plasma Coated Organic Surface Finishes and OSP", J. Microelectron. Packag. Soc., 21(3), 25 (2014). https://doi.org/10.6117/kmeps.2014.21.3.025
  33. Y. C. Sohn, J. Yu, S. K. Kang, D. Y. Shih and T. Y. Lee, "Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization", J. Mater. Res., 19(8), 2428 (2004). https://doi.org/10.1557/JMR.2004.0297
  34. A. Sharif and Y. C. Chan, "Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization", J. Alloys Compd., 440, 117 (2007). https://doi.org/10.1016/j.jallcom.2006.09.020
  35. C. E. Ho, R. Y. Tsai, Y. L. Lin and C. R. Kao, "Effect of Cu Concentration on the Reactions between Sn-Ag-Cu Solders and Ni", J. Electron. Mater., 31(6), 584 (2002). https://doi.org/10.1007/s11664-002-0129-0
  36. Y. K. Jee, Y. H. Ko and J. Yu, "Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad", J. Mater. Res., 22(7), 1879 (2007). https://doi.org/10.1557/jmr.2007.0234
  37. Y. K. Jee, Y. H. Ko and J. Yu, "Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints", J. Mater. Res., 22(10), 2776 (2007). https://doi.org/10.1557/JMR.2007.0346
  38. Y. M. Kim, K. M. Harr and Y. H. Kim, "Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn-4.0Ag-0.5Cu and Cu-Zn Substrate", Electron. Mater. Lett., 6(4), 151 (2010). https://doi.org/10.3365/eml.2010.12.151
  39. Y. H. Ko, J. D. Lee, T. Yoon, C. W. Lee and T. S. Kim, "Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene", ACS Appl. Mater. Interfaces, 8, 5679 (2016). https://doi.org/10.1021/acsami.5b11903
  40. K. Lee, K. S. Kim and K. Suganuma, "Electro-migration Phenomenon in Flip-chip Packages", J. Microelectron. Packag. Soc., 17(4), 11 (2010).
  41. J. H. Bong, S. J. Yoon, A. Yoon, W. S. Hwang and B. J. Cho, "Ultrathin graphene and graphene oxide layers as a diffusion barrier for advanced Cu metallization", Appl. Phys. Lett., 106, 0632112 (2015).
  42. C. G. Kang, S. K. Lim, S. Lee, S. K. Lee, C. Cho, Y. G. Lee, H. J. Hwang, Y. Kim, H. J. Choi, S. H. Choe, M. H. Ham and B. H. Lee, "Effects of multi-layer graphene capping on Cu interconnects", Nanotechnology, 24, 115707 (2013). https://doi.org/10.1088/0957-4484/24/11/115707
  43. S. J. Yoon, A. Yoon, W. S. Hwang, S. Y. Choi and B. J. Cho, "Improved Electromigration-Resistance of Cu Interconnects by Graphene-Based Capping Layer", Proc. 2015 Symposium on VLSI Technology, Kyoto, T124, IEEE (2015).
  44. C. P. Wong, J. Xu, L. Zhu, Y. Li, H. Jiang, Y. Sun, J. Lu and H. Dong, "Recent Advances on Polymers and Polymer Nanocomposites for Advanced Electronic Packaging Applications", Proc. 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, 1, IEEE (2005).
  45. J. Kim, B. S. Yim, J. M. Kim and J. Kim, "The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs)", Microelectron. Reliab., 52, 595 (2012). https://doi.org/10.1016/j.microrel.2011.11.002
  46. N. W. Pu, Y. Y. Peng, P. C. Wang, C. Y. Chen, J. N. Shi, Y. M. Liu, M. D. Ger and C. L. Chang, "Application of nitrogendoped graphene nanosheets in electrically conductive adhesives", Carbon, 67, 449 (2014). https://doi.org/10.1016/j.carbon.2013.10.017
  47. S. A. Ju, K. Kim, J. H. Kim and S. S. Lee, "Graphene-Wrapped Hybrid Spheres of Electrical Conductivity", ACS Appl. Mater. Interfaces, 3, 2904 (2011). https://doi.org/10.1021/am200056t
  48. K. M. F. Shahil and A. A. Balandin, "Thermal properties of graphene and multilayer graphene: Applications in thermal interface materials", Solid State Commun., 152, 1331 (2012). https://doi.org/10.1016/j.ssc.2012.04.034
  49. K. M. F. Shahil and A. A. Balandin, "Graphene-Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials", Nano Lett., 12(2), 861 (2012). https://doi.org/10.1021/nl203906r
  50. X. Zhang, K. K. Yeung, Z. Gao, J. Li, H. Sun, H. Xu, K. Zhang. M. Zhang, Z. Chen, M. M. F. Yuen and S. Yang, "Exceptional thermal interface properties of a three-dimensional graphene foam", Carbon, 66, 201 (2014). https://doi.org/10.1016/j.carbon.2013.08.059
  51. W. P. S. Saw and M. Mariatti, "Properties of synthetic diamond and graphene nanoplatelet-filled epoxy thin film composites for electronic applications", J. Mater. Sci.: Mater. Electron., 23, 817 (2012). https://doi.org/10.1007/s10854-011-0499-2
  52. Z. Gao, Y. Zhang, Y. Fu, M. M. F. Yuen and J. Liu, "Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots", Carbon, 61, 342 (2013). https://doi.org/10.1016/j.carbon.2013.05.014

Cited by

  1. Characterization of Copper-Graphite Composites Fabricated via Electrochemical Deposition and Spark Plasma Sintering vol.9, pp.14, 2016, https://doi.org/10.3390/app9142853
  2. Development and Characteristics of Multipurpose Transparent Polyurethane Film vol.21, pp.10, 2016, https://doi.org/10.1166/jnn.2021.19445